BME-ETT

1. BME-ETT Budapest University of Technology and Economics Department of Electronics Technology Prof. Gábor Harsányi head of department Presented by: Richárd Berényi www.ett.bme.hu We connect chips and systems

2. BME – Faculty of Electrical Engineering and Informatics electrical engineering • Dept. of Control Engineering and Information Technologies • Dept. of Automation and Applied Informatics • Dept. of Computer Science • Dept. of Telecommunications • Dept. of Broadband Infocommunications and Electromagnetic Theory • Dept. of Electronics Technology • Dept. of Electron Devices • Dept. of Electric Power Engineering • Dept. of Measurements and Information Systems • Dept. of Telecommunications and Media Informatics Design, production and reliability of PCBs Laser technology Integrated Enterprise Control Systems Sensor technology informatics We connect chips and systems

3. BME-ETT’s Industrial Background in Hungary > 10% GDP > 30% Export > 100.000 people We connect chips and systems

4. Competences in Electronics and Technology • Design and simulation of electronic circuits, PCB layout design • Complete design and simulation tools (Cadence) • Technology of module circuit boards • Complete prototyping line for PWB production • Flexible substrates • Thin film, Thick film • Technology of circuit assembly • Complete prototyping line for Surface Mount Technology assembling • Quality insurance and reliability • Accelerated lifetime tests • Failure analyses We connect chips and systems

5. Recent industrial projects in Hungary • Research on lead-free soldering, process optimization • Research on polymer thick film technology • Laser drilled microvias in PCB and flexible substrates • Development of Automated Optical Inspection algorithms • Thin film evaporation, thickness distribution measurement and simulation • Application specific electrical tester development • Life-time increase of pick&place feeders • Optimization of solder paste stencil production technology • Development of interactive web-based education • Controlling system for six-sigma project • Quality tests, accelerated lifetime tests • Failure analyses We connect chips and systems

6. ETT-VLAB BME-ETT developed a virtual laboratory environmentfor teaching microelectronics packaging technology. • It is an excellent tool for • students and engineers • to study • manufacturing equipment • processes • resulting productsand • to make preparations for • hands-on experiments • VLAB can be used to • present laboratory facility www.ett.bme.hu/vlab We connect chips and systems

7. X-ray structure and failure analysis Opens of BGA bumps PCB misalignment • tiltable detector • resolution: 600 nm • Examples of X-ray inspection applications: •  BGA, CSP ball inspection • Surface Mount Device solder joint • micro wire bond • multilayer printed wiring board  • interconnection • electromechanical components • effects of different solder pastes, fluxes Wire-bond failures We connect chips and systems

8. Scanning Acoustic Microscopy • reveals cracks, voids, delamination invisible for X-ray • non-destructive SAM Images of a solder joint failure X-ray optical x-section We connect chips and systems

9. Standard Climatic Tests THC -45°C..150°C heat-up time: ~90min. RH: 30..100% Thermal shock -60°C..200°C lift time between chambers ~10sec. HAST 100°C..150°C pressure: 2atm RH: max. 100% measurement of functional parameters during tests We connect chips and systems

10. International relations – EU projects • FLEXIL • Laser processing of advanced flexible substrates • LidCat • Laser drilled µvias (50µm) • Cheap Multi Chip Modules • Establishment of fast prototyping low cost multichip module technology • LeadOut • Lead-free soldering process introduction for SMEs • FlexNoLead • Impacts of lead-free soldering on flexible technology • EMCI • Unique method for via metallization (embedded micro connector) • CLEAN • Leakage Currents and Static Power Consumption in Nanometer CMOS Circuits We connect chips and systems

11. Leakage Currents and Static Power Consumption in Nanometer CMOS Circuits

12. Low-power interest in Hungary BME Department of Electron Devices deals with semiconductor devices, including device physics, process technology, materials characterization, design of VLSI circuits, development of CAD tools and thermal measurement and characterization of ICs and IC packages. Digital Media and System Engineering Laboratory (Prof.Dr. Ferenc Kovács) provides environment for the research of digital and analogue low-power circuits, development of VHDL-based circuit synthesis methods. His area includes the development of IC test equipment, real-time applications of VLSI circuits, low-power design of CMOS circuits and design of low-power biomedical instruments. Analogical and Neural Computing Laboratory, MTA-SzTAKI, Budapest Cellular Neural Networks (CNN) – a new computing paradigm for nonlinear spatio-temporal processing. Neurobiology is a motivating area. Research fields: HW and SW implementation of CNN computers (CNN Universal Machine); CMOS VLSI CNN chip development and application; emulated digital and optoelectronic implementations; systems research and system integration; CNN chip set architectures interfaced to the digital world. Integration Hungary Ltd (IHL) is a design center of Integration Associates Inc (IAI,www.integration.com). IAI is a fabless mixed-signal semiconductor manufacturer,Mountain View, CA, specialized in power management and IR, RF and wireline communication ICs. IHL staff is focused on RF IC development. Main products are low data rate, low range ISM band transmitters and receivers (EZRadio products). We connect chips and systems

13. Contact details Department of Electronics Technology Budapest University of Technology and Economics Goldmann t. 3., 1111 Budapest, Hungary Contact: prof. Gábor Harsányi Position: head of department Tel.: +36 1 463 3634 Fax: +36 1 463 4118 E-mail: harsanyi@ett.bme.hu Web: www.ett.bme.hu Skills: high density electronic modules, PWB, laser technology, sensors, biomedical applications, web-based courses We connect chips and systems