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Company Presentation – September 2012

Company Presentation – September 2012. Contents . Company Overview Enpirion Technology Enablers of High Density PowerSoC Featured Products Back-up Product Quality/Reliability Supply Chain Summary Key Contract Manufacturers Currently Supported

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Company Presentation – September 2012

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  1. Company Presentation – September 2012

  2. Contents • Company Overview • Enpirion Technology Enablers of High Density PowerSoC • Featured Products • Back-up • Product Quality/Reliability • Supply Chain Summary • Key Contract Manufacturers Currently Supported • PowerSoC Differentiation: Quantifying Ease of Design Proprietary and Confidential

  3. PowerSoC Highly Integrated Power System-On-Chip Target Markets Integrated: - Power FETs - PWM Controller - Compensation Circuit - Inductor Embedded/ Industrial Enterprise Telecom • <=15V DC-DC switching regulators • 300mA to 15A • standard product & ASSP • www.enpirion.com Storage/SSD Test & Measurement Optical Networking Hardware/Power Designer Challenges PowerSoC Benefits • Increasing # of power rails • More function in smaller form factors • Noise sensitivity & lower power budgets • Time-to-market Pressures; fewer resources • While improving Cost & Reliability! • High efficiency, smallest size • Excellent noise/transient performance • Simple, low risk power design • Highest reliability, fewest components Proprietary and Confidential

  4. Enpirion: Focused on “Power Done Right!” TheLeader of Integrated Power IC Solutionsdriving the miniaturization of DC-DC power systems The only semiconductor company with all key enabling analog power technologies Broad patent & IP portfolio - 45 issued + 25 pending Private fab-less semiconductor company since 2001 Our products lead the discrete-to-integrated transition in the multi-billion dollar power IC market Growing 7 times faster than the power IC market Our Power, Your Innovation Our power enables customers to maximize innovation without compromise. Smallest, coolest, fastest, easiest, most reliable integrated power IC solutions R&D Sales & Support Fabrication Test & Assembly Proprietary and Confidential

  5. Broad Market Demand for Uncompromised Power Enterprise Telecom Network Router Backhaul Server Optical Transport Storage Array Wireless Access Cloud Computing Increased density; uncompromised efficiency Smart Phones, IPTV, Tablets Increased density; uncompromised reliability Highest Power Density Combined with High Efficiency Low Thermals, Noise, Ripple Fast TTM Affordable Reliability Industrial Storage Solid State Drives Controllers Embedded Computing Automation & monitoring sophistication, many SKUs Increased density; uncompromised TTM & noise Memory capacity, I/O speed, & Reliability Increased density; uncompromised TTM Test & Measurement Proprietary & Confidential

  6. Target Markets & Our Value Proposition Proprietary and Confidential

  7. Key Enablers of High Density PowerSoC 3 Focused Technology Developments Delay Box DC-DC System Engineering Validation Stability Inductor Selection Controller & Compensation Design Production Testing Capacitor Selection Power Stage Analysis Time Domain Simulation Proprietary and Confidential

  8. Enpirion’s Power Technology Roadmap 2004-2010 2011 2012 2014 10V 0.25um CMOS w/ LDMOS (up to 20MHz ) 20V 0.18um CMOS w/ LDMOS (up to 15MHz ) Semiconductor Process 40V 0.18um LDMOS (up to 10MHz ) Magnetics Wire Wound Copper on Ferrite SMT Chip Open Bar Closed Bar Alloy on Silicon Copper on Alloy Hybrid Cores Inductor On Silicon Packaging Gen 1 Laminate Gen 2 Leadframe Gen 3 Stacked Gen 4 Clips Gen 5 Spiral Gen 6 Bumped Die RDL Gen 7 Monolithic Chip Scale Proprietary and Confidential

  9. Enpirion FET Technology = Efficiency + High Density 90% Line >90% Efficiency Vout= 1.8V Vout= 1.8V 12V, 0.18u LDMOS 6V, 0.25u LDMOS 6V, 0.25u LDMOS State of the art products built with industry’s fastest performing power FET technology Proprietary and Confidential

  10. Enpirion PowerSoC= Uncompromised Power Modules/PSiP Competitor A Competitor B Discrete Regulators Competitor C PowerSoC Enpirion 7x larger area 2x taller 96.5% @ Peak 4-6x larger area 2.5x taller 94% @ Peak 4-5x larger area 1.25x taller 92% @ Peak 75 mm2 1.85 mm height 94% @ Peak Highest Density without Compromising Performance, Reliability, Cost Proprietary and Confidential

  11. Enpirion PowerSoC  Uncompromised Power • Smallest Solution Footprint • 50 to 80% size reduction; very low profile • Increased Reliability; Lower Total Cost • Fully simulated/characterized/validated/production tested power system • >35,700 years MTBF (10x improvement); FIT 3.2 • True Industrial-rated; No de-rate, heat sink, airflow • Fewer components/Higher assembly yield • High Performance + Low Noise • Very High Efficiency: up to 97% • Low EMI & Conducted noise (10dB margin) • Up to 95% less ripple • Secondary filtering not required • Ease-of-use • Simple Design Flow; nearly 100% 1st pass success • 45% fewer Design steps • Significantly less exposure to design iteration • Fully-validated PCB files Proprietary and Confidential

  12. Featured Products Proprietary and Confidential

  13. Select Featured Products – 5V Proprietary and Confidential

  14. Select Featured Products – 12V Proprietary and Confidential

  15. Select Featured Products – Application Specific Note: Availability dates for yet to be released products subject to change. Proprietary and Confidential

  16. Features Solution complies with JEDEC for DDR2/3/4 Ultra high 96% peak efficiency Parallel up to 4 devices for 8A VTT load High reliability; 4.1 FITs; 28,200 years MTBF EV1320 High Efficiency 2A VTT Converter DDR Memory Termination | 16 | Specifications: • Sources/Sink up to 2A • VDDQ Input Voltage Range: 0.95V – 1.8V • Output Voltage = ½ VDDQ; tracks VDDQ • 40 mm2 total solution size | 16 | Proprietary and Confidential Proprietary and Confidential

  17. EV1320 Competitive Comparison: Uncompromised Power! Nearly 2x efficiency of a VTT LDO in a smaller footprint and =< cost Proprietary and Confidential

  18. EP5348UI Tiny 400mA DCDC • Specifications: • 400mA Minimum Output Current • Input Voltage Range: 2.4V – 5.5V • Output Voltage Range: 0.6V – (VIN-0.2V) • Output Voltage Programming • Tiny, 14-pin QFN Package • Solution Footprint: 20mm2 • Features: • 66mW/mm2 Solution Power Density • Compatible with Noise Sensitive RF • Over-current Protection • Thermal Protection: 150C/15C • Under-voltage Lock-Out 2mm x 1¾mm x 0.9 mm QFN Proprietary and Confidential

  19. EN5339QI 3A Low Profile DCDC • Specifications: • Input Voltage: 2.4V – 5.5V • Output Voltage: 0.8V – 3.3V • 3% accuracy over Line, Load, and Temp • VOUT Programming • 3A Continuous Output Current Solution Footprint: 60mm2 • Features: • Pin Compatible with EN5322QI • High Efficiency; 95% Peak • Very Low Ripple • Over-current Protection: 5A Typical • Thermal Protection: 155C/15C • Under-voltage Lock-Out • Enable and POK • 4 mm x 6 mm x 1.1 mm QFN Package Proprietary and Confidential

  20. EN6337(3A) / 47(4A) DC-DC w/ LLM • Specifications: • Input Voltage Range: 2.375V – 6.6V • Output Voltage Range: 0.75V – (VIN-0.5V) • 2% Output Accuracy (line, load, temp) • Minimum Output Current • 3A – EN6337QI (@2MHz) • 4A – EN6347QI (@3MHz) • Solution Footprint: 75 mm2 • Features: • 95% peak efficiency • Low Ripple • Over-current Protection • Under-voltage Lock-Out • Light Load Mode • Enable and POK • Directly interchangeable with EN5337QI • Sync to External Clock 4mm x 7mm x 1.85 mm QFN Proprietary and Confidential

  21. EN5367QI “Cost Optimized” 6A DCDC • Specifications: • Input Voltage Range: 2.5V – 5.5V • Output Voltage Range: 0.6V – (VIN-VDO) • 3% Output Accuracy (line, load, temp) • Resistor Divider VOUT Programming • 6A Minimum Output Current • Solution Footprint: 160mm2 • Features: • High efficiency up to 93% • Low Ripple • Excellent Transient Recovery • Programmable Soft start • Over-current Protection • Under-voltage Lock-Out • Enable and POK • Sync to External Clock 10mm x 5.5mm x 3.0 mm QFN Proprietary and Confidential

  22. Proprietary and Confidential

  23. EN2300 12V Product Family Overview Proprietary and Confidential

  24. EN2300 Family Features • Common Features • Integrated inductor, MOSFETs, Controller • Efficiency up to 94% • 2% Voltage Output Accuracy (line, load, temp) • Input Voltage Range: 4.5V – 14V • Resistor Divider Vout Programming • Operating temperature range: -40oC to 85oC without airflow/lead de-rating • Excellent total AC + DC regulation • Frequency Synchronization (External Clock) • Output Enable Pin and POK Signal • Programmable soft start • Protections: programmable over-current, UVLO, thermal • Scalability Features • EN2340 and EN2360 are pin compatible • EN23F0 may be paralleled – up to 4 devices, 60A (see next page) Proprietary and Confidential

  25. EN23F0 Parallel Operation Up to 4x 15A EN23F0 devices can be paralleled for high load applications Proprietary and Confidential

  26. EN2300 Competitive Comparison >2x Space Savings with Low Noise, Low Total Cost without compromising Efficiency, Ease of Design and Reliability Proprietary and Confidential

  27. Got Footprint, Performance, Reliability Challenges? DDR Non-Volatile DIMM PCIe RAID Controller + SSD ‘s PCIe Quad NIC Server Blade AV Receiver Atom PCIe server board PCIe Security Processor Enterprise SSD Notebook SSD Get Power Done Right - Enpirion PowerSoC! Intel Atom Module USB Cellular Data Card Embedded PC Module Digital Receiver USB3.0 SSD Compact PCI DSP Card Proprietary and Confidential

  28. Back-up

  29. Enpirion Power SoC has High Reliability • Enpirion fully characterizes the integrated inductor/regulator pair • This removes significant risk from the power supply design • Enpirion Power SoC undergoes IC level testing • FIT rate = 3.2 • @ 55 degrees C, 0.7eV activation energy, 60% confidence level, based on HTOL data collected to date • MTBF ~ 35,700 years (312.5M hours) Proprietary and Confidential

  30. Quality, Reliability & Environmental Management System • Enpirion deploys a Total Quality Management System • ISO 9001:2000 Certified • Sony Green Partners • Enpirion utilizes a proven fabless model with world-class global suppliers: • ISO 9001/ TS16949 Certified • ISO14001 Certified and RoHS Compliant • Sony Green Partners • Enpirion PowerSoCs maintain high reliability • System level performance with IC Level Reliability • Product design and qualification based on established industry standards & practices (JEDEC, JESD,…) • FIT rate = 3.2 (MTBF ≈ 35,700 years) • Long Term Reliability ensured by Manufacturing Process Controls and Long Term Reliability Monitoring • Enpirion Environmental Management System includes: • Follows ISO14001 Principles • Sony Green Partner Certified • RoHS (EU Directive 2002/96/EC) • WEEE (Directive 2202/96/EC) • Lead Free assembly compatible, 10sec/260°C reflow profile • JIG101 • PFOS/PFOA Ban (EU Directive 2006/122/EC) • Halogen Free (Bromine + Chlorine) • Sony SS-00259 Proprietary and Confidential

  31. Customer Quality Issues & Failure AnalysisFailure Mode Analysis Flow • Device Analysis Request Form • Problem Report Number Assigned Customer Request • Automated Tester • Manual Tester • Hot / Cold / THB Environmental Chambers • Visual Inspection • Component Supplier / Manufacturing Subcontractor • Failure Analysis and Corrective Action Failure Report Final Response < 15 days Receipt of Failure Failure Verification Initial Response < 2 days • Decapsulation • Cross Section / Delayering • Analytical (SEM, Auger, FIB etc.) • Optical Inspection • Active Circuit Probe Internal Analysis Non-destructive Testing • X-ray Radiography • C-SAM Analysis • Optical Inspection • Curve Trace Subcontracted Services Proprietary and Confidential

  32. IC Controller IC Controller Assembly Test CMOS Wafer Test Module Package Module Package 7 weeks 3 weeks 1 week 1 week 8 ” Wafers Korea Strategic Die Bank Strategic Inventory Finished Goods Inductors & Shipping Drop ship Japan/Taiwan Supply Chain Summary • Enpirion utilizes a Fabless semiconductor manufacturing model • Finished wafers are procured from wafer fabrication facilities in Korea • Final products are assembled, tested, and drop shipped from factories in Asia • Order entry, planning, scheduling, shipment release occur in the USA Malaysia, Taiwan, Thailand Malaysia, Taiwan, Thailand Malaysia, Taiwan, Thailand Lead Time 12 Weeks Proprietary and Confidential

  33. Key Contract Manufacturers Currently Supported • >75 CM/ODM relationships • Benchmark Electronics • Celestica • Flextronics • Foxconn Technology Group • Jabil Circuit • Plexus Corp. • Sanmina-SCI Corp. • Quanta • Zinwell Proprietary and Confidential

  34. Quantified Ease-of-Design Proprietary and Confidential

  35. Design Flow Comparison: 3 DC-DC Topologies Common Pre-Design Steps (6) Detailed Design Steps >18 Steps ~14 Steps ~6 steps Enpirion PowerSoC Design Flow (~12) DC-DC Regulator Design Flow (~20) Delay Traditional Discrete Design Flow (>24 steps) Enpirion PowerSoC= Faster Design Time & High Probability of 1st Pass Success Proprietary and Confidential

  36. Enpirion PowerSoC Simplied Design Steps At least 40% fewer steps (i.e. 8 less) Significantly (~1/3) lower exposureto design iteration Proprietary and Confidential

  37. Quantitative Comparison of PowerSoC vs. DC-DC Regulator Design Effort Source Darnell Group * Sized for 1 DC-DC power rail PwrSoC/PSiP reduces complexity & significantly improves time to market by 45%! Proprietary and Confidential

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