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SUSS MicroTec

SUSS MicroTec. Spray Coating. M arkets. Compound Semiconductor. MEMS. Source: CIS. Source: Intel. Source: Süss MicroOptics. Advanced Packaging. MOEMS. Types of Resist. Clariant AZ1500, AZ4000, AZ9000, AZ520D Rohm Haas Shipley 1818 TOK PMER-P, TELR-N

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SUSS MicroTec

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  1. SUSS MicroTec Spray Coating

  2. Markets • Compound Semiconductor • MEMS Source: CIS Source: Intel Source: Süss MicroOptics • Advanced Packaging • MOEMS

  3. Types of Resist • Clariant AZ1500, AZ4000, AZ9000, AZ520D • Rohm Haas Shipley 1818 • TOK PMER-P, TELR-N • Dow Chemicals BCB 3000 / 4000 • Asahi Cytop CTL107 M • Dow Corning Silicone • ALLRESIST e-beam PMMA

  4. Not all curves lead to success

  5. Coating Challenges Resist film tends to tear at the topography edges Goal: Uniform coating of topography Limited control of resist thickness at the bottom of the topography

  6. X-Stage Y-Stage Spray Nozzle Meander Path Process Flow • In Principal • X – Y stage • Not a spin process (no striations or comet tails) • Multi-flexible nozzle movement Katrin FischerSUSS MicroTec, April 2005

  7. Coating Topography AZ4620 Katrin FischerSUSS MicroTec, April 2005

  8. Coating Topography AZ9260 4µm Top 300µm Step 3 µm resist on top of the edge 3µm Bottom Katrin FischerSUSS MicroTec, April 2005 8

  9. Coating Topography AZ9260 4µm on Top Katrin FischerSUSS MicroTec, April 2005 9

  10. Coating Topography Shipley1818 4µm on Top Bottom 2,8µm Katrin FischerSUSS MicroTec, April 2005 10

  11. Coating Topography Shipley 1818 4µm Katrin FischerSUSS MicroTec, April 2005 11

  12. Coating Topography BCB 3000 5µm Katrin FischerSUSS MicroTec, April 2005 12

  13. Coating Topography BCB 4000 7µm Top 300µm Step 5µm on top of the edge 3µm Bottom Katrin FischerSUSS MicroTec, April 2005

  14. Coating Vertical Topography • Goal: Protective coating in trenches without filling • 50 µm trench depth • Modified Clariant AZ4620 • Reliable edge coverage Katrin FischerSUSS MicroTec, April 2005 14

  15. Exposure Results • 6µm of modified AZ 9260 across 300µm deep KOH etched trenches (no edge treatment) • coated with SUSS spray coating technology, exposed with SUSS large exposure gap optics Katrin FischerSUSS MicroTec, April 2005

  16. Top view of printed lines • Lines across topography step • 150 µm step height • Good resist profiles throughout Katrin FischerSUSS MicroTec, April 2005

  17. Manual: AltaSpray • wafer sizes • from pieces • up to 200mm round & 6” square • programmable spray pattern • adjustable nozzle heights • EBR / BSR / nozzel + chuck cleaning function • 2 nozzel option with seperate lines for different resist sorts Katrin FischerSUSS MicroTec, April 2005

  18. Automated:Gamma • integrated modules for vapor priming, spining, spray-coating, baking, developing • cassette to cassette handling • parallel spin and spray processing • wafer sizes • 2” to 200mm round • 2” to 6” square • EBR / BSR / nozzel + chuck cleaning function • 2 nozzel option with seperate lines for different resist sorts Katrin FischerSUSS MicroTec, April 2005

  19. Thank you foryour attention

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