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Radiation Hardened Electronics Market Growth at 9% CAGR to C

radiation hardened electronics market is estimated to grow at 8.95% to cross the $1bn mark by 2019, the radiation tolerant EDC market is estimated to grow at around 5.35% during the same forecast period. The combined market size of both the segments in 2014 was around $6.7bn only.

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Radiation Hardened Electronics Market Growth at 9% CAGR to C

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  1. IndustryARC Global Radiation Hardened and Radiation Tolerant Electronic Device & Components Market, 2014 – 2019

  2. TABLE OF CONTENTS 1LIST OF TABLES ....................................................................................................... 8 2LIST OF FIGURES .................................................................................................. 12 3RAD-HARD AND RAD-TOL EDC- MARKET OVERVIEW ............................. 14 4EXECUTIVE SUMMARY ....................................................................................... 16 5RAD-HARD EDC MARKET LANDSCAPE ......................................................... 19 5.1 5.2 MARKET SHARE ANALYSIS ........................................................ 19 COMPARATIVE ANALYSIS ......................................................... 20 5.2.1 PRODUCT BENCHMARKING ............................................. 20 5.2.2 PATENT ANALYSIS ......................................................... 20 5.2.3 TOP 5 FINANCIALS ANALYSIS ........................................ 22 6RAD-HARD EDC MARKET FORCES .................................................................. 23 6.1 MARKET DRIVERS ..................................................................... 23 6.1.1 RELIABILITY ON RADIATION-HARDENED AND RADIATION-TOLERANT COMPONENTS ............................ 23 6.1.2 DEMAND FOR COMMERCIAL AIRPLANES ON THE RISE .............................................................................. 23 6.1.3 SPACE AND MILITARY BUDGET CUTS INCREASING DEMAND FOR HIGHER RAD-HARD AND RAD-TOL COMPONENTS ................................................................ 23 MARKET CONSTRAINTS ............................................................ 24 6.2.1 INCREASING LIABILITY TO DAMAGING RADIATION EFFECTS DUE TO DECREASE IN CHIP SIZES ............................................................................. 24 MARKET CHALLENGES ............................................................... 24 6.3.1 INCREASING COST OF SEE TESTING PROCEDURE ........... 24 6.3.2 INADEQUATE SEE TESTING PROCEDURES ....................... 25 6.3.3 RECONFIGURABLE ELECTRONICS ON PRIORITY LIST OF SPACE AGENCIES ACROSS THE WORLD ............. 25 ATTRACTIVENESS OF RADIATION HARDENED EDC INDUSTRY ................................................................................ 25 6.4.1 POWER OF SUPPLIERS ................................................... 26 6.4.2 POWER OF CUSTOMERS .................................................. 26 6.4.3 THREAT OF NEW ENTRANTS ........................................... 27 6.2 6.3 6.4

  3. 6.4.4 6.4.5 THREAT OF SUBSTITUTION ............................................ 27 DEGREE OF COMPETITION ............................................. 28 7RAD-HARD EDC MARKET – STRATEGIC ANALYSIS ................................... 29 7.1 7.2 7.3 7.4 7.5 VALUE CHAIN ANALYSIS ........................................................... 29 PRICING ANALYSIS .................................................................. 30 OPPORTUNITIES ANALYSIS ...................................................... 30 PRODUCT/MARKET LIFE CYCLE ANALYSIS ................................ 31 SUPPLIERS AND DISTRIBUTORS .............................................. 31 8RAD HARD EDC MARKET BY PRODUCTS ..................................................... 32 8.1 8.2 INTRODUCTION ........................................................................ 32 ANALOG AND MIXED SIGNAL/ DIGITAL ELECTRONIC DEVICES ................................................................................... 33 8.2.1 RAD-HARD A/D AND D/A CONVERTERS .......................... 33 8.2.2 RAD-HARD MULTIPLEXERS ............................................. 33 DISCRETE SEMICONDUCTORS ................................................... 34 OPTOELECTRONICS .................................................................. 34 POWER MANAGEMENT .............................................................. 34 SENSORS .................................................................................. 35 MEMORY ................................................................................... 35 MICROPROCESSORS AND MICROCONTROLLERS ....................... 37 FPGAS ....................................................................................... 38 ASICS ....................................................................................... 39 OTHERS .................................................................................... 39 8.11.1 RADIATION HARDENED FLIP FLOP ................................. 39 8.11.2 RADIATION HARDENED CMOS STRUCTURE USING AN IMPLANTED P GUARD STRUCTURE ............................ 39 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 9RAD HARD EDC MARKET BY MATERIALS .................................................... 41 9.1 9.2 9.3 9.4 SILICON ................................................................................... 42 SILICON CARBIDE .................................................................... 42 GALLIUM NITRIDE .................................................................... 42 HYDROGENATED AMORPHOUS SILICON ................................... 42 10RAD HARD EDC MARKET BY PRODUCT-TYPE ............................................ 43 10.1 10.2 CUSTOM-MADE.......................................................................... 43 COMMERCIAL-OFF-THE-SHELF (COTS) ...................................... 43 11RAD HARD EDC MARKET BY INDUSTRY VERTICALS ............................... 45

  4. 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 INTRODUCTION ........................................................................ 45 AEROSPACE .............................................................................. 46 MILITARY ................................................................................. 48 SPACE ....................................................................................... 49 NUCLEAR .................................................................................. 50 MEDICAL ................................................................................... 52 CONSUMER ELECTRONICS......................................................... 53 OTHERS .................................................................................... 55 12RAD HARD EDC MARKET - GEOGRAPHIC ANALYSIS ................................ 56 12.1 12.2 12.3 12.4 12.5 INTRODUCTION ........................................................................ 56 AMERICAS ................................................................................ 57 EUROPE .................................................................................... 63 APAC ......................................................................................... 70 ROW ......................................................................................... 77 13MARKET ENTROPY .............................................................................................. 82 13.1 INTRODUCTION ........................................................................ 82 13.1.1 NEW PRODUCT LAUNCHES ............................................. 82 13.1.2 M&AS, COLLABORATIONS, JVS AND PARTNERSHIPS .............................................................. 84 14COMPANY PROFILES ........................................................................................... 85 14.1 AEROFLEX INC. ......................................................................... 85 14.1.1 BUSINESS OVERVIEW .................................................... 85 14.1.2 FINANCIALS................................................................... 85 14.1.3 PRODUCTS ..................................................................... 88 14.1.4 STRATEGY ...................................................................... 88 14.1.5 RECENT DEVELOPMENTS ................................................ 89 ATMEL CORPORATION .............................................................. 90 14.2.1 BUSINESS OVERVIEW .................................................... 90 14.2.2 FINANCIALS................................................................... 90 14.2.3 PRODUCTS ..................................................................... 92 14.2.4 STRATEGY ...................................................................... 92 14.2.5 RECENT DEVELOPMENTS ................................................ 93 BAE SYSTEMS PLC ..................................................................... 94 14.3.1 BUSINESS OVERVIEW .................................................... 94 14.3.2 FINANCIALS................................................................... 95 14.3.3 PRODUCTS ..................................................................... 96 14.2 14.3

  5. 14.3.4 14.3.5 CRANE CO. ................................................................................ 98 14.4.1 BUSINESS OVERVIEW .................................................... 98 14.4.2 FINANCIALS................................................................... 98 14.4.3 PRODUCTS ................................................................... 100 14.4.4 STRATEGY .................................................................... 101 14.4.5 RECENT DEVELOPMENTS .............................................. 101 HONEYWELL AEROSPACE ........................................................ 102 14.5.1 BUSINESS OVERVIEW .................................................. 102 14.5.2 FINANCIALS................................................................. 102 14.5.3 PRODUCTS ................................................................... 103 14.5.4 STRATEGY .................................................................... 104 14.5.5 RECENT DEVELOPMENTS .............................................. 104 INTERNATIONAL RECTIFIER CORPORATION .......................... 105 14.6.1 BUSINESS OVERVIEW .................................................. 105 14.6.2 FINANCIALS................................................................. 105 14.6.3 PRODUCTS ................................................................... 107 14.6.4 STRATEGY .................................................................... 107 14.6.5 RECENT DEVELOPMENTS .............................................. 107 INTERSIL CORPORATION ........................................................ 109 14.7.1 BUSINESS OVERVIEW .................................................. 109 14.7.2 FINANCIALS................................................................. 110 14.7.3 PRODUCTS ................................................................... 111 14.7.4 STRATEGY .................................................................... 112 14.7.5 RECENT DEVELOPMENTS .............................................. 112 LINEAR TECHNOLOGY CORPORATION ..................................... 114 14.8.1 BUSINESS OVERVIEW .................................................. 114 14.8.2 FINANCIALS................................................................. 114 14.8.3 PRODUCTS ................................................................... 116 14.8.4 STRATEGY .................................................................... 116 14.8.5 RECENT DEVELOPMENTS .............................................. 116 MAXWELL TECHNOLOGIES INC. .............................................. 118 14.9.1 BUSINESS OVERVIEW .................................................. 118 14.9.2 FINANCIALS................................................................. 118 14.9.3 PRODUCTS ................................................................... 120 14.9.4 STRATEGY .................................................................... 120 14.9.5 RECENT DEVELOPMENTS .............................................. 120 14.10MICROSEMI CORPORATION .................................................... 122 STRATEGY ...................................................................... 96 RECENT DEVELOPMENTS ................................................ 97 14.4 14.5 14.6 14.7 14.8 14.9

  6. 14.10.1BUSINESS OVERVIEW .................................................. 122 14.10.2FINANCIALS................................................................. 122 14.10.3PRODUCTS ................................................................... 124 14.10.4STRATEGY .................................................................... 124 14.10.5RECENT DEVELOPMENTS .............................................. 124 14.11STMICROELECTRONICS NV ..................................................... 126 14.11.1BUSINESS OVERVIEW .................................................. 126 14.11.2FINANCIALS................................................................. 126 14.11.3PRODUCTS ................................................................... 128 14.11.4STRATEGY .................................................................... 128 14.11.5RECENT DEVELOPMENTS .............................................. 129 14.12TEXAS INSTRUMENTS INC. ..................................................... 130 14.12.1BUSINESS OVERVIEW .................................................. 130 14.12.2FINANCIALS................................................................. 130 14.12.3PRODUCTS ................................................................... 132 14.12.4STRATEGY .................................................................... 133 14.12.5RECENT DEVELOPMENTS .............................................. 133 14.13XILINX INC. ............................................................................ 135 14.13.1BUSINESS OVERVIEW .................................................. 135 14.13.2FINANCIALS................................................................. 135 14.13.3PRODUCTS ................................................................... 137 14.13.4STRATEGY .................................................................... 137 14.13.5RECENT DEVELOPMENTS .............................................. 137 14.14MICROPAC INDUSTRIES INC. ................................................. 139 14.14.1BUSINESS OVERVIEW .................................................. 139 14.14.2FINANCIALS................................................................. 139 14.14.3PRODUCTS ................................................................... 140 14.15MS KENNEDY CORPORATION .................................................. 141 14.15.1BUSINESS OVERVIEW .................................................. 141 14.15.2PRODUCTS ................................................................... 141 14.15.3DEVELOPMENTS ........................................................... 141 14.16PEREGRINE SEMICONDUCTOR CORP. ...................................... 142 14.16.1BUSINESS OVERVIEW .................................................. 142 14.16.2FINANCIALS................................................................. 142 14.16.3PRODUCTS ................................................................... 143 14.16.4DEVELOPMENTS ........................................................... 143 14.17SEMICOA CORPORATION ........................................................ 145 14.17.1BUSINESS OVERVIEW .................................................. 145 14.17.2PRODUCTS ................................................................... 145

  7. 14.17.3DEVELOPMENTS ........................................................... 145 14.18TELEDYNE MICROELECTRONIC TECHNOLOGIES, INC. ............. 147 14.18.1BUSINESS OVERVIEW .................................................. 147 14.18.2PRODUCTS ................................................................... 147 14.18.3DEVELOPMENTS ........................................................... 147 14.193D PLUS SA ............................................................................. 148 14.19.1BUSINESS OVERVIEW .................................................. 148 14.19.2PRODUCTS ................................................................... 148 14.19.3DEVELOPMENTS ........................................................... 149 14.20AITECH DEFENSE SYSTEMS INC. ............................................. 150 14.20.1BUSINESS OVERVIEW .................................................. 150 14.20.2PRODUCTS ................................................................... 150 14.20.3DEVELOPMENTS ........................................................... 151 15APPENDIX .............................................................................................................152 15.1 15.2 15.3 15.4 15.5 ABBREVIATIONS ..................................................................... 152 152 SOURCES ................................................................................ 153 RESEARCH METHODOLOGY ..................................................... 153 EXPERT INSIGHTS .................................................................. 154

  8. 1LIST OF TABLES UU TABLE 1. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS RADIATION TESTING FACILITIES 15 TABLE 2. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT EDC MARKET FORECAST, 2014 – 2019 ($M) 16 19 19 TABLE 3. TABLE 4. TABLE 5. KEY RADIATION HARDENED ELECTRONICS COMPANIES, 2014 KEY RADIATION TOLERANT ELECTRONICS COMPANIES, 2014 GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS, BY PRODUCT TYPE 20 TABLE 6. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS - TOP 5 COMPANIES’ FINANCIAL ANALYSIS 22 TABLE 7. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 32 TABLE 8. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY END-PRODUCT, 2014-2019 ($M) 43 TABLE 9. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY END-USER, 2014-2019 ($M) 45 TABLE 10. GLOBAL RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY REGION, 2014- 2019 ($BN) 46 TABLE 11. GLOBAL RAD-HARD ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY COMPONENTS, 2013 - 2019 ($BN) 47 TABLE 12. GLOBAL RAD-HARD ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET VOLUME, BY COMPONENTS, 2013 - 2019 (UNITS) 47 TABLE 13. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MILITARY MARKET REVENUE, BY REGION, 2014-2019 ($BN) 48 TABLE 14. GLOBAL RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS SPACE MARKET REVENUE, BY COUNTRY, 2014-2019 ($M) 49 GLOBAL RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS SPACE MARKET VOLUME, BY COUNTRY, 2014-2019 (UNITS) TABLE 15. 50 TABLE 16. GLOBAL NUCLEAR RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY GEOGRAPHY, 2014-2019 ($M) 51 TABLE 17. GLOBAL NUCLEAR RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 51 TABLE 18. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MEDICAL MARKET REVENUE, BY REGION, 2014-2019 ($M) 52

  9. TABLE 19. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MEDICAL MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 53 TABLE 20. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS CONSUMER ELECTRONICS MARKET REVENUE, BY GEOGRAPHY, 2014-2019 ($M) 54 TABLE 21. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS CONSUMER ELECTRONICS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 54 GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY GEOGRAPHY, 2014-2019 ($M) TABLE 22. 56 TABLE 23. AMERICAS RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 57 TABLE 24. AMERICAS RAD-HARD ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY AIRCRAFT TYPE, 2013 - 2019 ($M) 58 U.S. RAD-HARD SPACE MARKET REVENUE, BY COMPONENTS, 2014- 2019 ($M) TABLE 25. 59 TABLE 26. AMERICAS NUCLEAR RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 59 TABLE 27. AMERICAS RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MILITARY MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 61 TABLE 28. AMERICAS RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MEDICAL MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 61 TABLE 29. AMERICAS RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS CONSUMER ELECTRONICS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 62 EUROPE RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) TABLE 30. 63 TABLE 31. EUROPE RAD-HARD ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY AIRCRAFT TYPE, 2013 - 2019 ($M) 64 EUROPE RAD-HARD SPACE MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) TABLE 32. 64 TABLE 33. UKRAINE RAD-HARD SPACE MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 65 TABLE 34. RUSSIA RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS SPACE MARKET REVENUE, BY COMPONENTS, 2014- 2019 ($M) 66 TABLE 35. EUROPE NUCLEAR RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 66

  10. TABLE 36. EUROPE RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MILITARY MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 67 TABLE 37. EUROPE RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MEDICAL MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 68 TABLE 38. EUROPE RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS CONSUMER ELECTRONICS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 69 APAC RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) TABLE 39. 70 TABLE 40. APAC RAD-HARD ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY AIRCRAFT TYPE, 2013 - 2019 ($M) 71 JAPAN RAD-HARD SPACE MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) TABLE 41. 71 TABLE 42. CHINA RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS SPACE MARKET REVENUE, BY COMPONENTS, 2014- 2019 ($M) 72 TABLE 43. SOUTH KOREA RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS SPACE MARKET REVENUE, BY COMPONENTS, 2014- 2019 ($M) 72 TABLE 44. INDIA RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS SPACE MARKET REVENUE, BY COMPONENTS, 2014- 2019 ($M) 73 TABLE 45. APAC NUCLEAR RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 74 TABLE 46. APAC RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MILITARY MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 75 TABLE 47. APAC RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MEDICAL MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 75 TABLE 48. APAC RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS CONSUMER ELECTRONICS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 76 ROW RADIATION HARDENED ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) TABLE 49. 77 TABLE 50. ROW RAD-HARD ELECTRONIC DEVICES AND COMPONENTS AEROSPACE MARKET REVENUE, BY AIRCRAFT TYPE, 2013 - 2019 ($M) 78 ROW NUCLEAR RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) TABLE 51. 78

  11. TABLE 52. ROW RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MILITARY MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 79 TABLE 53. ROW RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MEDICAL MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 79 TABLE 54. ROW RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS CONSUMER ELECTRONICS MARKET REVENUE, BY COMPONENTS, 2014-2019 ($M) 80 86 91 95 99 102 TABLE 55. TABLE 56. TABLE 57. TABLE 58. TABLE 59. TABLE 60. AEROFLEX INC., ANNUAL REVENUE, 2012-2013 ($M) ATMEL CORPORATION., ANNUAL REVENUE, 2012-2013 ($M) BAE SYSTEMS PLC. ANNUAL REVENUE, 2012-2013 ($M) CRANE CO., ANNUAL REVENUE, 2012-2013 ($M) HONEYWELL AEROSPACE, ANNUAL REVENUE, 2012-2013 ($M) INTERNATIONAL RECTIFIER CORP., ANNUAL REVENUE, 2013-2014 ($M) 106 INTERSIL CORP., ANNUAL REVENUE, 2012-2013 ($M) TABLE 61. TABLE 62. TABLE 63. TABLE 64. TABLE 65. TABLE 66. TABLE 67. TABLE 68. TABLE 69. 110 114 118 122 126 131 135 139 142 LINEAR TECHNOLOGY CORP. ANNUAL REVENUE, 2013-2014 ($M) MAXWELL TECHNOLOGIES INC., ANNUAL REVENUE, 2012-2013 ($M) MICROSEMI CORP., ANNUAL REVENUE, 2012-2013 ($M) STMICROELECTRONICS, ANNUAL REVENUE, 2012-2013 ($M) TEXAS INSTRUMENTS INC., ANNUAL REVENUE, 2012-2013 ($M) XILINX INC., ANNUAL REVENUE, 2013-2014 ($M) MICROPAC ANNUAL REVENUE, 2011 – 2013 ($M) PEREGRINE SEMICONDUCTOR ANNUAL REVENUE, 2011 – 2013 ($M)

  12. 2 LIST OF FIGURES FIGURE 1. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT EDC MARKET FORECAST, BY COMPONENTS, 2014 – 2019 ($M) 17 FIGURE 2. COMPARATIVE GROWTH OF RADIATION HARDENED AND RADIATION TOLERANT EDC SEGMENTS, 2014 – 2019 ($M) 17 FIGURE 3. RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS - PATENT ANALYSIS, BY YEAR, 2011 - 2014 21 FIGURE 4. RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS - PATENT ANALYSIS, BY KEY PLAYERS, 2011 – 2014 (%) 21 FIGURE 5. RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS, PORTERS’ FIVE FORCES ANALYSIS 26 FIGURE 6. RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET - VALUE CHAIN ANALYSIS 29 FIGURE 7. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET SHARE, BY COMPONENTS, 2014 (%) 32 FIGURE 8. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET SHARE, BY MATERIAL, 2014 (%) 41 FIGURE 9. GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET REVENUE, BY MATERIAL, 2014-2019 ($M) 41 FIGURE 10.GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET SHARE, BY END- USER, 2014 (%) 45 FIGURE 11.GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS MARKET SHARE, BY GEOGRAPHY, 2014 (%) 56 82 83 84 86 86 87 87 91 92 95 95 99 100 103 FIGURE 12.PRODUCT LAUNCHES, BY YEAR, 2010 - 2014 FIGURE 13.PRODUCT LAUNCHES: MARKET SHARE, BY KEY PLAYERS 2013-2014 FIGURE 14.M&AS AND PRODUCT LAUNCHES, BY YEAR, 2010-2014 FIGURE 15.AEROFLEX INC. SALES BY MANUFACTURING DIVISION, 2013 (%) FIGURE 16.AEROFLEX INC.: SALES BY PRODUCT DIVISION-AMS, 2013 (%) FIGURE 17.AEROFLEX INC.: SALES BY PRODUCT DIVISION-ATS, 2013 (%) FIGURE 18.AEROFLEX INC.: SALES BY GEOGRAPHY, 2013 (%) FIGURE 19.ATMEL CORPORATION: SALES BY PRODUCT SEGMENTS, 2013 (%) FIGURE 20.ATMEL CORPORATION: SALES BY GEOGRAPHY, 2013 (%) FIGURE 21.BAE SYSTEMS: SALES BY PRODUCT SEGMENTS, 2013 (%) FIGURE 22.BAE SYSTEMS: SALES BY GEOGRAPHY, 2013 (%) FIGURE 23.CRANE CO.: SALES BY PRODUCT SEGMENTS, 2013 (%) FIGURE 24.CRANE CO.: SALES BY GEOGRAPHY, 2013 (%) FIGURE 25.HONEYWELL AEROSPACE: SALES BY END-USER, 2013 (%)

  13. FIGURE 26.INTERNATIONAL RECTIFIER CORP.: SALES BY PRODUCT SEGMENTS, 2013 (%) 106 FIGURE 27.INTERNATIONAL RECTIFIER CORP.: SALES BY GEOGRAPHY, 2013 (%) 106 FIGURE 28.INTERSIL CORP.: SALES BY PRODUCT SEGMENTS, 2013 (%) FIGURE 29.INTERSIL CORP.: SALES BY GEOGRAPHY, 2013 (%) FIGURE 30.LINEAR TECHNOLOGY CORPORATION: SALES BY END USERS, 2013 (%) 110 111 115 FIGURE 31.LINEAR TECHNOLOGY CORPORATION: SALES BY GEOGRAPHY, 2013 (%) 115 FIGURE 32.MAXWELL TECHNOLOGIES: SALES BY PRODUCT SEGMENTS, 2013 (%) 119 119 122 123 127 127 131 132 136 136 143 FIGURE 33.MAXWELL TECHNOLOGIES: SALES BY GEOGRAPHY, 2013 (%) FIGURE 34.MICROSEMI CORPORATION: SALES BY END-USERS, 2013 (%) FIGURE 35.MICROSEMI CORPORATION: SALES BY GEOGRAPHY, 2013 (%) FIGURE 36.STMICROELECTRONICS: SALES BY PRODUCT SEGMENTS, 2013 (%) FIGURE 37.STMICROELECTRONICS: SALES BY GEOGRAPHY, 2013 (%) FIGURE 38.TEXAS INSTRUMENTS: SALES BY PRODUCT SEGMENTS, 2013 (%) FIGURE 39.TEXAS INSTRUMENTS: SALES BY GEOGRAPHY, 2013 (%) FIGURE 40.XILINX INC. SALES BY END-USERS, 2013 (%) FIGURE 41.XILINX INC. SALES BY GEOGRAPHY, 2013 (%) FIGURE 42.PEREGRINE SEMICONDUCTORS: SALES BY GEOGRAPHY, 2013 (%)

  14. 3RAD-HARD AND RAD-TOL EDC- MARKET OVERVIEW Radiation hardening is the process of developing electronic components that continue to remain unaffected by damage caused by radiations which come across in high-altitude flights, around nuclear reactors, particle accelerators, during nuclear accidents or nuclear warfare or the space. On the other hand, radiation tolerant devices are which can operate efficiently when exposed to radiation only when certain precautions and mitigations are taken care of. This is however comparatively lesser protection from radiation as compared to radiation hardening. The report takes into account the global radiation hardened and radiation tolerant electronic devices and components market which has been divided into five segments: by products, by material, by product-type, by end-user and by geography. The radiation hardened and radiation tolerant components form a vital part of many applications, such as in space, military and defense and others. Hence, to check the efficiency of these components, these are put under various tests such as Total Ionizing Dose (TID), Enhanced Low Dose Rate Effects (ELDRS), neutron and proton displacement damage, and Single Event Effects (SEE, Single Event Transients (SET), Single Event Latchup (SEL) and SEB). A Single Event Upset (SEU) is a change of state caused by ions or electro-magnetic radiation striking a sensitive node in a micro-electronic device, such as in a microprocessor, semiconductor memory, or power transistors. The state change is a result of the free charge created by ionization in or close to an important node of a logic element, for instance, memory bit. A Single Event Transient (SET) is a voltage glitch caused by single event to propagate through the circuit in a digital or analog circuit. A Single Event Latch-up (SEL) is an abnormal high-current state in a device caused by the passage of a single energetic particle through sensitive regions of the device structure and resulting in the loss of device functionality. A Single Event Burnout (SEB) is another state of device failure that can be triggered by the passing of a heavy ion through a MOSFET when biased in its off state. The NEPP program is responsible for developing the plans and leading the research on reliability and radiation response in the space and aeronautics environments. They generate technical knowledge about reliability, test methods, application and supply chain quality within the context of NASA space flight missions and hardware. However, this information is provided to NASA through web pages, publications and links published on the website. The below table showcases the main testing facilities for product OEMs to conduct certification tests and also to improve or customize their offerings according to the customer requirements.

  15. TABLE 1.GLOBAL RADIATION HARDENED AND RADIATION TOLERANT ELECTRONIC DEVICES AND COMPONENTS RADIATION TESTING FACILITIES Radiation Test Facility Brookhaven National Labs Function The NASA Space Radiation Laboratory (NSRL) uses beams of heavy ions from the accelerators that feed RHIC to simulate space radiation and study its effects on biological specimens—such as cells, tissues, and DNA—and industrial materials. The laboratory was founded in 1931 as the Radiation Laboratory and conducts unclassified scientific research on behalf of the United States Department of Energy (DoE). It provides a fundamental understanding of nuclear properties along with contributing both insights and techniques to a number of related scientific disciplines, for example, astrophysics, elementary particle physics, atomic/molecular physics, and condensed- matter physics. The facility allows conducting research on radiation induced effects in electronics and devices. It not only enables experiments with realistic space proton environment but also provides mono-energetic beams for radiation hardness tests of materials. It is the nation’s largest nuclear science facility on a university campus. The lab’s scientists investigate the properties of rare isotopes and nuclear reactions. In nature, these reactions would take place in stars and exploding stellar environments such as novae and supernovae. It is a multidisciplinary facility that provides services and performs research in the fields of air quality monitoring, radiation's effects on electronics, proton radiation therapy for ocular cancer and chemical analysis. It was acquired via funding from the NASA Johnson Space Centre and offers proton beam that is ideal for space radiation effects research and other applications, such as military systems, particle physics, detector development, and materials science. Lawrence Berkley Labs Texas A&M Cyclotron Paul Scherrer Institute National Laboratory Superconducting Cyclotron Crocker Nuclear Laboratory Indiana University Cyclotron Laboratory

  16. 15APPENDIX 15.1ABBREVIATIONS Abbreviation ADC ASIC CMOS COTS DDD DoE EEPROM ELDRS FPGA FPN ISR NASA NSRL NVMRAM PMIC PROM RHBD SDRAM SEB SEE SEL SET SEU SiC SoI SOS SRAM TID Expanded Form Analog-to-Digital Converter Application Specific Integrated Circuits Complementary metal-oxide semiconductor Commercial Off-the-shelf Displacement Damage Dose Department of Energy Electrically Erasable Programmable Read-Only Memory( Enhanced Low Dose Rate Effects Field-Programmable Gate Array Fixed Pattern Noise Intelligence, Surveillance and Reconnaissance National Aeronautics and Space Administration NASA Space Radiation Laboratory Non-volatile Magneto-resistive Random Access Memory Power Management Integrated Circuits Programmable Read-Only Memory Rad Hard By Design Synchronous dynamic random access memory Single Event Burnout Single Event Effects Single Event Latchup Single Event Transients Single Event Upset Silicon Carbide Silicon on Insulator Silicon on Sapphire Static Random Access Memory Total Ionizing Dose 15.2

  17. 15.3SOURCES IndustryARC uses both the primary and secondary sources continuously and in equal measures during the report production process for an accurate and holistic data analysis. 1.Company financials, magazines, journals, press releases, paid databases and in-house data repository are used to calculate the market revenue numbers. 2.Annual reports, company websites, public databases, and In-house data repository is used to gather market revenue of companies, market share analysis, market dynamics and company profiles, SWOT analysis. 3.Primary sources are used to validate the market findings of IndustryARC analysts and also to get first-hand information on the market, product, and geographic growth prospects and also identify key trends. 4.NASA (Jet Propulsion Laboratory), Sandia National Laboratories, American institute of Physics, International Space Exploration Coordination Group (ISECG), CNES, DLR, ESA, ISRO, State Space Agency of Ukraine, UK Space Agency, ROSCOSMOS, JAXA, CSA ASC, Microsystems for Space Technologies Laboratory, are some of the key secondary sources used in our report research. 15.4RESEARCH METHODOLOGY IndustryARC uses the following approach to gather data and present the analysis in the report: The quantitative and qualitative data collected for the Rad-hard market report is from a combination of secondary and primary sources. Research interviews were conducted with senior executives and/or managers of leading Rad-hard equipment manufacturers and distributors. These Key Opinion Leaders (KOLs) were then provided a questionnaire to gather quantitative and qualitative inputs on their operations, performance, strategies and views on the overall market, including key developments and technology trends. Data from interviews is consolidated, checked for consistency and accuracy, and the final market numbers are again validated by experts. The global market was split by products, services and geography based on different factors like primary and secondary sources, understanding of the number of companies operating in each segment and also KOL insights. We have used various secondary sources such as directories, articles, white papers, newsletters, annual reports and paid databases such as OneSource, Hoovers and Factiva to identify and collect information for extensive technical and commercial study of the Rad- hard and rad-tolerant market. The key players in the market and its value chain were identified through secondary research and their market opinions were also gathered in a similar way through telephonic interviews and questionnaires. We have also studied the annual reports of these top market

  18. players. Interviews with key opinion leaders such as directors, managers, marketing personnel were used extensively in understanding the need and emergence of rad-hard and rad-tolerant market. 15.5EXPERT INSIGHTS Primary interviews with experts and various stakeholders in the value chain were conducted to understand and evaluate key data points as well as market trends in the global Rad-hard and radiation tolerant EDC market. Some of the key participants include: STMicroelectronics 3DPlus Activ Electronics Intersil Corp Micropac Protec GmbH Microsemi

  19. THE ARC ADVANTAGE An analytical model lies at the core of our process, ensuring logical consistency throughout our research. We complement the model with secondary data and interviews with industry experts to reflect the latest trends. With our final expert validation, we provide you with only the most accurate and actionable intelligence. THE ARC PROCESS Base Method Analytical Method Consolidation Method Delphi Verification 1. Granular breakdown of drivers into factors 2. Validate all factors in terms of their present impact on the market 3. Assign weights to these factors in terms of their relevance and impact on the market 4. Build the Analytical Model 1. Get a top- down estimate of the market 2. Follow it up with a bottom-up estimate of the market 3. Check forconsistency and new growth factors that are relevant over the next 10 Years 4. Build the Base model 1. Granular breakdown of drivers into factors 2. Validate all factors in terms of their present impact on the market. 3. Assign weights to these factors in terms of their relevance and impact on the market. 4. Build the Consolidated Model 1. Verify the findings of the model with experts from across the value chain 2. Verify the findings with players across small and large enterprises 3. Tweak the model and add new factors 4. Finalize the ARC Model ANALYTICAL MODEL BASE MODEL CONSOLIDATED MODEL ARC MODEL

  20. ABOUT US IndustryARC was started by a group of young, passionate professionals along with extensively experienced industry veterans across various business segments. Our focus and expertise is mainly in the field of analytics, market research and consulting. Our singular goal is to provide accurate and affordable research to our clients. Our research team has expertise in diverse fields like Automotive, Chemicals, Consumer Product & Services, Electronics, Food & Beverages, Healthcare etc., However diverse the expertise maybe, everyone in our team shares one common trait - we love data and we love providing solutions to clients using that data even more! Seeing your business flourish based on our solutions and strategy is what we love the most! IndustryARC publishes more than 30 reports on an annual basis in the mentioned Industries. Our reports are in-depth and high quality reports that can help decision makers frame better strategies for their business requirements. These reports can be further customized as per your needs. Disclaimer: • The reports sold by IndustryARC are limited publications containing valuable market information provided to a select group of customers in response to orders. • Our customers acknowledge and agree that any report bought from IndustryARC is for their own internal use and not for general publication or disclosure to third parties. • Our reports or part of the reports, information contained in the report, cannot be shared or resold to any other third party. • Disclosure to third parties, usage of data in a public document, article or blog by the customer can be done with prior permission taken from IndustryARC. For information regarding permissions and sales, contact: sales@industryarc.com | sanjay.matthews@industryarc.com

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