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XFP System and 10G Common Electrical Interface. Dong Zheng BitBlitz Communications Milpitas, California Dzheng@bitblitz.com . Agenda. XFP modules vs. others Host systems architectures Implementation examples. Box-to-Box: Optical Modules. 300 pin MSA Large on Board Footprint Cost: 20x
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XFP System and 10G Common Electrical Interface Dong ZhengBitBlitz Communications Milpitas, California Dzheng@bitblitz.com
Agenda • XFP modules vs. others • Host systems architectures • Implementation examples
Box-to-Box: Optical Modules 300 pin MSA Large on Board Footprint Cost: 20x x16 Mux I/F Xenpak Plug-able Cost: 4-6x XAUI I/F Xpak/X2 Plug-able Cost: 2x XAUI I/F REQUIREMENTS! Lower Cost Smaller Form Factor (Greater Line Card density) Lower Power XFP/SFP Plug-able Cost: 1x 10G Ser I/F
XFP vs. other modules Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere. Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere.
10GE Applications Host Module XGMII XAUI ASIC 3G SerDes 80 16 XENPAK, XPAK, X2 XFI ASIC XGMII 10G SerDes 3G SerDes XAUI 4 80 16 XFP Optical XFP philosophy: Minimal electrical circuits in module
10GE Electrical Interfaces XFP host design guide line: XFI 10G interface keeps short XAUI extends reach distance
10G CEI SR (XFI) • Rate from 9.95Gbps to 11.09Gbps for SONET, 10GE, 10GFC applications • Max recommend host PCB length <200mm, depending on geometry and material Near-end eye mask Far-end eye mask
Design Example Devices used: 10G SerDes: BBTX100 3G SerDes: BBT3420 Standard FR-4
Test Results Note: Far-end eye Near-end mask Potential driving optics directly
Summaries • XFP modules are lower power, smaller form factor, lower cost for higher line card density over competing solutions • 10G electrical interface is more challenging compared to XENPAK based modules • Reference system has demonstrated feasibility of the XFP host system, with significant margin on 10G electrical interface.