Status of the Tracker Outer Barrel

1. Status of the Tracker Outer Barrel Joe Incandela University of California Santa Barbara for the illustrious and colorful TOB Group Tracker General Meeting July 15, 2005 (Slides compliments of D. Abbaneo,A. Affolder,C. Campagnari, A. Marchioro, A. Onnela, Lenny Spiegel, and many others…)

2. US Module Assembly Plates We are now setup to process at most15 plates (20 plates) per day (extended day). A much larger number of plates was prepared to allow us to adapt to whatever variations may occur in component deliveries and tracker needs.

3. US Production Cycle Wire bond Wire bond Quick test hybrids on ARC Thermal cycle hybrids Gantry makes modules. Final pinhole test on ARC Thermal cycled module Modules test on ARC Assemble rods from modules Rods shipped to CERN Rod burn-in

4. US Tracker Group • Brown University • R. Hooper, G. Landsberg, H.D. Nguyen, C. Pehlevan, T. Hartman, H.Y. Jung • University of California, Riverside (UCR) • G. Hanson, H. Liu, G.Y. Jeng, G. Pasztor, A. Satpathy, R. Stringer • University of California, Santa Barbara (UCSB) • A. Affolder, S. Burke, C. Campagnari, F. Garberson, D. Hale, J. Incandela, S. Jaditz, P. Kalavase, S. Kyre, J. Lamb, D. Stuart, D. White + technicians • University of Illinois, Chicago (UIC) • E. Chabalina, C. Gerber, L. Nigra, T. Ten • Fermilab (FNAL) • S. Cihangir, M. Demarteau, D. Glenzinski, H. Jensen, A. Ronzhin, J. Spalding, L. Spiegel, S. Tkaczyk + technicians • University of Kansas (KU) • P. Baringer, A. Bean, L. Christofek, D. Coppage • Mexican Consortium: • Cinvestav: H. Castilla, R. Perez, A. Sanchez • Puebla: E. Medel, H. Salazar • San Luis Potosi: A. Morelos • University of Rochester (UR) • R.Demina, R. Eusebi, Yu. Gotra, E. Halkiadakis, S. Korjenevski, S. Lockwood D. Miner, P. Tipton + technicians

5. US Production Steps/Status DAQ Component shortages and/or failures can limit production testing capacity in future

6. UCSB TEC Production • Module Production • R5N, R5S, R6 and R7 • All TEC production equipment is commissioned • With the possible exception of R7 at UCSB • General capacity issues • Can (and likely will) saturate our capacity with TEC production (30/d) • Actual rate depends on need and availability of parts as well as TOB production parts availability and schedule • Bonding and Testing capacity adequate • LT testing capacity limit is ~100 per week but could eventually be mostly TEC if necessary (since TOB burn-in will be shifted to rods) or it will have to be sampled

7. R7 as of yesterday • Message from Dean White (UCSB) • We built 9 TOB 4-chip and 3 R7 modules today (July 14).  • All were grade A.    • For the 6 sensors on the 3 R7 modules built, the angle between the sensors was 4 mdeg or less, and the individual sensors were all 6 mdeg or less.  • It will take a bit more time to be confident about the R7 assembly plates, but we appear to be headed in the right direction with the rebuilt pick-up tool. • We are doing dry runs on one of the other R7 plates.  • The plan is to build on this plate today 

8. FNAL & UCSB Inventory – 7/12/05 As of July 12 2005: Plenty of sensors and frames on hand Hybrids are still the critical path components

9. Now storing ~2000 modules We’re making storage for ~400 more TOB modules. We’ll need even more storage capacity Continue in batches of 400 storage units Musical wirebonders FNAL has shipped a K&S 8090 to UCSB which will be commissioned after the UCSB K&S 8060 has a bond-head replacement. Once fully commissioned we ship the 8060 to FNAL THIS GIVES BOTH SITES MODULE BONDING CONTINGENCY AS WELL AS ADEQUATE HYBRID BONDING CAPACITY Module Issues

10. US module production (to June 10) US will build >8,000 modules US peak Capacity ~250-300 modules per week. One week peak so far ~ 100  85

11. Other Planning • Will help accelerate TEC schedule • R7 production at FNAL in Autumn at 12-15 modules per day. • UCSB will make R5 and R6 at up to 30 per day when TOB is finished • Second hybrid line • Go-ahead given for up to 2k circuits – David Stuart (UCSB) will oversee • Riverside repair and diagnostics center • Nearly online • Goal to study the small fraction of rejected hybrids/modules in order to fully categorize and document problems • Create an encyclopedia and museum of pathology that could be referenced during data-taking if similar problems appear on modules that are then completely inaccessible…

12. Rods Overview • Basic components procured • Assembly of frames is DONE (modulo ICC) • Integration of modules on rods is understood • Rate of ≳ 8/d in the US is not be a problem … • Testing was problematic and rod production was halted • I2C communication errors seen on 30-50% of rods • Recent and very substantial effort to understand and remedy • Many thanks to : A. Marchioro, Wim Beaumont, M. Johnson, G. Maggazu, Slawek Tkaczyk… • Simple solution (number 6) an improvement but not quite.. • A better solution (number 7) adopted and requires new ICC • Secondary issues of header errors and failures in LT tests are also under study

13. Main cause SDA Unequal fall-time of SCL and SDA signals SCL on FE-Hybrid Picture shows sequence of SCL/SDA signals with SDA pulled-down in AOH and measured on FEH

14. Solution 6 PSU FE FE-Hybrid PSU Control APV 82W SCL SDA AOH 82W Jumper creates a common time domain but some recent information from US indicates may still be marginal LLD

15. Option 7 PSU FE FE-Hybrid ICC PSU Control 100pF DCU/APV CRT245 (Line driver) 100 pF 330W SCL AOH 22W SDA Parasitic on AOH CA 22W LLD 10pF

16. Effect of “damping” resistor SDA with “damping” SDA without “damping” SCL not show on this slide

17. US Rod Production - Mechanical • Assembly procedures well developed • Trained personnel (including backups) at both sites • Takes ~ 1-1.5 hours to assemble a rod • Not a bottleneck • Long term testing 4 (6) (8) DS (SS6) (SS4) rods/2 days No issues – everything is in place

18. Single Rod Teststand (SRT) FNAL Many room temperature Tests: • Hardwired thermistors and humidity sensors • CCU ring redundancy • DCU readouts • Leakage current • Pedestals & noise • Looking for gross problems • No channel level characterization • Most tests done using LtStruct • currently V29 • Hardwired sensors tested with simple custom box • Root macro similar to module test macro to generate plots • Plots etc. uploaded to e-log • Output root and text files saved for ALL tests • including version number, if tested more than once Only piece missing: protocol for testing digital functionality, experts will provide UCSB

19. Sample SRT output

20. (Semi) long term test ~ 2 days 6-8 SS rods/load Thermal cycle Full channel level characterization Multi Rod Test-stand (MRT) FNAL UCSB

21. Current MRT test cycle Warm Test Cold Warm Cold Test Warm Test Cold Test Warm Test Expected to evolve…

22. Hardware: all OK, robust now (was very leaky…) DAQ software (LtStruct) Much progress recently thanks to great cooperation from Wim et al. But there are still a few problems Analysis SW: DefectAnalyzer V0.28 + some changes: Makes plots and XML file First pass cuts defined…will be refined as we learn… Custom perl script Compares bad channels with lists from module tests and also flags DCU problems, etc MRT status

23. Current (limited) production • While I2C solution 7 is being prepared we are assembling and testing a limited number of rods with "jumpers" (I2C Solution 6) • Test I2C solution 6 • To be shipped to CERN to populate 1st cooling segment, and possibly the cosmic rack • Gain experience with (somewhat) large scale rod production • Somewhat longer testing cycle to double-triple-quadruple-check I2C behavior • Gain experience with testing protocol • Document/investigate non-I2C failures • Refine cut requirements

24. Part Count as of July 13, 2005

25. 5 with unconnected thermistors (as read out by DCU, i.e., these are not the "hardwired" thermistors) 4 at FNAL, 1 at UCSB 1 fails ring redundancy test FNAL 1 Laser failure FNAL 1 with strange problem, open ring? UCSB, under investigation All 4 SS4 rods (UCSB) have unusually high noise SRT results – out of 43 tested rods Discussed in TOB meeting where we agreed upon the actions to be taken

26. But also… • Still low rate of I2C errors 230 that we thought would have been cured by jumper (Solution 6) • Other not-yet-understood I2C errors • A few other annoyances like header errors HW or SW problems? Experts are actively investigating

27. After this "limited production" we will stop Take stock of situation, firm up procedures Attack other (non I2C) problems Hold a mini-workshop to get the UCSB and FNAL-based people together in August We will likely consider another fairly substantial production exercise Allows one to hunt more rare problems Module storage… Plans

28. TOB Wheel Assembly

29. TOB Wheel Measurements with theodolites, photogrammetry, slide calipers, and rulers: Wheel is correct in shape (better than 0.2 mm)

30. TOB wheel construction: complete • Mechanics complete and rotated into final position • Precision elements of disks and cylinders glued on a single jig yielding typically 30 m relative precision • Relative positioning of disks and cylinders limited only by measurement system precision (100 m) Major achievement by Antti Onnela and the DT2 technical crew!

31. Wheel ready Wheel on assembly chariot Thermal screen operational Wheel ready for insertion in the tracker support tube and… The tube with thermal screen are already in the assembly clean room.

32. Preparations for TOB integration - where we are as of yesterday He leak test stand OKRod precabling stand OKCu power cables two weeksCable “bridge” one weekVacuum system for soldering to be commissionedService supports in productionCooling manifolds in productionReadout hardware FEDs/FEC available - firmware 1 week (?)Power supplies availableTest software to be commissioned on C-Rack Plumbing in 186 (cooling and He) Basically done DB tools defined - only ribbon registration implemented ------ later ------Alu cables need to update layout and start production (lengths OK)Cable test box in production in Lyon (mid-August) - need updated pinoutDOHMs finalizing tail lengths - start production

33. Summary • Module production lines have completed 25% of TOB • >99% yield and >99.95% good channels • Production of 40-50 modules/day can be achieved, provided that we have adequate parts flow and stable testing • Rod frames production in Helsinki is complete • Rod integration and testing capacity ≳8 rods/day • I2C communication problem is understood • Rod integration and testing has restarted in the US with solution 6 • Solution 7 likely definitive – will learn more in coming weeks. • TOB Wheel is ready and other preparations are in train • Integration exercises will start soon • Very capable team at CERN • US may send a team in September (headed by Jeff Spalding)