'Wire bonding' presentation slideshows

Part-D

Part-D. Main topics Packaging of electronic equipments Components of electronic systems Surface mount technology Printed Wiring board (PWB) types Electronics packaging levels Wire bonding packaging Flip-Chip packaging Chip Scale Packaging Ball Grid Array packaging

1.23k views • 53 slides

Part-D

Part-D. Main topics Packaging of electronic equipments Components of electronic systems Surface mount technology Printed Wiring board (PWB) types Electronics packaging levels Wire bonding packaging Flip-Chip packaging Chip Scale Packaging Ball Grid Array packaging

1.06k views • 53 slides

Electrical Tapes & Optical Links

Electrical Tapes & Optical Links. Electrical tapes Al/kapton tapes for SCT Wiggly tapes for SCT EC Lessons learned. Optical Links Survey reliability in ATLAS Focus on problematic systems Lessons learned and being learnt. Al/kapton Tapes. 50 um Al/50 um kapton

553 views • 41 slides

Silicon Strip R&D Activity in Korea

484 views • 37 slides

CAD Tools for 3D-IC and TSV-based designs

609 views • 33 slides

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?? ??? ???. ?????? ??? ????? ? ???????? ????. Wire Bonding. ????? : ???? ???? ???? ???????? ????? ?????: ????? ????? ???. ???????? 93. Content. IC interconnection technologies Whats wirebonding Wire Bonding Processes Thermosonic Wirebond forms Design rules Cost

723 views • 26 slides

Status of SVD2 upgrade

343 views • 23 slides

Reconfigurable Patch Antenna

Reconfigurable Patch Antenna. With Matching Network. Presented by: Mike Bly, Josh Rohman Advisor: Dr. Prasad N. Shastry. Presentation Outline. Introduction to Reconfigurable Antenna Alternative Options Design Criteria Patch Antenna Design Switching Method and Implementation

2.65k views • 22 slides

Stave Assembly

Stave Assembly. (A random walk through stave construction). Outline. I got asked to think of specifications for module mounting system build accuracy I think the intention was to try and review where to use build tolerances (stave, module placement, stave placement, cylinder placement)

397 views • 21 slides

IBL Stave & loading tools

IBL Stave & loading tools. The main goal for today… Review and Validate the SPECS for the Staves (dim., tol., …and the related fabrication processes and tools) Review of the Assembly tools (Flex, Modules) and related SPECS

262 views • 15 slides

L6 Ladder assembly

L6 Ladder assembly. T. Tsuboyama 21 Sept. 2011. Motivation. The assembly of Origami needs repetition of gluing and wire bonding. If this is done in companies, we will occupy the production for much longer time than wire bonding.

302 views • 15 slides

US Barrel Module Status Report

US Barrel Module Status Report. October 9, 2001. Overview. US groups to deliver 670 modules. Work is split between LBL and UC Santa Cruz LBL Hybrid assembly, test and burn-in Module assembly, test and burn-in UCSC Hybrid rework, test and burn-in Module rework, test and burn-in

205 views • 9 slides

Test setup for RAL structures - Cedric Mansuy

Test setup for RAL structures - Cedric Mansuy. Test setup ready main board + chip carrier PCBs (2 types: transistors (1), HV transistors, insulation, capacitances (2)) Setup with lab instruments (switching matrix, LCRmeter , source-meters) and Labview Software for analyzing data ( Matlab )

224 views • 8 slides

Preproduction Status & Results

Preproduction Status & Results. Qty. 4 completed thermal cycle, burn-in and final electrical test, Sent to SLAC. Qty. 10 completed thermal cycle, burn-in and final electrical test, Sent to INFN. Qty. 14 thermal cycle complete, burn-in and final electrical test (ECD 2/12/04).

171 views • 8 slides

DESY Summary

DESY Summary. Ingrid-Maria Gregor , Julia Fourletova , Tobias Haas, Katsumasa Ikematsu, Tatsiana Klimkovich, Ulrich Koetz, Lukasz Maczewski, Alessandro Montanari, Carsten Muhl, Jolanta Sztuk. Testbeam Infrastructure and Magnet Board Population. JRA1 Meeting in Geneva January 26th 2007.

239 views • 8 slides

Wire Bonding of Single-layer PA

266 views • 6 slides

HFT PIXEL wirebond vacuum chuck

HFT PIXEL wirebond vacuum chuck. vacuum chuck assembly. existing vacuum chuck on the wire bonding machine. wire bonds. ladder locating pins. HFT PIXEL ladder. vacuum chuck for holding HFT PIXEL ladder. wire bonder vacuum chuck.SLDASM. wire bonding, exploded view.

259 views • 6 slides

Miniworkshop on the ATLAS Upgrade for the HL-LHC Closeout

Miniworkshop on the ATLAS Upgrade for the HL-LHC Closeout. Zdenek Dolezal Charles University in Prague. ITK and the Prague cluster. Investigate possibility to set up one production unit of the ITK endcap modules in Prague Significant extension of the ATLAS tasks:

132 views • 5 slides

Stave programme

Stave programme. Staves recently build. Stave#7 I think is at QML Intend was to aggressively thermally cycle and look for structural issues Stave#8 Shield-less tapes , no cut-outs K13C2U/EX1515, 45gsm 2.275mm OD Titanium pipe, no fittings

184 views • 4 slides

Ceramic Single Layer capacitors Short application description

Ceramic Single Layer capacitors Short application description. W line. Line. Example 1. Ribbon or wire bonding. W line. Example 2. Single layer Capacitor. MMIC. Power supply decoupling. Example 3. T line thickess. Example 1. Ribbon or wire bonding. Example 2.

356 views • 3 slides