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1. Dynamic Thermal Circuit Reliability (DTCR) Using Models, PI, PI-ACE,Process Book, and the Module Database
2. Topics to be Covered What is DTCR?
Sources of DTCR information
Choosing the appropriate technology solutions
Discussion of Example
Questions?
3. Dynamic Thermal Circuit Reliability
4. Physical Factors and Ratings Due to geographic lengths, physical factors differ per line segment.Due to geographic lengths, physical factors differ per line segment.
5. Steady State Ampacity Calculation (Neher-McGrath) For example, will disregard Solar Heating
For example, will disregard Solar Heating
6. CIM has static information
7. Modules have combined information
8. Adjusting Ambient Temperature
9. Workflow
10. Population of Model Results in:
11. ACE Design Question Design based upon modules?
Context configuration issues arise.
Synchronization issues arise. Design based upon class/instance relationships?
12. General ACE Algorithm
13. Issues Encountered Which Interface?
Forgetfulness
Logging
14. Which Interface? Ampacity tags and aliases are calculated only.
Need to be configured as output tags, but have no real interface.
Decided to create a virtual interface DTCRACE.
15. Forgetfulness Debug of ACE calc was OK
Checked security settings
OK
What else?
16. Forgetfulness Calculated tags are output tags.
Must turn off shutdown events for output tags.
17. LogPIACEMessage Logging
18. Logging Options Do Nothing
Files
Use a PI Tag
19. Log Display
20. Making ProcessBook Model Aware
21. Same Display, different Substation
22. Benefits of Having ACE and PB Model Driven As model changes, both are synchronized:
Errors corrected, calculations automatically detect.
As model is changed (e.g. adding a new line segment)
Calculations adapt
PB display adapts
23. Future Benefits Application Framework may allow auto-generation of displays/one-lines.