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Richard Kass

Radiation-Hard ASICs for Optical Data Transmission in the ATLAS Pixel Detector. K.E. Arms, K.K. Gan, M. Johnson, H. Kagan, R. Kass, C. Rush, A. Rahimi, S. Smith, R. Ter-Antonian, M.M. Zoeller The Ohio State University A. Ciliox, M. Holder, S. Nderitu, M. Ziolkowski

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Richard Kass

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  1. Radiation-Hard ASICs forOptical Data Transmission in theATLAS Pixel Detector K.E. Arms, K.K. Gan, M. Johnson, H. Kagan, R. Kass, C. Rush, A. Rahimi, S. Smith, R. Ter-Antonian, M.M. Zoeller The Ohio State University A. Ciliox, M. Holder, S. Nderitu, M. Ziolkowski Universitaet Siegen, Germany Richard Kass Outline l Introduction l Results from IBM 0.25 mm Prototype Chips l Results from Proton Irradiations l Summary Richard Kass/OSU

  2. ATLAS Pixel Detector 2 disks/end 2 layers in barrel l Inner most charged particle tracking detector l Pixel size: 50 mm x 400 mm l ~ 100 million channels l Dosage after 10 years: middle barrel layer: 50 Mrad or 1015 1-MeV neq/cm2 optical link: 30 Mrad Richard Kass/OSU

  3. ATLAS Pixel Opto-link VCSEL:Vertical Cavity Surface Emitting Laser diode VDC:VCSEL Driver Circuit PIN:PiNdiode DORIC:Digital Optical Receiver Integrated Circuit Opto-board: this board holds the VDCs, DORICs, PINs, VCSELS use BeO as substrate for heat management Richard Kass/OSU

  4. VCSEL Driver Circuit Specs • Convert LVDS input signal into single-ended signal appropriate to drive the VCSEL diode • Output (bright) current: 0 to 20 mA, controlled by external voltage • Standing (dim) current: ~ 1 mA to improve switching speed • Rise & fall times: 1 ns nominal (80 MHz signals) • Duty cycle: (50 +/- 4)% • “On” voltage of VCSEL: up to 2.3 V at 20 mA for 2.5 V supply • Constant current consumption! • Current design uses TRUELIGHT “high power oxide” VCSELs Richard Kass/OSU

  5. Digital Optical Receiver IC Specs lDecode Bi-Phase Mark encoded (BPM) clock and command signals from PIN diode lInput signal: 40-1100 mA lExtract: 40 MHz clock lDuty cycle: (50 +/- 4)% lTotal timing error: <1 ns lCommon Cathode PIN array lBit Error Rate (BER): < 10-11 at end of life 40 MHz clock command BPM lTraining period: ~1 ms of 20 MHz clock (BPM with no data) Input transitions ] leadingedges Internal delays] trailingedges Richard Kass/OSU

  6. Status of VDC and DORIC VDC and DORIC produced using IBM 0.25mm CMOS process Migrated ATLAS SCT’s VDC & DORIC design in AMS 0.8mm Bipolar to DMILL DMILL (0.8mm CMOS) process met e-specs but was not rad hard enough VDC-I5e and DORIC-I5e: our fifth IBM submission Use CADENCE program 5 layers, enclosed layout transistors and guard rings 4 channels per chip (VDC: 1.4mm´4mm DORIC: 2.3mm´4mm) engineering run, produced enough chips for production Received chips in June 2003 Electrical measurements performed on these chips: detailed measurements of many parameters: rise/fall time, duty cycle, bright/dim current… VDC-I5e and DORIC-I5e are acceptable for use in pixel detector Need to certify that these chips are radiation hard previous VDC and DORIC version (I4) rad hard to > 50Mrad detailed plan to certify radiation hardness Richard Kass/OSU

  7. Ch 4 Ch 4 Ch 3 Ch 3 Ch 2 Ch 2 Ch 1 Ch 1 DORIC and VDC Layout DORIC-I5 (2.3 x 4mm) VDC-I5 (1.4 x 4mm) Preamp / Digital Test Pads Input Pads: Signal_in GndA Noise_in VddAmp VddA Analog / Digital Bias, Resets Richard Kass/OSU

  8. VDC-I5e Measurements bright Eight VDCI5e chips with four channels per chip were measured dim VDCI5e duty cycle Spec is 50±4% Richard Kass/OSU

  9. VDC-I5e Rise and Fall Times rise time spec is <1 ns fall time Richard Kass/OSU

  10. Status of BeO Opto-Board converts electricalÛoptical 6-7 links/board First BeO opto-boards arrive in April. Find problems: many vias not filled. Send boards back to company for repair. Company only partially successful with repairs (~50% success rate) We find a new company to produce the boards (more $$$ too) two populated opto-boards used for rad-hardness tests Richard Kass/OSU

  11. Radiation Hardness MeasurementsCERN August 2003 Important to measure/certify radiation hardness of optical components VDC DORIC VCSEL Fibers Glues, etc… Use CERN’s T7 beam (24 GeV protons) for radiation hardness studies. We perform two types of radiation hardness tests: Cold Box: read out VDC and DORIC electrically (copper wires) Shuttle: readout VDC and DORIC via optical fibers VDC and DORICs mounted on BeO opto-board shuttle can be moved in and out of beam remotely For both tests we monitor the VDCs and DORICs in real time. Richard Kass/OSU

  12. CERN Irradiation Tests PC BER Tester DORIC Distribution 0.2 m Ribbon 25m Ribbon + 25 m Coaxial System for Irradiation in Cold Box Coaxial 20 MHz VDC Distribution Beam Area Distribution 0.5m Ribbon Test Boards VDC or DORIC Testing system at OSU before shipping to CERN Richard Kass/OSU

  13. Irradiation Tests System for Irradiation in Shuttle Opto-board Bit error test board in T7 control room Bi-phase marked optical signal 25 m fibers/wires Decoded data Opto-pack clock PIN DORIC data An irradiation test Opto-link VDC VCSEL VCSEL VDC measure power of clock and data Vs dose Richard Kass/OSU

  14. Setup for CERN’s T7 Shuttle shuttle test electronics at OSU prior to shipping to CERN 25m of optical fibers Remotely moves in/out of beam opto-boards Optical fibers Richard Kass/OSU

  15. Results from Irradiation Threshold for zero bit errors vs Dose Opto-board #1 anneal anneal anneal anneal anneal all other links: pseudo-random bit string and Ipin=100 uA Thresholds independent of dose Richard Kass/OSU

  16. Results from Irradiation Opto-board #1(BeO#3) Clock Optical Power Vs Dose Irradiate for ~4-6 MRad (~4-5 hours) Move boards out of the beam and anneal for 12-15 hours LVCSELs need time to anneal Monitor the optical power of each link in real time. Opto-board #2(BeO#4) anneal anneal anneal anneal anneal anneal anneal anneal anneal anneal Beam Iset = 0.6 mA (=10mA) for beam, 1.5mA (=1314mA) for annealing Richard Kass/OSU

  17. Summary and Conclusions VDC and DORIC chips satisfy ATLAS Specs BeO Opto-board: Original vendor not able to produce quality boards Have found new vendor Þ updated layout submitted Radiation studies: Cold Box: VDC and DORIC are more than hard enough! Shuttle: VCSEL radiation hardness an issue will VCSELs anneal enough to meet power specs ? Move to Production in 2004 ~500 VDCs, ~400 DORICs, ~200 opto-boards (includes spares) Richard Kass/OSU

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