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Microelectronic Packaging Education for the 21 st Century

Microelectronic Packaging Education for the 21 st Century. Objective Develop new courses to be developed by Faculty to be shared globally to educate students and industry professionals Achieve By Collaboration between universities, government, professional society and industry Partners

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Microelectronic Packaging Education for the 21 st Century

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  1. Microelectronic Packaging Education for the 21st Century Objective • Develop new courses to be developed by Faculty to be shared globally to educate students and industry professionals Achieve By • Collaboration between universities, government, professional society and industry Partners • IEEE/CPMT and PRC/NSF

  2. Microelectronic Packaging Education for the 21st Century Funding Level: 1997 through 2000

  3. Microelectronic Packaging Education for the 21st Century

  4. Thin Film Substrate Virtual Laboratory (Gary May) • http://www.ece.gatech.edu/research/labs/vc/packaging OR http://cpmt.org Description • Course contents: clean room environment; process theory, steps and flow chart; interconnect design and testing • Provides: theory, lecture notes, video, graphics, familiarity with process techniques • Target group: undergraduate and graduate students, engineers new to the subject area Usage • Site is regularly used to accompany the lecture and lab portions of the senior level “Electronics Packaging Substrate Fabrication” course offered at GaTech. Status • Complete

  5. Signal Integrity(Jose Schutt-Aine) • http://natcsi.ece.uiuc.edu OR http://cpmt.org Description • Course contents:CAD tools on crosstalk simulation and lossy interconnect • Course provides: Simulation tools, taped lectures • Target group: Graduate students and engineers working in signal integrity Usage • Once the material is completed it can be used as an individual module to teach signal integrity concepts in system level packaging courses Status • Some sections are incomplete

  6. Thermal Management(Avi Bar-Cohen, Yogendra Joshi, Sushil Bhavnani) • http://www.me.umn.edu/courses/me5348/outline.html Description • Multi-institutional project - U of Minnesota, U. of Maryland and Auburn University • Course contents: conduction in PCBs and chip packages; convection cooling of PCBs and electronic systems; heat sinks; passive immersion cooling; failures and reliability; strain,stress and fatigue; thermoelectric cooling; heat pipes. • Course provides: lecture material, exercises, case study projects, lectures on CD • Target group: course is provided simultaneously at all three campuses during the spring semester to mostly graduate students and limited UG students. Usage & Status • Complete. The course material can be used as a semester long course or modules.

  7. Electrical Design(Bruce Kim) • http://cpmt.org Description • Course contents: interconnect modeling, embedded passives, simultaneous switching noise, CAD tools on crosstalk simulation and lossy interconnect • Target group: graduate students Status • Most sections of the web site is under construction

  8. PWB Virtual Laboratory(Zsolt Illyevalfi-Vitez) • http://www.ett.bme.hu/vlab OR http://cpmt.org Description • Course content: PWB technology; thin and thick film technology; laser technology; surface mount technology, computer integrated manufacturing technology • Course provides: Information on the available equipment in the lab, processes and results with animation and graphics • Target group: graduate students Usage • The site is used by the graduate students of the Technical University of Budapest Status • Apart from a few sites under construction most of the course is complete

  9. Cost-Based Design/Analysis(Peter Sandborn, Cynthia Murphy) • http://www.enme.umd.edu/ESCML Description • Course content: Lectures and on-line models for computing yields through various process steps. • Course provides: Web-based calculators, for student use; lectures for use by professors and students • Target group: graduate students Usage • The site is used by the graduate students of the University of Maryland Status • Several lectures now available; several calculators are open for others to use

  10. PCB Interconnects(NJ Rao) Status • Under construction

  11. Future Directions • Finish courses that are not completed to date • Initial product is CD-ROM, for some courses, convert into multi-media by Sync-O-Mat software and post on web. • Update the completed courses periodically • Add new courses in strategic areas • RF • Optoelectronics • Wafer level packaging • Integral passives • Reliability

  12. Strategic Course Topics

  13. Recommendations * PRC committed ** PRC willing to commit if CPMT does

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