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GLAST Large Area Telescope: Tracker Subsystem WBS 4.1.4 6A: Fabrication Overview Robert Johnson Santa Cruz Institute for

Gamma-ray Large Area Space Telescope. GLAST Large Area Telescope: Tracker Subsystem WBS 4.1.4 6A: Fabrication Overview Robert Johnson Santa Cruz Institute for Particle Physics University of California at Santa Cruz Tracker Subsystem Manager johnson@scipp.ucsc.edu.

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GLAST Large Area Telescope: Tracker Subsystem WBS 4.1.4 6A: Fabrication Overview Robert Johnson Santa Cruz Institute for

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  1. Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: Tracker Subsystem WBS 4.1.4 6A: Fabrication Overview Robert Johnson Santa Cruz Institute for Particle Physics University of California at Santa Cruz Tracker Subsystem Manager johnson@scipp.ucsc.edu

  2. Tracker Production Overview Module Structure (walls, flexures, thermal-gasket, fasteners) Engineering: SLAC, Hytec, Italy Procurement: SLAC, Italy SSD Procurement, Testing Japan, Italy, SLAC SSD Ladder Assembly Italy (G&A, Mipot) 10,368 Tracker Module Assembly and Test Italy 2592 18 Tray Assembly and Test Italy (G&A, Mipot) 342 342 Electronics Design, Fabrication & Test UCSC, SLAC (Teledyne) 648 Composite Panel & Converters Engineering: SLAC, Hytec, COI, and Italy Procurement: Italy (Plyform) Readout Cables UCSC, SLAC

  3. SSD Ladder Assembly (Italy) G&A Engineering (in progress) Mipot (PRR in April) Electrical tests by INFN personnel Composite Panel Assembly (Italy) Plyform (PRR in April) Tray Assembly (Italy) G&A and Mipot Bond SSDs to panels Wire bond to the MCMs Encapsulate wire bonds MCM Assembly (USA) Teledyne Electronic Technologies Bond pitch adapter SMT soldering Die attach and wire bonding Electronics test by UCSC personnel Encapsulation and conformal coating G&A, Plyform, and Teledyne all participated in the Engineering Model fabrication. Assembly by Corporate Vendors

  4. Italy SSD Receiving and Testing INFN Pisa INFN Perugia Mount MCMs onto trays (and test electronically) INFN Pisa Test finished trays and assemble into tower modules INFN Pisa USA Wafer probing of ASICs UCSC Burn-in and thermal cycling of completed MCMs SLAC Assembly Work at LAT Institutes

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