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Progress and Integration for Detector Upgrades in the Central Region

This update outlines the progress made in the integration of detector upgrades in the central region. It includes information on the engineers and detector representatives involved, as well as details on mechanical and electrical issues. Additionally, it covers the specifications for the VTX electrical systems and provides information on the cable plant and cooling requirements for both pixel and strip detectors. The update also addresses the mechanical support structure and other integration issues. Lastly, it provides updates on the status of mechanical engineering and the upcoming meeting with HYTEC.

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Progress and Integration for Detector Upgrades in the Central Region

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  1. General Progress • Started general integration meetings for detector upgrades in the central region • Ed O’Brien, the engineers (and detector reps.) • Alternate weeks between mechanical and electrical issues • Paul Giannotti (BNL) to work on VTX electrical issues • Steve Boose (BNL) to handle HV/LV power supplies for VTX • Custom system built in-house preferred • CAEN HV/LV system specs for pixel detectors provided by Stony Brook folks

  2. VTX Spec Sheet “Parameter book” in TAC Review Linked off PHENIX Silicon and Engineering pages

  3. VTX Spec Sheet (cont) Lots of holes in this section

  4. 3D CAD Model at LANL • Following slides summarize what is currently fairly firmly established for LANL to use as input for 3D CAD model. • At least gets us up to and out of the outer support structure.

  5. Pixel Detectors • Cable plant: • 20 cm x 1.5 cm Al pixel bus (10 cm pigtail off the end of each half ladder) is wire-bonded to Al-Cu transition board. • 3 cm x 3 cm x 8 mm encapsulated Al-Cu transition board is wire-bonded to Cu fan-out flex cable. • Cu fan-out flex cable terminates with fine pitch multi-pin connector(s): • Provides point of disconnect for assembly to SPIRO pilot module board. • Considering multiple 3 cm x 8 mm x 8 mm connectors in a finger-like arrangement. • SPIRO boards are mounted on endplates of the outer support structure. • Beyond 10 cm x 10 cm SPIRO board, HV/LV on coax cables and signals on optical fibers. • Cooling: • 3 mm dia supply on one end of each ladder and 3 mm dia return off opposite end.

  6. Strip Detectors • Cable plant (default option): • Flex ribbon cable wire-bonded off the end of each ladder provides LVDS link between bus to RCC chips and multi-pin bulkhead connector on the outer support structure: • Not wider than width of strip ladder and length to be determined by optimizing route in 3D CAD model. • Provides point of disconnect for assembly of strip ladders onto barrel. • Cooling: • 3 mm dia supply on one end of each ladder and 3 mm dia return off opposite end.

  7. Mechanical Support Structure • Modular design will allow mounting of VTX independent of NCC. • Suspended from support rods cantilevered off CM • One end on floating supports to compensate for motion during energization of magnet.

  8. Other Integration Issues • Additional space necessary for VTX electronics may be provided by truncating corners of HBD to boundary of acceptance limits. • Incumbent on VTX Group to prove this space is necessary • HBD Group currently designing final support structure • Temperature of pole tips from heat generated by energized magnet an issue? • Are thermal shields for VTX necessary (as in PHOBOS)? • A non-issue according to Hubert; little heat generated

  9. Status of Mech Engg • Letter of intent from BNL to contract for engineering on VTX mechanics/integration at LANL in place • Not the same as the contract for HYTEC • Past experience: contract takes ~ 4 mos. to set up • HYTEC w/ Dave Lee provided contract draft to BNL • Specifies scope of work based on original cost matrix • Defines deliverables as finished parts (not just drawings) • Meeting in NM w/ HYTEC scheduled for June 16

  10. HYTEC Cost Matrix + 15 + 20 DOE Proposal R&D 200(?)

  11. Status of Mech Engg (cont) • Walt Sondheim to present recent update from 3D CAD model • Don Lynch to present results on spatial envelopes for proposed detector upgrades in central region

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