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Veljko Milutinovi ć

Veljko Milutinovi ć. VLSI for SuperComputing: From Applications and Algorithms to Masks and Chips. 1 /40. World Top Foundries in VLSI for SuperComputing. #1?. 2 /40. World Top Foundries in VLSI for SuperComputing. #1? Qualcomm. 3 /40. World Top Foundries in VLSI for SuperComputing.

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Veljko Milutinovi ć

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  1. Veljko Milutinović VLSI for SuperComputing: From Applications and Algorithms to Masks and Chips 1/40

  2. World Top Foundries in VLSI for SuperComputing • #1? 2/40

  3. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm 3/40

  4. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? 4/40

  5. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? Intel 5/40

  6. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? Intel • #3? 6/40

  7. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? Intel • #3? Mubadala (AMD, ...) 7/40

  8. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? Intel • #3? Mubadala (AMD, ...) • The Qualcomm VP/TD started from this course(first as my PhD student and later as the course TA) 8/40

  9. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? Intel • #3? Mubadala (AMD, ...) • The Qualcomm VP/TD started from this course(first as my PhD student and later as the course TA) • An Intel VP/TD took the IR4RVL in-a-nut-shell(at my past IEEE/ACM-HICSS conference tutorial) 9/40

  10. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? Intel • #3? Mubadala (AMD, ...) • The Qualcomm VP/TD started from this course(first as my PhD student and later as the course TA) • An Intel VP/TD took the IR4RVL in-a-nut-shell(at my past IEEE/ACM-HICSS conference tutorial) • Maybe, a next MubadalaSRB VP/TD comes from ETF  10/40

  11. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? Intel • #3? Mubadala (AMD, ...) • The Qualcomm VP/TD started from this course(first as my PhD student and later as the course TA) • An Intel VP/TD took the IR4RVL in-a-nut-shell(at my past IEEE/ACM-HICSS conference tutorial) • Maybe, a next MubadalaSRB VP/TD comes from ETF or MF  11/40

  12. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? Intel • #3? Mubadala (AMD, ...) • The Qualcomm VP/TD started from this course(first as my PhD student and later as the course TA) • An Intel VP/TD took the IR4RVL in-a-nut-shell(at my past IEEE/ACM-HICSS conference tutorial) • Maybe, a next MubadalaSRB VP/TD comes from ETF or MF  or FFH  12/40

  13. World Top Foundries in VLSI for SuperComputing • #1? Qualcomm • #2? Intel • #3? Mubadala (AMD, ...) • The Qualcomm VP/TD started from this course(first as my PhD student and later as the course TA) • An Intel VP/TD took the IR4RVL in-a-nut-shell(at my past IEEE/ACM-HICSS conference tutorial) • Maybe, a next MubadalaSRB VP/TD comes from ETF or MF  or FFH  or FON  13/40

  14. Who works here? 14/40

  15. The Holistic Foundry (R&DFab)in VLSI for SuperComputing • Phase#1: From Applications to AlgorithmsPhase#2: From Algorithms to MasksPhase#3: From Masks to Chips 15/40

  16. The Holistic Foundry (R&DFab)in VLSI for SuperComputing • Phase#1: From Applications to AlgorithmsPhase#2: From Algorithms to MasksPhase#3: From Masks to Chips • Verification is crucial in each one of these phases,and related teaching is done in coop with ELSYS! 16/40

  17. The Holistic Foundry (R&DFab)in VLSI for SuperComputing • Phase#1: From Applications to AlgorithmsPhase#2: From Algorithms to MasksPhase#3: From Masks to Chips • Verification is crucial in each one of these phases,and related teaching is done in coop with ELSYS! • Management issues of importance for an R&DFab are covered in the accompanying course: IR4USP (including 12 related homework assignments)! 17/40

  18. Contents: From Algorithms to Masks • Part#1: VLSI for ControlFlow SuperComputing • Part#2: VLSI for DataFlow SuperComputing • Part#3: VLSI for WirelessFlow SuperComputing 18/40

  19. VLSI for ControlFlow SuperComputing • ManyCore Systems: • VHDL vs Verilog (0.5 weeks) • Design and Programming of a 200MHz RISC Microprocessor(2.5 weeks) + HW#1 • MultiCore Systems: • MicroProcessor and MultiMicroProcessor Systems by Wiley (1 week) • Verification by Elsys (2 weeks) + Lab#1 19/40

  20. 20/40

  21. 21/40

  22. VLSI for DataFlow SuperComputing • FineGrain DataFlow: • Altera vs Xilinx (0.5 weeks) • Design and Programming of the 200MHz Maxeler Machine (3.5 weeks) + HW#2 • SystolicArray DataFlow: • Systolic Array Architectures (0.5 weeks) • DARPA Systolic Architectures (0.5 weeks) + Lab#2 22/40

  23. Advances in Computer Architecture (North Holland)by Veljko M. Milutinovic with a contribution from John Hennessy 23/40

  24. High-Level Language Computer Architecture (Elsevier Computer Science Press)by Veljko M. Milutinovic with a contribution from Michael Flynn 24/40

  25. VLSI for WirelessFlow SuperComputing • WSNs: Part#1 • Hardware (0.25 weeks) • Software (0.25 weeks) • WSNs: Part#2 • Systems (SUN+Slimmer) (0.25 weeks) • Applications (UbiComputing@WSN+DataMining@WSN) (0.25 weeks) 25/40

  26. 26/40

  27. opt.html 27/40

  28. VLSI for QuantumMechanical SuperComputing • Basics: • Hardware (0 weeks) • Software (0 weeks) • Advances: • Systems (0 weeks) • Applications (0 weeks) Optional class projects for extra points! 28/40

  29. European Projects • ESF: • RoMoL: Riding on Moore's Law (0 weeks) • HiPeac: Parallel Programming Models (0 weeks) • FP7/H20: • FP7: ProSense (0 weeks) • FP7: BalCon (0 weeks) 29/40

  30. Example Algorithms for Practical Implementations • Engineering: • Computer Engineering (0 weeks) • Financial Engineering (0 weeks) • Science: • Physical Chemistry (0 weeks) • Computer Science (0 weeks) 30/40

  31. SOME PREVIOUS OFFERINGS OF THIS TECH COURSE Purdue Stanford MIT Barcelona Siena Ljubljana Previous offerings of the related MGMT course: Purdue, Dartmouth, HarvardCNY, Barcelona, Pisa, Ljubljana 31/40

  32. BOTTOM LINE: BRINGING ADVANCED INDUSTRIAL EXPERIENCE INTO THE CLASSROOM 32/40

  33. BOTTOM LINE: BRINGING ADVANCED INDUSTRIAL EXPERIENCE INTO THE CLASSROOM 33/40

  34. BOTTOM LINE: BRINGING ADVANCED INDUSTRIAL EXPERIENCE INTO THE CLASSROOM 34/40

  35. BOTTOM LINE: BRINGING ADVANCED INDUSTRIAL EXPERIENCE INTO THE CLASSROOM (2)

  36. BOTTOM LINE: BRINGING ADVANCED INDUSTRIAL EXPERIENCE INTO THE CLASSROOM (2)

  37. BOTTOM LINE: BRINGING ADVANCED INDUSTRIAL EXPERIENCE INTO THE CLASSROOM (2)

  38. BOTTOM LINE: BRINGING ADVANCED INDUSTRIAL EXPERIENCE INTO THE CLASSROOM (3) 38/40

  39. BOTTOM LINE: BRINGING ADVANCED INDUSTRIAL EXPERIENCE INTO THE CLASSROOM (3) 39/40

  40. BOTTOM LINE: BRINGING ADVANCED INDUSTRIAL EXPERIENCE INTO THE CLASSROOM (3) Wireless Sensor Networks: ApplicationDesign and DataMining 40/40

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