Different Types Of Thermal Conductive Sealant

1. Different Types Of Thermal Conductive Sealant www.aok-technologies.com

2. Thermal Greases Though these are messy thermal interface solution, these have thermal compounds with typical thermal resistance of Kcm^2/W: 0.2 – 1.0. Thermal Greases www.aok-technologies.com

3. With silicone or hydrocarbon greases, loaded with thermally conductive filler materials, this provides low thermal resistance. www.aok-technologies.com

4. Thermal Pads These are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. These are pre-cured thermally conductive elastomeric pads which are easy to apply. Thermal Pads www.aok-technologies.com

5. Due to their thickness, these are low in thermal resistance of Kcm^2/W: 1.0 – 3.0. Typically require high pressure clamping to achieve reasonable thermal. Relatively firm at room temperature, it becomes soft to fill gaps at higher temperatures. www.aok-technologies.com

6. Phase Change Materials With thermal resistance of Kcm^2/W: 0.3 – 0.7, these are solid materials that melt between 50-80C. These are the combination of pad convenience and grease thermal performance. These avails some adhesion and are not rework able like greases and thermal pads. www.aok-technologies.com

7. Thermal Tapes Thermally conductive tapes are similar to thermal pads but provide more substantial adhesion across the interface. Being a Thermal conductive sealant, its thermal resistance is Kcm^2/W: 1.0 – 4.0 www.aok-technologies.com

8. Gels With typical thermal resistance of Kcm^2/W: 0.4 – 0.8, these partially cure to reduce mess which is comparable to grease. www.aok-technologies.com

9. Solder With traditional heat transfer method, it requires high heat, electrically conductive but these days most other options are electrically insulating. Rework not able and not suitable for large bond areas. These are available with thermal resistance of Kcm^2/W: 0.05 Thermally Conductive Adhesives www.aok-technologies.com Through heat dissipation, thermally conductive adhesives help to protect the electronic circuitry. Thermosetting polymers provide substantial long-term strength across the bond interface, and 2nd to only soldering in ultimate heat transfer capabilities. With typical thermal resistance of Kcm^2/W: 0.15 – 1.0, it requires a robust manufacturing process. The adhesives provide highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices and also, manages heat while solving other application issues. www.aok-technologies.com

10. The amount of heat transmission through any combination of materials can be calculated. Technologically advanced formulations designed to meet the performance requirements of many high tech industries includes Telecommunications, Motor control, Aerospace, Military, Medical, Electro-optical, Electronic and Robotic. You can calculate the exact amount of heat loss while manufacturing the thermal sealant by understanding the technical terms and the factors involved in the process.  www.aok-technologies.com

11. Office Address Tel. : +86-755-8652 1770 Fax : +86-755-8652 1449 Office Add : Room A309, Shennan Garden, Nanshan District, Shenzhen, China. Postcode : 518000 E-mail : sales@aok-technologies.com Factory Address Tel. : +86-755-2976 5775 Fax : +86-755-2752 0218 Factory Add: Miaoxi Industrial Park, Guihua Village, Guanlan Town, Baoan District, Shenzhen City, China. Postcode: 518110 www.aok-technologies.com

12. If you have any requirement or need any other information related to Thermal conductive sealant, or other Product then please visit our website. www.aok-technologies.com www.aok-technologies.com