BEE2 Platform Update

1. BEE2 Platform Update Daniel Burke 23 June 06

2. Transitioning into RAMP… • Formal Board Support Package for BEE2/RAMP • Modeled on current Xilinx development package content • Current Status • BEE2 hardware, enclosure, OS, support • Initiate design of BEE3/RAMP2 platform • Early RAMP input • Scheduling issues

3. Completion Plan (3 month*) • TASKS • The minimum package will consist of: • Fully tested BEE2 board with required power supply and cable set • Stable Linux-based reference design (BSP) utilizing: • Control FPGA -One or more user FPGAs -All DIMMs on those FPGAs • One or more XAUI links • Freestanding operation, i.e. No networked rootfs; implies 2GB CF usage • Console access via USB keyboard and mouse, display on DVI • Target externally available, unmodified rootfs, probably Debian • Protective 2U enclosure • User guide documenting BIST, system operation, ref design, sample build of hardware and software, pre-built bitfiles and elfs, usage of scripts for DDR builds, etc. *as envisioned in March

4. Timeline • TIMELINE • Hardware: • BEE2 production is under the control of Ken, but I suggest the mid-point board delivery from SAE, in anticipation of some local testing. [Week 8, 8 May] • Cables are well understood; SAE could make those sets along with the boards. • The Vicor power supply needs to be evaluated, then reconfigured slightly to fit the case.  We potentially could have that tested in original form by two weeks after delivery, and remounted in another two weeks for the 2U case.  I don’t know the expected delivery date, so I will conservatively say [Week 3, 3 May] • Much of the reference design has been done by Andrew and Pierre, and is experiencing a thorough evaluation by the Red Team.  I suggest the mid-point for the finalized version [Week 11, 29 May] Making the unit freestanding requires USB keyboard and mouse, and console redirect to DVI, and mounting of a fairly full-featured rootfs on the CF.  This work can proceed in parallel with the ref design completion, and although is not strictly necessary (could continue with serial or export window), is under investigation by a UCB undergrad. [Week 11, 29 May] Merging the two is fairly trivial, and should be complete by [Week 12, 5 June] Thus, the full BSP target date is early June, which allows some slippage.

5. Timeline (cont’d) The 2U enclosure can be either a full-custom unit, or a slightly modified off-the-shelf unit.  If we can purchase a suitable box, fit our power supply, and design custom front and rear panels to provide sufficient airflow, this might be the fastest path. The first step is to obtain a generic 2U enclosure, and use it for fitting of the Vicor as well as airflow evaluation.  This has been done.After the dimensions are confirmed, the mechanical design of the power supply can be finalized, and the minor extrusion and mounting fixtures obtained; the existing unit can be reassembled and tested same as item 1.)  [Week 3, 3 April] The front panel design consists of three tasks: specifying the proper cut-outs for the CF, USB, and XAUIs;  determining airflow requirements, fitting fans, specifying holes; and finally, designing whatever control functions should be visible and creating a PCB/display for that utility.   This work will start after the GSRC review; each task can be allocated one week: [Weeks 1, 2, 3 ending 3 April] The rear panel will be a simplified version of the front, and can be specified in an additional week [Week 4, 10 April].   Production can take an additional 4 weeks [Week 13, 12 June]

6. Documentation User guide:Documenting the BIST is complete in rough form System operation description should proceed over the next 5 weeks [Week 6, 24 April], then be reviewed by Andrew and Pierre, and others. Reference design documentation should be derived from Andrew’s RAMP presentation with updated information from the Red Team experience, and reviewed around two weeks later [Week 8, 8 May] Sample builds of hardware and software will be in continuous evolution, and likely finalize around the end of May [Week 11, 29 May] Script usage should be prepared by Andrew and Pierre, around the third week in June [Week 12, 24 June] for independent review. The full document should be assembled and reviewed by all team members starting the latter part of May [Weeks 9-12, 12 June]

7. BEE2 Development Plan

8. BEE2 500W Power Supply Design BEE2 requires a substantial amount of power in a restricted form-factor. The design being prototyped is 475W (5V 80A, 12V 5.25A) with integral heatsink, cooling fans and plenum (not shown), line filtering and regulation, based upon very high density modular components.Depending upon requirements, potentially could upgrade to more 5V current, but must revisit thermal analysis.

9. 2U Enclosure Design Compromise between thermal density constraints and potential use in rack-based system. Highest practical airflow through 3.5” chassis, while still exposing all front and back connectors. Also incorporates front panel display, remote management board, and clock chains requested by SSL.

10. Thermal Analysis Characterized assuming 25C ambient and 15C max temp rise. Airflow conservatively meets requirements as well as LFM across DC-DC converters.

11. User Guide

12. Status • Board Inventory - 22 boards back from manufacturing, 10 are RAMP and undergoing checkout procedure. Board kit being assembled, consisting of correct DIMMs, CF preloaded with bootable Linux and diagnostics. 2U Enclosure – Rough enclosure for confirming airflow characteristics being prepared at IL, ship to Berkeley 30 June. Finalize CAM files for front/back panel following week; make beta chassis soon afterwards.Power Supply – Allocation parts expected first of second week of July; initial unit assembled and functional load tests mid-month; release design for manufacturing (lead times uncertain with some components).Integration – Depending upon manufacturing schedule, decision will be made regarding package assembly and delivery.