Memory Testing and Pattern Introduction

1. Memory Testing and Pattern Introduction TM

2. Contents • Brief Introduction • Memory Classification and Application • How to Test Memory IC • Pattern Introduction • Scramble

3. Memory IC Testing • For storage media (memory): • not magnetic tape, not hard/floppy disk, not brain • For silicon process: • not WAT test, not reliability test, • not physical failure analysis • For IC testing: • not logic (ASIC, CPU, FPGA, LCD driver, …) • not mix-signal (ADC, DAC, USB, …) • For test program: • not timing, not pin format, not hardware configuration • not command to generate report, not user interface • We focus on: • electrical failure analysis, (memory IC) function test, test pattern

4. Memory Classification • Volatile memory: data will lose after power off • SRAM (static random access memory): • Low Power (or Low Voltage) SRAM / High Speed SRAM • DRAM (dynamic RAM, need refresh): • Synchronous DRAM / Double Data Rate (DDR) SDRAM • FCRAM (FJ, Fast Cycle RAM): DRAM cell with SRAM peripheral • Non volatile memory: data still keep after power off • ROM (read only memory) / PROM (programmable ROM) • EPROM (Erasable PROM) / EEPROM (Electrical EPROM) • Flash • Embedded Memory : • some of above memories are merged with some logical purpose circuit on a chip

5. Memory Application • LP-SRAM: mobile phone • HS-SRAM: cache memory • DRAM: phase out • SDRAM / DDR SDRAM: mother board / graphic card • ROM / PROM / EPROM: game machine / BIOS • EEPROM / Flash: smart card / voice recorder • FCRAM(FJ): mobile phone

6. Special Testing Feature • SRAM: typical memory function (Write and Read) • DRAM: row and column address are multiplexed, need refresh • SDRAM: need one synchronous clock, pipe-line (burst) concept • DDR SDRAM: one cycle two data, write latency, DLL on/off • FCRAM: need some test mode to access the DRAM cell • ROM: need SOM (source only memory) board of tester, read only • EEPROM / Flash: read / program / erase all / page mode • address and data are multiplexed, BUSY signal • Embedded Memory: in general, several hundreds pins, so we need customer provide more detailed or confidential document about • the memory-related, only around fifty pins information to run a • specified sequence to enter the direct access mode

7. From the PC BIOS’s View • For the PC with 256M bytes SDRAM (the simplest way, mail box) • write all 0x00, read all 0x00 be visited 2 times • write all 0xFF, read all 0xFF be visited 2 times • write all 0x55, read all 0x55 be visited 2 times • write random, read random be visited 2 times, total 8 times

8. What We Say the “Testing” • For the 16Mx8 bits SDRAM • 1. In general, when we are debugging or creating a pattern, • we always just consider one DQ only. • 2. In order to get good fault coverage and measure almost all the • device feature listed on data sheet, a test program will access • each bit more than several hundreds times, not only few times DQ1 to DQ8 are accessed in the same time for every address

9. Elements of Pattern • the most important is address and data:

10. Pattern Classification • For written data (background data): • solid 0/1, row bar, column bar, checker board, • diagonal, DQ switch, RWI (repeat with invert) • For cell visiting sequence (address changing): • write-verify, scan X/Y, march4n, march6n, • inverse, address complement, RWI • Take too long time and less use • galloping, butter-fly, shift diagonal --- n^2 • For DRAM special: • disturb, Long RAS

11. Background Data • In testing world: X is ROW is WL (word line), • Y is COLUMN is BL (bit line)

12. DQ Switch (polarity)

13. X-Fast vs. Y-Fast

14. Write Solid1 and RWI

15. Scan vs. Write Verify

16. Scan to March-4n

17. March-6n

18. Data / Address Scramble • Data scramble: only for DRAM, caused by Bit Line and /BL • Address scramble: in general, DRAM simple, SRAM complex

19. Display Scramble • Display scramble: whole chip address decoding rule • or chip architecture and DQ sequence • describe the relationship between the electrical address • and topological (physical) address