Introduction to VLSI CMPE/ELEE 4375 Introduction

1. Introduction to VLSICMPE/ELEE 4375Introduction

2. Outline • Syllabus • Logistics (time, place, instructor, website, textbook) • Grading • Topics • Outcomes • Introduction to VLSI • A brief history • MOS transistors • CMOS logic gates 0: Introduction

3. Time and Place Class: 8:45 am - 9:35 am MWF Engineering Building 1.262 Instructor Hasina Huq hhuq@utpa.edu ENGR 3.278, 665-5017 Office hours: MTW 1.00 pm -3.00 pm or walk in or by appointment Course Information (1) 0: Introduction

4. Course Information (2) Prerequisites • Digital logic (ELEE 2330) and Electronic 1(ELEE 3301), or equivalent • I assume you know the following topics • Boolean algebra, logic gates, etc. • MOSFET characteristics • Undergraduate physics: Ohm’s law, resistors, capacitors, etc. • Undergraduate math: calculus 0: Introduction

5. Course Information (3) • Text Ken Martin, Digital Integrated Circuits design, Oxford, • Reference Class handouts • Cadence manual set • H.Craig Casey, Jr., Devices for Integrated Circuits, John-Wiley, • Baker, Li, & Boyce, CMOS Circuit Design, Layout, and Simulation, IEEE Press, 1998. Account UNIX (lab access) 0: Introduction

6. Course Information (4) • Grading • 60% project • 5% homework • 15% mid-term exam • 20% final exam • Laboratory Based Projects (3) 60% (10%, 20%, 30%) • Final project include design, report and presentation • Total 100% 0: Introduction

7. Course Information (5) • Topics • NMOS,PMOS CMOS • logic gate • fabrication and layout • MOS transistor characteristics • Performance analysis for VLSI circuits • digital circuits design • Integrated Circuit (IC) design • Compact & cost effective design • System on chip 0: Introduction

8. Course Information (6) • Use the Electric CAD tool to design a chip including (depending on tool availability) • Schematic entry • Layout • Transistor-level cell design • Gate-level logic design • Hierarchical design • Switch-level simulation (IRSIM) • Design rule checking (DRC) • Electrical rule checking (ERC) • Network consistency checking (NCC) • HDL design (Verilog) • Place and route • Pad frame generation and routing • Pretapeout verification 0: Introduction

9. Course Information (7) • Outcomes • Estimate and optimize combinational circuit delay using RC delay models and logical effort • Design high speed and low power logic circuits • Understand interconnect and reliability issues • Design functional units including adders, multipliers, DFF, ROMs, SRAMs, and PLAs • Beware of the VLSI trends and challenges 0: Introduction

10. Introduction • Integrated circuits: many transistors on one chip. • Very Large Scale Integration (VLSI): very many • Complementary Metal Oxide Semiconductor • Fast, cheap, low power transistors • Today: How to build your own simple CMOS chip • CMOS transistors • Building logic gates from transistors • Transistor layout and fabrication • Rest of the course: How to build a good CMOS chip 0: Introduction

11. A Brief History • 1958: First integrated circuit • Flip-flop using two transistors • Built by Jack Kilby at Texas Instruments • 2003 • Intel Pentium 4 mprocessor (55 million transistors) • 512 Mbit DRAM (> 0.5 billion transistors) • 53% compound annual growth rate over 45 years • No other technology has grown so fast so long • Driven by miniaturization of transistors • Smaller is cheaper, faster, lower in power! • Revolutionary effects on society 0: Introduction

12. The impact of ICs on modern society has been pervasive. Without them current computer, electronics systems and information-technology revolution would not exist. Immense amount of signal and computer processing is realized in a single IC. Most of the students of Computer/ Electrical Engineering are exposed to Integrated Circuits (IC's) at a very basic level, involving circuits like multiplexers, Flip flop, encoders etc. But there is a lot bigger world out there involving miniaturization, that a micrometer and a microsecond are literally considered huge! This is the world of VLSI - Very Large Scale Integration. 0: Introduction

13. The course will help you to understand why you need to learn the Chip / Integrated Circuit (IC) Design technologies. This involves packing more and more logic devices into smaller areas and smaller areas.This has opened up a big opportunity to do things that were not possible before. VLSI circuits are everywhere ... your computer, your car, your brand new state-of-the-art digital camera, the cell-phones, and what have you.All this involves a lot of expertise on many fronts within the same field, which we will look at in the course.At UTPA we use Cadence simulation tool which is an industry standard simulator 0: Introduction

14. Modern ICs are enormously complicated. A large chip may have more transistors than there are people on Earth i.e. may contain millions of transistors. The rules for what can and cannot be manufactured are also extremely complex. An IC process may well have more than 600 rules. CAREER:  Design Engineer: Takes specifications, defines architecture, does circuit design, runs simulations, supervises layout, tapes out the chip to the foundry, evaluates the prototype once the chip comes back from the fab. TYPICAL COMPANIES AND JOBS?Intel, IBM, Texas Instruments, Motorola, National Semiconductor, Maxim, Linear Technology, Siemens, Qualcomm 0: Introduction

15. University: Most of the universities in USA are offering VLSI course at undergraduate level because of reality, demand. Dept: Electrical and Computer Engineering: University of Texas at Austin, RiceUniversity, Department of Electrical and Computer Engineering at Texas A&M University, Dept. of Electr. Eng. & Comput. Sci., Univ of Michigan. Ann Arbor, MI, Department of Electrical and Computer Engineering UC Berkeley 0: Introduction

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20. Invention of the Transistor • Vacuum tubes ruled in first half of 20th century Large, expensive, power-hungry, unreliable • 1947: first point contact transistor at Bell Labs • John Bardeen and Walter Brattain at Bell Labs • Read Crystal Fire by Riordan, Hoddeson 0: Introduction

21. Transistor Types • Bipolar transistors • npn or pnp silicon structure • Small current into very thin base layer controls large currents between emitter and collector • Base currents limit integration density • Metal Oxide Semiconductor Field Effect Transistors • nMOS and pMOS MOSFETS • Voltage applied to insulated gate controls current between source and drain • Low power allows very high integration • Simpler fabrication process 0: Introduction

22. MOS Integrated Circuits Intel 1101 256-bit SRAM Intel 4004 4-bit mProc • 1970’s processes usually had only nMOS transistors • Inexpensive, but consume power while idle • 1980s-present: CMOS processes for low idle power 0: Introduction

23. Moore’s Law Integration Levels SSI: 10 gates MSI: 1000 gates LSI: 10,000 gates VLSI: > 10k gates • 1965: Gordon Moore plotted the number of transistors on each chip • Fit straight line on semilog scale • Transistor counts have doubled every 26 months 0: Introduction

24. Corollaries • Many other factors grow exponentially • Ex: clock frequency, processor performance 0: Introduction

25. Scaling Down: a Mystery In 1971, minimum dimensions of 10 um in 4004. In 2003, minimum dimensions of 130 ns in Pentium4. Scaling down forever ? (No, transistors cannot be less than atoms) Many predictions of fundamental limits to scaling have already proven wrong We believe that scaling will continue for at least another decade. What is the future? 0: Introduction

26. Periodic Table 0: Introduction

27. Dopants Silicon is a semiconductor Pure silicon has no free carriers and conducts poorly Adding dopants increases the conductivity Group V (Arsenic): extra electron (n-type) Group III (Boron): missing electron, called hole (p-type) 0: Introduction