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Microgear Transmission Process Sequence Diagram

Microgear Transmission Process Sequence Diagram. Presented By: Christian Daco James Ford Michael Layman Huey Lee Allan Siu. Starting with a silicon substrate…. Silicon Substrate. 1. LPCVD 2  m layer silicon dioxide (SiO 2 ).

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Microgear Transmission Process Sequence Diagram

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  1. Microgear TransmissionProcess Sequence Diagram Presented By: Christian Daco James Ford Michael Layman Huey Lee Allan Siu

  2. Starting with a silicon substrate… Silicon Substrate

  3. 1. LPCVD 2 m layer silicon dioxide (SiO2) SiH4 + O2 SiO2 + H2 @ Temp 400 – 500 C Silicon Dioxide Silicon Substrate

  4. 2. LPCVD 1m polysilicon layer. SiH4 Si + 2H2 @ Temp = 600-650 C Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  5. 3. Coat photoresist. Photoresist Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  6. 4. Expose and develop photoresist. Photoresist Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  7. 5. Etch polysilicon layer by plasma etching in Cl2 to expose silicon dioxide layer. Photoresist Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  8. 6. Strip photoresist in H2SO4/H2O2 Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  9. 7. Wet etch SiO2 layer with HF Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  10. 8. Deposit sacrificial SiO2 layer conformally with tetraethylorthosilicate (TEOS) Silicon Dioxide Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  11. 9. Deposit 1m polysilicon layer with LPCVD. Polysilicon Layer #2 Silicon Dioxide Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  12. 10. Apply photoresist and pattern gear shape. Photoresist Polysilicon Layer #2 Silicon Dioxide Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  13. (Zoom out view to see gear formation) Photoresist Polysilicon Layer #2 Silicon Dioxide Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  14. 11. Plasma dry etch in Cl2 to create gear shape Photoresist Polysilicon Layer #2 Silicon Dioxide Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  15. (Zoom in) 12. Strip photoresist in H2SO4/H2O2 Polysilicon Layer #2 Silicon Dioxide Polysilicon Layer #1 Silicon Dioxide Silicon Substrate

  16. 13. Wet etch SiO2 layer with HF to release gear. Polysilicon Layer #2 Silicon Dioxide Polysilicon Layer #1 Silicon Dioxide Silicon Substrate Silicon Substrate

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