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WROCLAW UNIVERSITY OF TECHNOLOGY. Faculty of Microsystem Electronics and Photonics. Dean - Andrzej Dziedzic. Faculty of Microsyste m Electronics and Photonics - WEMIF.
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WROCLAW UNIVERSITY OF TECHNOLOGY Faculty of Microsystem Electronics and Photonics Dean - Andrzej Dziedzic
Faculty of Microsystem Electronics and Photonics - WEMIF WEMIF employs 61 academic teachers, including 6 full professors, 10 associated professors and 35 assistant professors. Moreover WEMIF has 42 PhD students and about 850 students. Faculty Majors: Photonics Microelectronics and Microsystems • development of microsensors and microsystems for environmental and chemical applications • silicon micromechatronics and microsystems • thick and thin film circuits • process technology and characterisation of device structures for microwave • digital ASIC design • hybrid microelectronics • interconnecting and packaging electronic circuits(assemblies, materials, prototyping methods) • photovoltaics and solar cells (PV modules assembling/encapsulation, design and monitoring of PV systems) • optoelectronics, including integrated optics and fiber waveguides, design, fabrication and measurements of photonics devices and systems • process technology and characterisation of device structures for optoelectronics DIAGNOSTICS TECHNOLOGY
Faculty of Microsystem Electronics and Photonics - WEMIF Faculty Units Division of Microelectronics and Nanotechnology (W12/Z1) Director: Marek Tłaczała, associate professor Division of Vacuum and Plasma Technologies (W12/Z2) Director: Witold Posadowski, associate professor Division of Micro- and Nanostructures Metrology (W12/Z3) Director: Teodor Gotszalk, associate professor Division of Technology and Diagnostics of Microelectronic Structures (W12/Z4) Director: Tadeusz Berlicki, professor Laboratory for Interconnecting and Packaging Electronic Circuits (W12/Z5) Director : Jan Felba, associate professor Division of Microsystems and Photonics (W12/Z6) Director: Leszek Golonka, professor
GaAs AlGaAs Optoelectronics GaInNAs Microwaves • Schottky diode • MESFET • HEMT, HFET • OEIC • MMIC • detectors PIN, MSM • photo-voltaics • photo-HBT Division of Microelectronics and Nanotechnology (W12/Z1) The Main Research Interest MOCVD II MOCVD I III-N GaN, AlGaN Characterization Device technology • photoluminescence • X-ray diffractometry • dopant profiling C-V, PVS (Bio-Rad) • admitance spectroscopy • photoreflectance spectroscopy
Division of Vacuum and Plasma Technologies (W12/Z2) Thin Films Techniques Physical Vapour Deposition (PVD)(novel thin films deposition methods) very high efficiency deposition of pure metal layers using DC and pulsed magnetron sputtering, reactive, medium frequency pulsed magnetron sputtering, self-sustained magnetron sputtering (SSS) : DC self-sustained magnetron sputtering (DC-SSS), pulsed DC self-sustained magnetron sputtering (pulsed DC-SSS)
Division of Micro and Nanoscructure Metrology (W12/Z3) • Scanning Probe Microscopy Laboratory • Research Activity – Part 1 • Scanning Probe Microscopy-SPM diagnostics of micro- and nanostructures: • Lateral Force Microscopy-LFM and Load Modulation Force Microscopy-LMFM with piezoresistive cantilevers, • Scanning Thermal Microscopy-SThM using Nanoprobe and Wollaston sensors, • Electrostatic Force Microscopy-EFM using piezoresistive sensors, Si conductive cantilevers and cantilevers with metallic tips, • Scanning Nearfield Optical Microscopy-SNOM using fiber and cantilever sensors, • Quantitative nanostructure geometry investigations with calibrated Atomic Force Microscopy-AFM instruments, • SPM nanolithography on metallic and semiconductor surfaces. Topography of Au/Zn/Cr metalization Thermal conductivityof Au/Zn/Cr metalization
Division of Technology and Diagnostic of Microelectronics Structures(W12/Z4) Domain of study: • technology of fabrication microelectronic passive structures for new generation microsensors • fabrication of TCO (Transparent Conducting Oxide) and TOS (Transparent Oxide Semiconductor) thin films by reactive magnetron sputtering method for transparent electronic • electrical and optical diagnostic of materials and semiconductor structures • qualitative and quantitative diagnostic investigation of lattice mismatched AIIIBV semiconductor heterostructures and low-dimensional structures by Deep-Level Transient Spectroscopy (DLTS) • experimental and theoretical analysis of electronic states at extended defects (e.g. dislocations)
Laboratory for Interconnecting and Packaging Electronic Circuits – LIPEC(W12/Z5) THE MAIN ACTIVITY: • interconnecting and packaging microelectronic circuits - materials and technology(developing and improving of dice attachment methods: flip-chip, chip-on-board, chip-scale-package, semi-flip-chip, twin-chips and so forth) • investigation of new materials for green polymer as well as micro and nano-scale electronics • numerical prototyping, optimization and multi-physics simulations of the microelectronic devices, packages and MEMS • microelectronic devices and packages reliability evaluation and assessment • thermo-mechanical material properties characterization in reference to micro-scale and nano-scale
Division of Microsystems and Photonics - Thick-Film Microsystems Laboratory (W12/Z6) • Main Activities • Passive components in LTCC modules • LTCC packaging • Modeling of temperature and fluid flow in LTCC modules • Thermoelectric microgenerators • Thermographic measurements of microsystems • Integrated microfluidic systems • Applications of LTCC inoptoelectronics • Microsystems for biological applications • Sensors
Channel (crossection) Micr.Int. 2002 Pressure sensor COE 2000 DC-DC converter Kita PhD 2003 Gas sensor, Sens&Act B 1998 Division of Microsystems and Photonics - Thick-Film Microsystems Laboratory (W12/Z6) LTCC modules investigated at TML Fluidic microreactor with optical detection Int.J.Appl.Cer.Tech.,2006 Enzymatic microreactor CICMT 2008 Gas flow sensor CICMT 2008 LTCC microreactor
Faculty of Microsystem Electronics and Photonics - EDUCATION Major: ELECTRONICS AND TELECOMMUNICATIONS Academic year 2009/2010 Year I, II and III – first-cycle studies (7 semesters), mode of study; full-time studies and next Second-cycle studies (3 semesters) are planned Year IV and V – MSc courses (10 semesters), mode of study; full-time studies with 3 specializations: • Microsystems • Optoelectronics and optical fiber technology • Electronics, photonics and microsystems (offered in English)
Electronics and Telecommunications – ELECTRONICS, PHOTONICS AND MICROSYSTEMS
Electronics and Telecommunications – ELECTRONICS, PHOTONICS AND MICROSYSTEMS 1st YEAR, SEMESTER 1 Basic courses CHS – Contact Hours (organized), TSW – Total Student Workload (h), E – Exam, T – Test Advanced courses
Electronics and Telecommunications – ELECTRONICS, PHOTONICS AND MICROSYSTEMS 1st YEAR, SEMESTER 2 Basic courses CHS – Contact Hours (organized), TSW – Total Student Workload (h), E – Exam, T – Test Advanced courses
Electronics and Telecommunications – ELECTRONICS, PHOTONICS AND MICROSYSTEMS 2nd YEAR, SEMESTER 3 CHS – Contact Hours (organized), TSW – Total Student Workload (h), E – Exam, T – Test, CW - Course Work
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