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ORION2.0: A Fast and Accurate NoC Power and Area Model for Early-Stage Design Space Exploration. Andrew B. Kahng ¶ Bin Li ‡ Li-Shiuan Peh ‡ Kambiz Samadi ¶ ¶ University of California, San Diego ‡ Princeton University April 21, 2009. 1. Outline. Motivation ORION2.0 Framework
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ORION2.0: A Fast and Accurate NoC Power and Area Model for Early-Stage Design Space Exploration Andrew B. Kahng¶ Bin Li‡ Li-Shiuan Peh‡ Kambiz Samadi¶ ¶ University of California, San Diego ‡ Princeton University April 21, 2009 1
Outline • Motivation • ORION2.0 Framework • Dynamic Power Modeling • Leakage Power Modeling • Area Modeling • Validation and Significance Assessment • Conclusions 2
Motivation • Many-core chip NoCs needed to interconnect many-core chips Power-efficiency of NoCs is important • Performance was the primary concern • Now power efficiency is critical • 28% of total power in Intel 80-core Teraflops chip is due to interconnection networks (routers + links); • Need rapid power estimation to trade off alternative architectures • Rapid power-area tradeoffs at the architectural level Our Goal: Develop accurate models that are easily usable by system-level designer early in the design cycle 3
Related Work • Real-chip power measurements (Isci et al. 03) • RTL-level NoC power estimations (A. Banerjee et al. 07, and N. Banerjee et al. 04) • Simulation time is slow • Requires detailed RTL modeling not suitable for early-stage NoC design space exploration • Architectural-level power estimation • Interconnection network (Patel et al. 97); model is not instantiated with architectural parameters not suitable to explore tradeoffs in router microarchitecture • Uniprocessor power modeling (Wattch: Brooks et al. 00 and SimplePower: Ye et al. 00) • NoC power modeling (ORION 1.0: Wang et al. 02) • ORION 1.0 • has been widely used • early-stage design space exploration for NoC power-performance tradeoff analysis 4
ORION 1.0 Modeling Methodology Power models derived for major building blocks (FIFO, Crossbar, and arbiter) For each component, a canonical structure is described in terms of architectural and technological parameters Detailed analysis is performed to determine parameterized capacitance equations Capacitance equations and switch activity estimation are combined to determine power consumption Power models are based on detailed estimates of gate and wire capacitance and switching activity 5
Limitations of ORION 1.0 Up to 8.1X diff. 10.3X diff. 6
Outline • Motivation • ORION2.0 Framework • Dynamic Power Modeling • Leakage Power Modeling • Area Modeling • Validation and Significance Assessment • Conclusions 7
technology parameters circuit implementation & buffering scheme • interconnect parameters • device parameters • scaling factors for future • technologies • … • SRAM and register FIFO • MUX-tree and Matrix crossbar • different arbitration scheme • hybrid buffering scheme grantI reqI architectural parameters grantE reqE • # of ports; # of buffers • # of xbar ports; # of VC • voltage, frequency Arbiter grantW reqW grantN reqN grantS reqS Request Signals Source Source Buf I Control Link Link Buf E Link Link Buf W inI outI Link Link Buf N inE outE Link Link Buf S Crossbar inW outW inN outN inS outS ORION 2.0: Accurate NoC Router Models ORION 2.0 • Built on top of ORION 1.0 • Uses our automatic/semi-automatic flows to obtain technology inputs • Provides significant accuracy improvement compared with ORION 1.0 Write 8
Crossbar • Area • More accurate router area model • Link area model • Links • Hybrid buffering • Leakage power Clock ORION 2.0 Improvements Power Subcomponents • Buffer • SRAM-based • Flip-flop-based Buffer (SRAM-based) Model Infrastructure Arbiter (dynamic power) • Application-specific • technology-level • adjustment • Updated capacitance • and transistor sizes • Arbiter • VC allocator model • Leakage power Crossbar Links (dynamic power) Area (router) ORION 1.0 ORION 2.0 9
Model Technology Inputs • Inputs for power calculation • Leakage current values (obtained from Liberty (.lib) / SPICE) • Input capacitance for different repeater size (Liberty, Predictive Technology Models (PTM)) • Inputs for area calculation • Wire dimensions (Interconnect Technology Format (ITF) / LEF / ITRS) • Cell area is available from Liberty and for future technologies, ITRS A-factors or proposed area models can be used • We also provide data for (1) high-performance (HP), and (2) low-power (LOP) device types for 90nm and 65nm • Scaling factors for 45nm and 32nm technologies were obtained from ITRS 2007 / MASTAR5.0 10
Outline • Motivation • ORION2.0 Framework • Dynamic Power Modeling • Leakage Power Modeling • Area Modeling • Validation and Significance Assessment • Conclusions 11
Dynamic Power Modeling • Dynamic Power: Switching Capacitance • Clock power: • Pclk = × Cclk× Vdd2× f • Cclk = Csram-fifo + Cpipeline-registers + Cregister-fifo + Cwiring • Physical Links: due to charging and discharging of capacitive load • Pd = × Cload× Vdd2× f; Cload = Cground + Ccoupling + Cinput • Register-based FIFO: implemented as shift registers • Virtual channel allocator: added two models • Other components: we use ORION 1.0 models with updated transistor and technology parameters 12
Clock Power (1) Clock power heavily depends on its distribution topology we assume an H-tree topology Cclk = Csram-fifo + Cpipeline-registers + Cregister-fifo + Cclock-wiring Memory structures: precharge circuitry capacitive load on clock network: due to precharge transistor Tc Cchg = Cg(Tc) + Cd(Tc) Csram-fifo = (Pr + Pw)× F × B × Cchg where Pr, Pw, F, B are #read ports, #write ports, #buffers, and flit-width, respectively Pipeline registers: due to different stages in a router assume D-flip-flop (DFF) as the building block for pipeline registers Cpipeline-register = Npipeline ×F × Cff, where Cff is DFF capacitance Register-based FIFO: due to DFF capacitance used in registers Cregister-fifo = F × B × Cff 13
Clock Power (2) Wiring load: due to (1) wiring and (2) clock tree buffers Example: 5-level H-tree clock distribution: where, D, Cw are chip dimension and per-unit-length wire capacitance, respectively capacitive contribution due to clock buffers requires estimation of number of buffer stages, k: where Rint, Cint, Rd, and Cgate are clock tree network wire resistance, wire capacitance, drive resistance, and input gate capacitance of a minimum size inverter, respectively where ρ, Carea, and Cfringe are resistivity, unit area, and unit fringe capacitances respectively Cclock-wiring = kCgate + Cwire Clock leakage power is due to clock buffers 14
Repeater and Wire Power Models • Repeaters (buffers) are used in links and clock tree network • Leakage power has two main components: (1) sub-threshold leakage, and (2) gate-tunneling current • Depending on design conditions we will compute the leakage power at different temperature conditions:(1) 25◦C, (2) 80◦C, and (3) 110◦C • Both components depend linearly on device size ps= (psn + psp) / 2 psn = k0n + k1n × wn psp = k0p+ k1p × wp • Dynamic power can be calculated as: pd = a × cl × vdd2 × f cl = ci + cg + cc • pd, a, cl, vdd and f are dynamic power, activity factor, load capacitance, supply voltage and frequency, respectively • Load capacitance is composed of the input capacitance of the next repeater (ci), ground (cg) and coupling (cc) capacitances of the wire driven 15
Interconnect Optimization: Buffering Conventional delay-optimal buffering unrealistic buffer sizes high dynamic / leakage power suboptimal Our approach: iterative optimization of hybrid objective (power + delay) Search for optimal number and size of repeaters Can be extended for other interconnect optimizations (e.g., wire sizing and driver sizing) Pareto-optimal frontier of the power-delay tradeoff of a 5mm interconnect in 90nm / 65nm 16
Virtual Channel Allocator Model • Provides three virtual channel (VC) allocation models • Traditional two-stage VC allocator model • Most widely used • Power consumption increases rapidly as number VCs increases • Add One-stage VC allocator model • Lower power consumption • Lower matching probability • Add VC selection model • Proposed by Kumar et al. "A 4.6Tbits/s 3.6GHz Single-cycle NoC Router with a Novel Switch Allocator in 65nm CMOS”, ICCD07 • Low power and high performance 17
Outline • Motivation • ORION2.0 Framework • Dynamic Power Modeling • Leakage Power Modeling • Area Modeling • Validation and Significance Assessment • Conclusions 18
Leakage Power Modeling • Leakage Power:Subthreshold and Gate • From 65nm and beyond gate leakage becomes significant • I’sub(i,s) and I’gate(i,s) are subthreshold and gate leakage currents per unit transistor width for a specific technology • Wsub(i,s) and Wgate(i,s) are the effective widths of component i at input state s for subthreshold and gate leakage, respectively • Key circuit components INVx1, NAND2x1, NOR2x1, and DFF • Leakage currents are computed at different transistor junction temperatures: (1) 110◦C, (2) 80◦C, and (3) 25◦C • Same methodology as in ORION 1.0 • Leakage current values are all obtained through SPICE simulation using foundry SPICE models 19
Arbiter Leakage Power Model • Three arbitration schemes: (1) matrix, (2) round-robin (RR), and (3) queuing • Example: matrix arbiter • with R requesters one R×R matrix to keep the priorities • grant logic can be implemented as a tree of NOR and INV gates and the RxR matrix can be constructed using DFF • NOR2, INV, and DFF represent 2-input NOR gate, inverter gate, and DFF, respectively • Further details on modeling methodology in Chen et al. 2003 20
Outline • Motivation • ORION2.0 Framework • Dynamic Power Modeling • Leakage Power Modeling • Area Modeling • Validation and Significance Assessment • Conclusions 21
Router Area Model Matrix Arbiter • As number of cores increases, the area occupied by communication components becomes significant (19% of total tile area in the Intel 80-core Teraflops Chip) • Gate area model by Yoshida et al. (DAC’04) • Link area model by Carloni et al. (ASPDAC’08) Areaarbiter = (AreaNOR2x12(R-1)R) + (AreaDFF(R(R-1)/2)) + (AreaINVx1R) 22
Repeater and Wire Area Models • For existing technologies, the area of a repeater can be calculated as: ar = τ0 + τ1 ×(wn + wp) • ardenotes repeater area, τ0and τ1 are coefficients using linear regression; wn, wparewidths of NMOS, and PMOS respectively • For future technologies, feature size (F), contacted pitch (CP), row height (RH), and cell width (CW) can be used to estimate the area: NF = (wp + wn + 2 × F) / RH CW = NF × (F + CP) + CP ar = RH × CW • Wiring area can be calculated as: aw = (n × (ww + sw) + sw) × L • aw denotes wire area, n is the bit width of the bus, and ww, sw, L are wire width, spacing and wire length 23
Outline Motivation ORION2.0 Framework Dynamic Power Modeling Leakage Power Modeling Area Modeling Validation and Significance Assessment Conclusions 24
ORION2.0: Validations and Results • Validation: Two Intel NoC Chips • (1) Intel 80-core Teraflops: high-performance many-core design • (2) Intel SCC: ultra low-power communication core • ORION2.0 offers significant accuracy improvement ORION 2.0 Intel 80-core ORION 1.0 25
Impact on System-Level Design Testcases VPROC: video processor with 42 cores and 128-bit datawidth dVOPD: dual video object plane decoder with 26 cores and 128-bit datawidth … …….. R2 R2 R1 R1 R1 … R1 R1 R1 … R2 … … … … … … … R2 …….. R2 R1 R1 R1 • System-level Impact: Communication-Driven Synthesis in COSI-OCC • AccurateORION 2.0 models lead to better-performing NoC • Relative power due to additional port not as high in ORION 2.0 vs. 1.0 26
Conclusions • Accurate models can drive effective NoC design space exploration • ORION 1.0 is inaccurate for current and future technology nodes • Proposed accurate power and area models for network routers (ORION 2.0) • Presented a reproducible methodology for extracting inputs to our models • Maintained ORION 1.0 interface, while significantly improved the accuracy of models switching to ORION 2.0 is easy! 27
ORION 2.0 Release • ORION 2.0 Website: http://www.princeton.edu/~peh/orion.html 28
System-Level NoC Power Modeling Example Polaris Toolchain V. Soteriou, N. Eisley, H. Wang, B. Li, L.S. Peh, TVLSI’07