XIS Meeting 2004Mar16 FMS0 Door Open Failure & AE/TCE0 TCE Card Problem

1. XIS Meeting 2004Mar16FMS0 Door Open Failure& AE/TCE0 TCE Card Problem K. Hayashida, Osaka University

2. FMS0 Door Open Failure on Feb27 Door Open Time 2min-3min at RT 4min at -20degC 6min at -40degC 9min at -70degC • Nominal Door Open Sequence • Actuator current Start • Current =0.35-0.37A/+29V • Door open • M-SW Off / Current stop / LED on • Actuator shrink • M-SW on / LED off • 2004/2/27 FMS0 • Installed in Vacuum Chamber / LN2 Cooling started • Accutuator 18degC / BNT Pressure Sensor 0degC • 175sec after the Actuator current start, LED on for 2-3sec • At the time of LED on, the chamber pressure increased by one order of magnitude, indicating the Door at least partly opened. • No X-rays detected even when CCD= -60degC ! • Warm up/Leak … Door was closed !!

3. FMS0 Installed in the chamber

4. FMS0 Door Closed! Upward

5. XIS-BNT GSE

6. FMS0 Door Opened

7. Door Open Mechanism Side View (View from the inside BNT) Top View Latch M-SW Actuator Lod Door Completely Close (O-ring compressed) Ball-baring on the Door Door Half Close (O-ring not compressed) Door Open ! M-SW off /current off /LED on

8. Post Failure Test • De-installed from the Chamber • Manually move the latch to open the Door • Door Open test in the Air at RT using GSE + actuator; no problem Door Open Time 165sec • Various Inspections and Measurements • Scratch on the Latch surface to which M-SW contacts • Stroke between the Door Open Position to M-SW off position ~0.58mm • Margin of the Latch part to the Bonnet Housing; That should not make inversion of Door Open and M-SW off • M-SW stroke • Free(off) position to On position :0.32mm • On position to the most compressed position: 0.06mm • On position to off position: 0.14mm • By touching the M-SW lever, the M-SW was easily on/off. NOT YET RESOLVED

9. FMS0 Door Opened

10. Scratch on FMS0 Latch

11. M-SW (FMS1)

12. Scratch on FMS1 Latch

13. Possibilities • Actuator and/or GSE problem • Actuator worked properly but door did not open (O-ring stick to the body; The springs are too weak etc) • Latch part problem • Various margins of the Latch/Door are short to reproduce the inversion Door Open and M-SW off timing. • M-SW problem • Strokes of M-SW of FMS0 BNT is systematically different from other BNTs. • *) FMS0 failure occurred at cooling down phase BNT temperature of 0degC 19degC. Test at such low temperature has not yet been done.

14. Schedule • FMS0 bonnet was disconnected from the FMS0 base on Mar1. FMspare Bonnet wa s connected to FMS0 base on Mar6. • FMS0 bonnet is now inspected in detail at NTS. • Other bonnets in Osaka/Kyoto were inspected by NTS people (Mar12-13). • Re-adujstement and/or replacement of M-SW is considered.

15. AE/TCE0 TCE Card Trouble(Mar10) • FMS0 Test with AE/TCE0 • EGSE-software on Sun-WS and QL started 11:57 • PSU-on 12:11 PSU voltage/currents were nominal • AE/TCE Reset (pulse) 12:18 • Hk_all 12:18 • Hk_routine 12:19 • Strange HK from TCE card / Timeout for CR read to TCE card. • CR / HK values from other cards were nominal. • Temp Set=30.76degC/SCL=0.0% … could not set into TCE CR • AE/TCE Reset (pulse) 12:21 • The situation did not change. • AE/TCE Reset (pulse) 12:34 • PSU-off 12:36 • *)No problems in Mar9 experiment with the same configuration. No problems in Mar11 test of AE/TCE0 with dummy CCD and dummy TEC

16. Strange HK / Timeout CRin capture log • The strange HK values of the TCE card is like • T_READ_HK T_HK_CHAN0 (0x310000) => 0xc8fc (SC Bus Voltage=56.056 Volts) • T_READ_HK T_HK_CHAN1 (0x310100) => 0xcd4f (SC GND=9.900 Volts) • T_READ_HK T_HK_CHAN2 (0x310200) => 0xd182 (TCE +12 Volts=31.301 Volts) • T_READ_HK T_HK_CHAN3 (0x310300) => 0xd590 (TCE +5 Volts=10.956 Volts) • T_READ_HK T_HK_CHAN4 (0x310400) => 0xd98b (TCE TEC Voltage=11.466 Volts) • T_READ_HK T_HK_CHAN5 (0x310500) => 0xdd5e (TCE +24 Volts=35.855 Volts) • T_READ_HK T_HK_CHAN6 (0x310600) => 0xe11a (TCE GND=12.433 Volts) • T_READ_HK T_HK_CHAN7 (0x310700) => 0xe4b8 (TCE Temp=6173.000 Deg(C)) • The timeout of the CR values of TCE card is as follows • T_READ_CR T_CR_CHAN0 (0x210000) => 0x0000 (Operating Mode=0) (READ GENERATED NO RESPONSE) • T_READ_CR T_CR_CHAN1 (0x210100) => 0x0000 (CCD Temp=-257.790 deg(C)) (READ GENERATED NO RESPONSE) • T_READ_CR T_CR_CHAN2 (0x210200) => 0x0000 (HeatSink Temp=-255.770 deg(C)) (READ GENERATED NO RESPONSE) • T_READ_CR T_CR_CHAN4 (0x210400) => 0x0000 (CCD Temp Set Point 1.714T + 177.26 (T is desired setpoint in degrees C)=0) (READ GENERATED NO RESPONSE) • T_READ_CR T_CR_CHAN5 (0x210500) => 0x0000 (Current Soft Limit 1.27P (P is desired percentage of max current=0)(READ GENERATED NO RESPONSE)

17. Points to be considered • What is the cause of this “rare” failure ? PSU-on procedure problem? TCE card trouble ? Command decoder trouble in Control Card ? • Shouldn’t “AE/TCE reset” initialize the AE/TCE status to its “reset” state? There might be two or more states for the reset ? Cf. High/Low states in +5V current reported by Tsuru-san. • In the SC operation • The XIS PSU is almost always on. We have to turn off all the XIS system, if this event occur ? • *) The DE forces the AE/TCE reset line assert when the DE is off or in initializing state. We can assert the reset line when we turn on the PSU in the ground operation.

18. TCE Card Replacement Schedule • Mar 20 Current (Old) TCE Card test • AE/TCE01 with dummy CCD + dummy TEC test (1.5hr / one AE/TCE ? ) @Osaka • AE/TCE23 (+BNT GSE?) Kyoto-> Osaka, the same test for AE/TCE23 • Mar21 AE/TCE01 Card replacement and Test ? • Mar22 AE/TCE23 Card replacement and Test ? • Mar23 Sumo; Setup XIS-EU sensor to the chamber • Mar24 XIS-EU cooling down/TEC performance Test/55Fe Data at -90degC Heatsink Temp <-45degC • Mar25 Spare • Mar26 MIT members leave Japan • Mar29 – FM-Sensors cooling test @Osaka/Kyoto