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Automatic, Non-Contact Die Monitoring System

MICRON. MICRON. Automatic, Non-Contact Die Monitoring System. The Low Cost Solution For:. Misfeeds Slug detection Material Changes Stroke Deviation Mis-alignment between punch and die Broken punch or die assemblies. Micron base unit with 2 additional channels.

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Automatic, Non-Contact Die Monitoring System

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  1. MICRON MICRON Automatic, Non-Contact Die Monitoring System The Low Cost Solution For: • Misfeeds • Slug detection • Material Changes • Stroke Deviation • Mis-alignment between • punch and die • Broken punch or die • assemblies Micron base unit with 2 additional channels

  2. Micron is the most advanced monitoring system available to the stamping industry With precise accuracy to .00004 inches (1/1000 mm)

  3. Micron Detects Separation Gap to Within .00004 Inches

  4. Easy to use, limits are set automatically

  5. Each stack includes one channel of monitoring with high and low limits

  6. HMIC-R Sensor and target

  7. Specifications: 115VAC ±10% 30 watts 1 NO-NC, 250VAC 5A rating Less than 10 Msec Up to 2500 SPM To .00004 inches -10°C to 50°C ± 99 Microns Proximity 500 KHZ .1 inch (2.5mm) Base 8.25”w x 9.50”d x 3.25”h Stack 8.25”w x 9.50”d x 4.75”h Power requirements: Power consumption: Output contacts: Response time: Operating speed: Repeatability: Operating temperature: Alarm adjustment: Sensor type: Maximum sensing distance: Enclosure size:

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