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奇力新電子股份有限公司. 10/2014. 全球電感市場成長趨勢. Inductor 2012-2016 Global Demand Forecast. Passive components are essential components of any electric circuitry Demand for electronic devices drives demand for passive components
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奇力新電子股份有限公司 10/2014
全球電感市場成長趨勢 Inductor 2012-2016 Global Demand Forecast • Passive components are essential components of any electric circuitry • Demand for electronic devices drives demand for passive components • Smartphones, 4G base station, tablet, PCs, home appliance, automobile electronics, industrial, LED, lighting, healthcare equipment, IoT • Inductors is one of the three main sub-categories of passive components • Demand for inductors has been driven strongly by more sophisticated electronic devices requiring higher quantity and higher efficiency components Qty (M pcs) USD (M) Source: Paumanok Publications, Inc .
發展歷程 World-class Company A Local Ferrite Producer Business Expansion Major Domestic Player Established K $USD Acquired Belkin Int’l 120,000 Developed Molding and Thin-Film Technology Public listing on TWSE Formed strategic alliance with Yageo 100,000 Developed High- Frequency Chip Inductor Established U.S. office Developed SMD Power Inductor Revenue 80,000 Established China Henan plant Established ChinaSuZhou office Developed Wire- Wound and Multilayer Developed Mn-Zn and Iron Core Established Korea office 60,000 Expanded China DongGuan plant Established China DongGuan plant Established second plant Constructed Hukou new HQ and plant Company established 40,000 1972 1977 1990 1997 1998 1999 2000 2001 2002 2003 2005 2007 2009 2011 2014 Year
奇力新的成長 ($USD ’000) ($USD ’000) Source: Paumanok Publications, Inc . 5
市場位置 2013E Value: 2,345M USD 2013E Volume: 247B pcs • Product coverage: wire-wound, multilayer, and thin-film inductors for power and signal applications • Chilisin: #4 global position with 5.1% market share of estimated volume 246,965Mpcs • Chilisin: #6 global position with 3.6% market share of estimated value USD2,345M • Source:株式会社マーケティング・アイ(MAKETINKUAI CORP) http://www.m-eye.co.jp/
銷售市場與區域分布 2013 Sales By Application 2013 Sales By Region 7
主要客戶 PC / Systems Consumer Electronics Telecommunication OEMs / EMSs Automotive *Any trademarks or logos used throughout this presentation are the property of their respective owners, Chilisin does not claim ownership or distribution rights of the above logos
銷售與服務據點 Factory Suzhou, China Branch Office Suwon, Korea Factory Henan, China Chilisin HQ and Factory Hsinchu, Taiwan Branch Office San Jose, USA Powder Factory Touliu, Taiwan Factory Dongguan, China Manufacturing sites with sales offices Sales offices Distributors and agents
廠區分佈 Headquarter Hsinchu, Taiwan Est. 1972 Employee: 751 Factory Dongguan, China Est. 1997 Employee: 1,199 Factory Henan, China Est. 2010 Employee: 518 Factory Suzhou, China Est. 2001 Employee: 96 -----------------------------------All factories are ISO 9001 and TS 16949 certified ---------------------------------- Wire-Winding Molding Multi-layering Thin-film Through-hole Manufacture Site Finished Products Inventory
產品線 Wire-winding Molding Multi-layering Thin-film Process Power Inductor Chip Inductor Power Inductor Magnetic-resin Power Inductor Chip Inductor Power Inductor Ferrite Bead Power Inductor Chip Inductor Common-mode Choke New - Power Inductor Common Mode Choke • 2520~1608 size, t: 0.55mm • for handset & ultrabook • Up to GHZ band • Downsize from 0402 to 0201 • Baseband &RF application • Downsize from 0402 to 0201 • 0805,0504 package • for USB2.0, MIPI interface • SMD type • for notebook & tablet PC • DIP type • for motherboard • For RF application • 0201 size +/-0.1nH • Ferrite core for baseband application Size: 0402 • Ceramic core for RF application • Downsize from 0402 to 0201 • Wide range • for power solution • SMD Miniature type: 3225~1608 size, t: 0.6mm • for smartphone & tablet • for USB2.0/3.0/HDMI • 2016~3030 size • for mobile phone • 4040~5050 size • for tablet PC • 6060~8080 size • for TV/audio 11
RFQ Response 24hrs Delivery Response 48hrs Capacity Fully Support 100% Customer Satisfaction Technical Service Logistic VMI
Customer Design-in Circuit Simulation Technical Seminar R/L/C Engineering Support Material Research & Development Product Development
優良品質 • Best Supplier Award from New Kinpo (2010)(2013) • Best “Cooperate To Win” Award from Lenovo (2011) • Outstanding Supplier Award from SerNet (2011) • Best Supplier Award from Asus (2005)(2007) • Best Supplier Award from Solectron(2007) • Best Supplier Award from Zyxel (2006)(2007) • TS16949 Certification (Since 2005) • Samsung Eco-Partner Certificate (Since 2005) • ISO 14001 Certification (Since 2004) • Sony Green Partner Certificate (Since 2003)
競爭優勢與成長策略 • Competitive Products • Full range of magnetic series • Sufficient capacity support • Vertical integration from powder mixing to inductor manufacturing • World-class quality • Cost-competitiveness • Quick delivery and flexible logistic support • Value-added Service • Total solution provider for EMI, power and RF • Design-in capability • Professional engineering support • Material research & development • Concurrent product innovation 15 15