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CCTC Tech Roadmap Plant 1 and Plant 2 (HDI)

CCTC Tech Roadmap Plant 1 and Plant 2 (HDI). Surface Finishes Offered. ◆ HASL ◆ OSP ◆ ENIG ◆ Selective ENIG+OSP ◆ Flash Gold ◆ Gold contacts ◆ Immersion Tin ◆ Immersion Silver ◆ Lead Free HASL ◆ Carbon Print ◆ Peelable mask.

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CCTC Tech Roadmap Plant 1 and Plant 2 (HDI)

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  1. CCTC Tech RoadmapPlant 1 and Plant 2 (HDI)

  2. Surface Finishes Offered ◆ HASL ◆ OSP ◆ ENIG ◆ Selective ENIG+OSP ◆ Flash Gold ◆ Gold contacts ◆ Immersion Tin ◆ Immersion Silver ◆ Lead Free HASL ◆ Carbon Print ◆ Peelable mask

  3. Production flow chart of Conventional Product Inner layer dev. etch strip Inner layer punching Material Shearing Inner layer image Drilling Drilling X-Ray Lamination Brown Oxide Inner layer AOI De-burring De-smear Thru Hole Plating Panel Plating Outer layer Image Soldermask Contact Plating Outer layer AOI Alkaline Etching Pattern Plating HASL or LF HASL Legend Routing Electrical Test Final Inspection ENIG Immersion Silver Packaging Immersion Tin OSP

  4. CCTC Process Capability (Standard Technology-P1)

  5. STD Technology Roadmap 2011

  6. STD Technology Roadmap 2011

  7. STD Technology Roadmap 2011

  8. STD Technology Roadmap 2011

  9. STD Technology Roadmap 2011

  10. STD Technology Roadmap 2011 width length

  11. STD Technology Roadmap 2011

  12. Basic Property Comparison for Various Material According to our experiments on lead free material, the experience during the PCB manufacturing and also the feedback from our customers during their assembly, we compared the general property parameters of various lead free material. Please refer to below table:

  13. CCTC Process Capability (HDI Technology-P2)

  14. HDI Technology Roadmap 2011

  15. HDI Technology Roadmap 2011

  16. HDI Technology Roadmap 2011

  17. HDI Technology Roadmap 2011

  18. HDI Technology Roadmap 2011

  19. HDI Technology Roadmap 2011

  20. HDI Technology Roadmap 2011

  21. HDI Technology Roadmap 2011

  22. HDI Technology Roadmap 2011

  23. Thank You!

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