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A 20/30 Gbps CMOS Backplane Driver with Digital Pre-emphasis. Paul Westergaard, Timothy Dickson, and Sorin Voinigescu University of Toronto Canada. Outline. Motivation Design Goals Circuit Description and Design Experimental Results Summary and Conclusion. Motivation. Application
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A 20/30 Gbps CMOS Backplane Driver with Digital Pre-emphasis • Paul Westergaard, Timothy Dickson, and Sorin Voinigescu • University of Toronto • Canada
Outline • Motivation • Design Goals • Circuit Description and Design • Experimental Results • Summary and Conclusion
Motivation Application • Serial inter-chip communications over backplanes at 20-Gb/s. Unfulfilled Needs • CMOS implementation over 10-Gbps • > 30 dB dynamic range, low-power • Programmable width and height pre-emphasis to increase receiver simplicity Prior Art • Previous CMOS backplane drivers have only achieved 10 Gb/s data rate.
Design Goals • 30-Gb/s main path operation without pre-emphasis • 20-Gb/s fully featured operation with • ‘digital’ pre-emphasis • eye-crossing • output swing control • High Sensitivity (<10 mVpp per side) • Large output swing (>350 mVpp per side) • 50-Ohm input/output matching • 1.5 V supply • 130 nm CMOS implementation
Biasing for peak fT and NFMIN Peak fT bias 0.3mA/um Min. NFMIN 0.15mA/um Multi-stage amplifiers with signal path transistors biased at half peak fT
Circuit Architecture • Multi-stage amplifier implementation • Input stage biased and sized for high gain and low noise • Inductive broad-banding in every inverter stage to reduce power and increase speed • Main (higher-speed) and pre-emphasis paths are parallelized
Eye-crossing Control *D. S. McPherson, S. Voinigescu et al IEEE GaAs IC Symp. - Oct. 2002
Inductor design considerations • Inductor broadband “2-p” model model extracted for design from ASITIC simulations. • Multi-layer ( 2 or 3 metals) design used to minimize inductor area (400, 700, 900 pH used) • Largest inductor side is 44 um (900 pH)
Measured Eye-diagrams: 0.3Vp-p output 25 Gb/s 20 Gb/s 30 Gb/s
Sensitivity Input: 21mVpp one side onlyOutput: 80mVpp per side 20 Gb/s 30 Gb/s
Output Swing Control @20Gbps Input: 200mVpp one side only Output: 170mVpp Output: 340mVpp
Output Swing Control @30 Gbps Input: 200mVpp one side only Output: 170mVpp Output: 270mVpp (Gain at 30 Gb/s!)
30%-70% Crossing Control @20 Gbs 50% 30% 70%
40%-60% Crossing Control @ 25 Gbs 50% 40% 60%
Conclusion • First CMOS driver above 20 Gb/s • Novel digital pre-emphasis • High sensitivity, dynamic range • Large output swing • Eye-crossing control • Communications between chips and backplanes is feasible at 20 Gb/s in 130-nm CMOS technology
Acknowledgements • Rudy Beerkens and Boris Prokes of STMicroelectronics Ottawa • STMicroelectronics for fabrication • Micronet and Gennum Corporation for financial support • Quake Technologies for access to 40 Gb/s BERT