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Characterization of Void Growth in High Temperature Fatigued Copper through USANS

Characterization of Void Growth in High Temperature Fatigued Copper through USANS. Guangjun Cheng Stephen Fenimore Rohan Hule Jinkee Lee Christopher Metting Maria Torija. Outline. USANS Problem background Experimental design Analysis Results Conclusions. Low q range

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Characterization of Void Growth in High Temperature Fatigued Copper through USANS

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  1. Characterization of Void Growth in High Temperature Fatigued Copper through USANS Guangjun Cheng Stephen Fenimore Rohan Hule Jinkee Lee Christopher Metting Maria Torija

  2. Outline • USANS • Problem background • Experimental design • Analysis • Results • Conclusions

  3. Low q range 3x10-5 Å-1 < q < 0.01 Å-1 Particle Diameter: 0.1 μ m < D < 10 μm USANS Capabilities

  4. Fatigue causes voids in copper lattice Voids grow nucleate at grain boundaries Lead to mechanical failure Relationship between stress and void growth Problem Background

  5. Experimental Design • Fatigue conditions • 405 oC • 17 cycles/second • Max stress amplitude: 34 MPa • Monitor void growth by varying the number of fatigue cycles • 25,000; 50,000; 100,000 cycles • USANS to examine growth shape and size

  6. Reduced Slit Smeared USANS Data Slope= -1 (plate) Slope= -3 (Porod)

  7. Porod Scattering, 100,000 cycles Intercept ~surface area/sample volume -3 3

  8. Invariant Area under curve ~ Volume Fraction

  9. Modified Guinier (plate) m= -T2/12

  10. Results

  11. Comparison with prior work Scripta Met. 24 (1990) 227-232

  12. Conclusions • USANS proved to be a powerful tool for this investigation • Average volume increases with cycle number • Number of nucleation sites is independent of the number of cycles

  13. HURRAY for USANS!Thanks to John Barker, Man-Ho Kim, and David Mildner Questions?

  14. Data reduction for USANS: Smearing corection

  15. Scattering for non-interacting particles

  16. Particle Volume fraction- Invariant

  17. Interfacial Surface Area

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