FPC1011F Introduction of a new sensor package

1. FPC1011F Introduction of a new sensor package

2. FPC1011F • Summary: • FPC has invested + 1 000 KUSD • High quality design • Electrically compatible with FPC1011C • Available as solderable component • New high quality supplier chain • Production start June 2008

3. FPC1011F • Product improvements: • BT substrate • + High quality FR4 • + No silver migration or oxide • - May need mechanical support from underneath

4. FPC1011F • Product improvements: • BT substrate • Film Assisted Moulding • + Standard mould method • + Embedded passives • + Protects silicon edges

5. FPC1011F • Product improvements: • BT substrate • Film Assisted Moulding • Flex film contact • + Custom design of flex film (length etc.) • - Sourced by customer

6. FPC1011F • Product improvements: • BT substrate • Film Assisted Moulding • Flex film contact • Available for soldering with BGA • + Enables automated assembly process • + Low cost

7. FPC1011F • Product improvements: • BT substrate • Film Assisted Moulding • Flex film contact • Available for soldering with BGA • New hard coating • + Mass production process, applied on wafer • + Not sensitive to scratches, • - May give ESD footprint under extreme conditions

8. FPC1011F • Product improvements: • BT substrate • Film Assisted Moulding • Flex film contact • Available for soldering with BGA • New hard coating • - May give ESD footprint under extreme conditions: • Strong ESD discharge from test electrode (>7.5KV) => Coating surface may be affected by oxygen plasma reaction => May be detected in image from extremely wet fingers. • Disappears over time (typically by 30% after 3 days) • Conditions for possible appearance: • Low humidity, typically northern China (may bring high voltage ESD discharges), • High humidity, typically southern China (may bring wet skin properties), • Electrode approach from top & discharge via sensor surface. • Not observed by live finger discharge.

9. FPC1011F • Productimprovements: • BT substrate • Film Assisted Moulding • Flex film contact • Available for soldering with BGA • New hard coating • Metal frame • + More robust versus plastic frame in FPC1011C • + Available in different forms • + Colour and surface conditions (default Satine finish metal colour) • - Needs minimum order quantity

10. FPC1011F Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA New hard coating Metal frame available in different forms

11. New Supplierchain • Production improvements: • Assembly managed by Amkor • + No. one package supplier world wide • Full automated production process • + High volume capacity • + Repeatable high quality process • Well defined qualification process • + High product quality • - Longer product change time

12. New Supplierchain Production process: Silicon production

13. New Supplierchain Production process: Silicon production Coating Spin coating process

14. New Supplierchain Production process: Silicon production Coating Packaging • Wafer dicing • Die attach • Wire bonding • Passives • FIM mould • Frame assembly • Flex contact assembly • Test & outgoing inspection

15. FPC1011F Customer feedback: Questions? Acceptable product? Thank you for your attention !