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Introducing Speedstack 2013 March 2013 - Richard Attrill / John Lee

Introducing Speedstack 2013 March 2013 - Richard Attrill / John Lee. New ‘Processed Thickness’ displayable column. New ‘Processed Thickness’ displayable column.

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Introducing Speedstack 2013 March 2013 - Richard Attrill / John Lee

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  1. Introducing Speedstack 2013 March 2013 - Richard Attrill / John Lee

  2. New ‘Processed Thickness’ displayable column

  3. New ‘Processed Thickness’ displayable column Processed Thickness, a single column that contains the conductor Finished Thickness and dielectric Isolation Distance. Totalling these fields equals the Stack Up Thickness

  4. New ‘Processed Thickness’ displayable column Processed Thickness, shown on the Technical Report

  5. Calculated Impedance field now highlighted Speedstack 2013 Speedstack 2012

  6. Design rule check (DRC) improvements New mechanical drill aspect ratio checks

  7. Stack Up Thickness Enhancements New ‘Solder Mask Thickness’ and ‘Stack Up Thickness with Solder Mask’ calculations now included within Speedstack Stack up thickness calculations also included on Speedstack status bar. Easy to keep track on stack up thicknesses while adding / swapping and deleting materials.

  8. Stack Up Thickness Enhancements Stack Up Information grid layout improved to more clearly present stack up thickness data Updated Speedstack status bar showing stack up thickness totals

  9. Stack Up Thickness Enhancements New ‘Solder Mask Thickness’ and ‘Stack Up Thickness with Solder Mask’ calculations now included on report

  10. The selected Units are now printed on the title bar Printing Enhancements Improvements have been made to the position of the dimensioning text and lines / arrows

  11. Interfacing with other systems It is now possible to automatically import an XML file into Speedstack on launch. Useful for importing pre-existing stack up data XML

  12. Interfacing with other systems Call an external program / utility / script from within Speedstack via the External Utilities menu

  13. Interfacing with other systems External Utilities menu defined within the Configuration option

  14. Multiple instances of Speedstack may now run simultaneously

  15. Other Speedstack enhancements Technical report improvements Impedance structure highlighting improvements for Advanced structures A more consistent number accuracy (precision) is now used for the dielectric constant, isolation distance and finished thickness fields shown on the stack up graphic Opening / saving of SCI project files is now given more emphasis throughout Speedstack than the older STK file format

  16. Other Speedstack enhancements The Speedstack keyboard short-cuts have been reallocated to more Windows-like functionality. Short-cuts that originally use the Insert key have been changed to more suitable keys in order to support Apple keyboards Alterations have been made to the controlled impedance tab scroll bar behaviour to accommodate Simplified / Traditional Chinese and Korean Windows 7 OS Speedstack now confirms adequate screen resolution during start up

  17. Windows 8 Speedstack 2013 has been tested for compatibility with Windows 8

  18. Upgrading to Speedstack 2013 • Active Speedstack Polarcare customers are entitled to upgrade to the 2013 release • Speedstack 2013 requires a new license: • The Speedstack 2012 license will NOT be suitable for Speedstack 2013 • The 2013 license will NOT be suitable for Speedstack 2012 or earlier releases • Users wishing to evaluate Speedstack 2013 prior to upgrading should contact their local Polar Instruments office

  19. Thank you

  20. For more information: Contact Polar now: Phone USA / Canada / MexicoKen Taylor ( 503) 356 5270 Asia / Pacific Terence Chew +65 6873 7470 Japan japan@polarinstruments.asia +81 45 339 0155 UK / EuropeNeil Chamberlain +44 23 9226 9113 Germany / Austria / Switzerland Hermann Reischer +43 7666 20041-0 www.polarinstruments.com

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