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MICROELECTRONICS ENGINEERING GROUP Contact: Assoc. Prof. Yasar Gurbuz

MICROELECTRONICS ENGINEERING GROUP Contact: Assoc. Prof. Yasar Gurbuz Faculty of Engineering & Natural Sciences Sabanci University Orhanli, 34956 Tuzla, Istanbul, Turkey Tel: +90 216- 483 9533 , Fax: +90 216- 483 9550 e-mail: yasar@sabanciuniv.edu. MAJOR AREAS OF RESEARCH.

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MICROELECTRONICS ENGINEERING GROUP Contact: Assoc. Prof. Yasar Gurbuz

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  1. MICROELECTRONICS ENGINEERING GROUP Contact: Assoc. Prof. Yasar Gurbuz Faculty of Engineering & Natural SciencesSabanci UniversityOrhanli, 34956 Tuzla, Istanbul, TurkeyTel: +90 216- 483 9533, Fax: +90 216- 483 9550e-mail: yasar@sabanciuniv.edu

  2. MAJOR AREAS OF RESEARCH Microelectromechanical Systems (MEMS):Modeling, simulation and fabrication of silicon micromachined mechanical systems; pressure, acceleration sensors, ultrasonic transducers, RF-MEMS; resonators, oscillators, filters. Integrated Circuits and VLSI Design and Technology:RF/Analog/Digital/Mixed Signal ICs, SoC ASIC Design, Hardware realization of dedicated DSP architectures, High Speed A/D, D/A Converters, Modeling and Simulation of Semiconductor Devices. Photonics and Optoelectronics: High Speed ElectroOptic Modulators, Chip-scale Photonic ICs, Wavelength Division Multiplexing(WDM) Fiber Optic Network Components, Quantum Dots, Quantum Cyptography, Optical Thin Film Coating and Fiber Optic Sensors. MICROELECTRONICS GROUP

  3. Ayhan BOZKURT • E-mail : abozkurt@sabanciuniv.eduPhone : +90 216 483 9537Fax : +90 216 483 9550 • Education • PhD. in Electrical and Electronics Eng., Bilkent University, Ankara, Turkey,1994-2000 • MSc. in Electrical and Electronics Eng., Bilkent University, Ankara, Turkey,1992-1994 • BSc. in Electrical and Electronics Eng., Bilkent University, Ankara, Turkey,1987-1992 • Research Interest • Acoustic Non-destructive Evaluation (NDE) • Modeling and Fabrication of Microelectromechanical Systems (MEMS) • Transducer Design for Ultrasonic Imaging • IC Design for Sensor Interfaces • Low-level Microprocessor/DSP Programming MICROELECTRONICS GROUP

  4. Cem ÖZTÜRK • E-mail : cemozturk@sabanciuniv.eduPhone : +90 216 483 9593Fax : +90 216 483 9550 • Education • PhD, Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA, 2002 • MSc, Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA, 1997 • BSc, Electrical and Electronics Engineering, Bogazici University, Istanbul, Turkey, 1995 • Work Experience • Sabanci University, Faculty of Engineering & Natural Sciences, Microelectronics Group (Sep 2003-present) • Assistant Research Engineer, Electrical and Computer Engineering Dept., University of California, Santa Barbara, CA, USA (Mar 2002- Aug 2003) • Research Assistant, Electrical and Computer Engineering Dept., University of California, Santa Barbara, CA, USA (Sep 1995- Mar 2002) • Research Interests • Photonics, Chip-scale Photonic Integrated Circuits, Optoelectronic filters and add/drop Mux/DeMux, WDM Fiber Optic Networks and Components, Ultra-high speed electrooptic and quantum well modulators, Semiconductor and hybrid integrated processing technologies. MICROELECTRONICS GROUP

  5. İlker HAMZAOĞLU • E-mail : hamzaoglu@sabanciuniv.eduPhone : +90 216 483 9577Fax : +90 216 483 9550 • Education • PhD, Computer Science, University of Illinois at Urbana-Champaign, IL, USA, 1999 • MSc, Computer Engineering, Bogazici University, Istanbul, Turkey, 1993 • BSc, Computer Engineering, Bogazici University, Istanbul, Turkey, 1991 • Work Experience • Faculty Member, Sabanci University, Faculty of Engineering & Natural Sciences, Microelectronics Group (Sep 2003-present) • Principle Staff Engineer (Dec 2002- Aug 2003), Senior Staff Engineer (Aug 1999- Dec 2002), Multimedia Architecture Lab, Motorola Labs, Schaumburg, IL, USA • Visiting Lecturer, Computer Science Dept., University of Illinois at Urbana-Champaign, IL, USA (Summer 1998, Summer 1999) • Teaching and Research Assistant, Computer Science Dept. and Electrical and Computer Engineering Dept., University of Illinois at Urbana-Champaign, IL, USA (Jan 1994- July 1999) • Research Interests • Embedded Systems (Hw/Sw) Design, Digital SoC ASIC Design, Computer-aided Design, Verification • and Testing for Digital SoC ASICs, Embedded Microprocessor Architectures, Parallel Processing. MICROELECTRONICS GROUP

  6. Meriç ÖZCAN • E-mail : meric@sabanciuniv.eduPhone : +90 216 483 9506Fax : +90 216 483 9550Education • PhD, Electrical Engineering, Stanford University, Stanford, CA, USA, 1991 • MSc, Electrical Engineering, Stanford University, Stanford, CA, USA, 1986 • BSc, Electrical Engineering, Middle East Technical University, Ankara, Turkey, 1984 • Work Experience • Sabanci University, Faculty of Engineering & Natural Sciences, Microelectronics Group (02-present) • K2 Optronics Inc., Director of Advanced Research, Sunnyvale, CA, (00-01) • NASA Ames Research Center, Research Scientist, Moffett Field, CA (91-00) • Stanford University, Research Assistant, Stanford, CA (84-91) • Research Interests • Analog and Digital Electronic Design, High Frequency Electronic Design, Optoelectronics, Fiber Optic Communication, Quantum Electronics, Quantum Computing, Quantum Cryptography. MICROELECTRONICS GROUP

  7. Yasar GÜRBÜZE-mail : yasar@sabanciuniv.eduPhone : +90 216 483 9533Fax : +90 216 483 9550Education • 1997 Ph. D., Electrical Engineering, Vanderbilt University, Nashville, TN • 1993 MSc, Electrical Engineering, Vanderbilt University, Nashville, TN • 1990 BSc, Electronics Engineering, Erciyes University, Kayseri - Turkey • Work Experience • 2000- Faculty Member, Sabanci University, FENS • 1999-2000 Project Manager, Aselsan Inc., MGEO, Ankara • 1997-1999 Senior Research Associate, Vanderbilt University • 1991-1997 Research / Teaching Assistant, Vanderbilt University • Research Interests • Microelectromechanical Systems (MEMS) • Analog and RF Integrated Circuits • Solid-State Sensors • Microelectronics Devices • Semiconductor Technology • Memberships:IEEE Solid-State Circuits Society, SPIE MICROELECTRONICS GROUP

  8. Chem/Bio Pressure Light Thermal Electrical etc. Idea Design/Simulation Mask Making (outsourcing) Sensors & Transducers LAB CAPABILITIES Patterning Cleaned Silicon Substrate Deposition/Sputter Etching (wet/dry) Wire Bonding Packaging Testing (Atmospheric Pressure) Testing (Sub-Atmospheric Environment) Vacuumed Cavity MICROELECTRONICS GROUP

  9. Design and Simulation Lab Software: Hardware: • SUN Workstations • 3x ULTRA-10 (1 GByte RAM) • 4x ULTRA-5 (512 MByte RAM) • 24x HP Pentium IV PCs • Europractice • Cadence / Synopsys • HSpice, Saber • MemsCap, MemCad, Ansys MICROELECTRONICS GROUP

  10. MICROELECTRONICS GROUP Class 1000 Clean Room • SPUTTER • Specs.: • Vacuum: 10-7 Torr • Temperature 350oC • RF Power (600W) , DC Power (500W) • 20 – 100kHz variable frequency pulse • 3 Gas inputs • Load Lock Chamber • Computer Controlled • Deposition Capability: • Metals • Oxides • Reactive coating • oxides & nitrides • MISC. FACILITIES • Microscope • Ultrasonic Cleaner • Balance • Hot Plate Stirrer • Small Capacity Furnace, 3 zone (1200oC) • RIE • Specs: • ICP, 1500W, 13.56MHz • RIE, 600W • 4 Gas Lines • 0.05-0.5mbar • End Point Detector • Etch Capabilities: • Oxide • Nitride • Semiconductor (Si. GaAs etc…) • Metals • MASK ALIGNER • Specs • Exposure Optics UV: 300nm • Automated delivery system • Variable Dose • Separate View Aligners • Capability • 1um resolution • WET BENCH • Class 100 Hood • Hot plate • Spinner • Ultrasonic Cleaner • Etch Basin • DI Water & dry air

  11. Test and Measurement Lab • IC Probe Station • Surface Profiler • Logic Analysis System • Semiconductor Parameter Analyzer • 500 MHz Infiniium Oscilloscope • 1 GHz Infiniium Oscilloscope • Spectrum Analyzer • Impedance Analyzer • RF Signal Generator • Sampling Oscilloscope • Arbitrary Waveform Generator • Pulse Generator MICROELECTRONICS GROUP

  12. SPONSORED RESEARCH EXAMPLES and WORKING ENVIRONMENT • TARGET, EU-6th Frame Work Project (2004-2008) (http://www.target-net.org): • European research in the field of microwave power amplifiers for broadband wireless access • (including RF-semiconductor technology, RF-IC, RF-MEMS, RF system architectures) • RF-MEMS for wireless appications: • Resonators, Filters and Oscillators • MINAEAST-NET, EU-6th Frame Work Project Project • (2004-2006), • http://www.minaeast.net • involving micro and nanotechnologies. • MEMS-Based Chemical Sensors and • Interface Electronics (Mixed-Signal IC) • (TUBITAK, 2001-2004) • High-Voltage Front-End IC Design CMUT • (TUBITAK, 2003-2005) Sensor Read-out CDR PLL • High-Voltage Front-End IC Design CMUT • MEMS-Based Chemical Sensors DC-DC Conv. Sensor Read-out IC & MEMS Design and simulation lab. Class-1000 Clean Room Test and Characterization (RF/microwave, small/large power and optical)

  13. IEEE 802.11a-b: • - Bit rate: 110 and 220Mb/s • - Power consumption: 100mW and 250mW • - Bandwidth ≥ 500MHz • - Number of channels: 5 • Total signal power: +20dBm • - Adjacent channel power ratio, • (ACPR) better than 30dBc at 500MHz bandwidth • PAE PA unit: better than 40% • Reference PLL from 3.35GHz to 10.35GHz, step 250MHz • - MEMS based pass-band filter: 3.1-10.6GHz, roll-off selectivity 20dB/500MHz.

  14. MOSFET structure E Source Gate B B Drain C C High Electron Mobility Transistor HeterostructureBipolarTransistor

  15. PLL / VCO MOSFET structure E Source Gate B B Power Amplifer Drain C C Mixer LNA RF Devices High Electron Mobility Transistor HeterostructureBipolarTransistor RF ICs TRx – RF System MICROELECTRONICS GROUP

  16. RF MEMS for TRx Resonators VC-Capacitors Switches Filters Inductors MICROELECTRONICS GROUP

  17. RF Integrated Circuits and MEMS for TRx PLL / VCO Power Amplifer Mixer LNA MICROELECTRONICS GROUP

  18. Project Objectives • MINAEAST-NET is intended to be a tool for achieving a better integration of eight ACCs (Romania, Hungary, Poland, Slovenia, Slovakia, Lithuania, Bulgaria and Turkey), in projects for FP6 on Micro and Nano Technologies. • MINAEAST-NET will be established as the premier source of information about resources and results in MNT from ACCs and about the strong points of the ACC organisations. • Organisations and companies from MS (and world-wide) that are looking for partners in MNT for any kind of projects, should address their needs to MINAEAST-NET and MINAEAST-NET will definitely find the best partner suited for them. • For all MNT interested organisations from ACC, MINAEAST-NET will be the main source of MNT specific project and partnership information: MNT related information about EC calls, international networking activities, partnership search from abroad. • MINAEAST-NET will support interaction between ACC and MS organisations to initiate FP6 proposals through organising meetings, workshops and support travel cost. • MINAEAST-NET will also be the little helper with any questions concerning proposal set-up and regulations for ACC organisations all that especially for MNT. Micro and Nanotechnologies going Eastern Europe through Networking INCO-CT-2004-510470 Acad. Dan Dascalu, Project coordinator Email: dascalu@imt.ro www.imt.ro Turkey contact point: Yasar Gurbuz, Sabanci University www.sabanciuniv.edu Email: yasar@sabanciuniv.edu

  19. Micromachined Chemical Gas Sensor and Signal ReadOut Integrated Circuitry Material characterisation Electrical characterisation Micromachined Gas Sensor Sensor Read-out IC Back-side etched Sensors Sensors Close-up view

  20. MEMS for Ultrasonic Imaging Capacitive Micromachined Ultrasonic Transducer (CMUT) Annular Array used in IVUS Imaging Ultrasound Generation Echo Detection MICROELECTRONICS GROUP

  21. MEMS for Ultrasonic Imaging High-Voltage Front-End IC Design CMUT MICROELECTRONICS GROUP

  22. Pending Projects • Micro and NanoTechnologies for Automotive Applications - EU 6th FrameWork • Sensors / MEMS and IC / VLSI Systems • Protein microchip design; cardiovascular risk assessment platform– DPT / TÜBİTAK MICROELECTRONICS GROUP

  23. Ultra Wide Band (UWB) Wall Penetrating Radar • Ultra wideband technology has its origins in the development of time domain (impulse response) techniques for the characterization of linear, time invariant microwave structures. • A short pulse in time has a large bandwidth in frequency domain hence it is called ultra wide band waveform. • UWB radar also uses radiated and reflected electromagnetic waves to detect, locate and identify targets. • The advantage of using UWB waveforms for radar include better spatial resolution, detectable materials penetration, easier target information recovery from reflected signals and lower probability of interference than with the narrowband signals. • Here we are developing a hand held behind the wall moving object/persons detector for intelligence and surveillance. Same system can also be used for people detection under the ruins after an earthquake for example…. MICROELECTRONICS GROUP

  24. Ultra Wide Band (UWB) Wall Penetrating Radar Block Diagram of the system currently under development: Transmitter Code Generator Programmable Time Delay Pulse Generator I Adjustable Delay Pulse Generator II Clock Oscillator Pulse length <1ns Energy concentrated in 2-6GHz band Average Power < 10uW Receiver Correlator Baseband SignalProcessing S/H Integrator Multiplier MICROELECTRONICS GROUP

  25. Hybrid Tunable Wavelength Division Multiplexed(WDM) Filter (MOST Research Center funded by DARPA @ UCSB) • Low loss and low cost due to fiber matched • Polymer waveguide, fast tuning through GaAs • electrooptic effect (nanosec.s) • Fast thermoelectric control (microsec.s) • Arbitrary filter spectra and multiwavelength • operatiom easily achiavable. MICROELECTRONICS GROUP

  26. Active WG Structure Passive WG Structure 1.9 mm 1.9 mm 2265 A Common WG Core InP-and GaAs-based Optical Microresonator Devices (CSWDM Research Center funded by DARPA @ UCSB) MICROELECTRONICS GROUP

  27. Digital SoC ASIC Examples Personal Digital Assistants (Application Processors and Hardware Accelerators) Digital Cameras/Camcorders (Image/Video Processing/Compression Systems) Cellular Phones (Baseband Processors, Application Processors and Hardware Accelerators) Entertainment Devices (Game Station (Graphics Processors), MP3 Player (Audio Processors), Set-Top Box (Video Processing, Security)) Storage Devices (Hard Disk Controllers, RAID Controllers) Biometric Devices (Image Processing, Cryptography) Networking Devices (Switches, Routers) Automobiles (Engine Control, Lane Departure Warning Systems) MICROELECTRONICS GROUP

  28. H.264 / MPEG4 Part 10 Video Compression Standard • The latest video compression standard • Performs 50% better than the next best standard • Standardized by both ISO and ITU • • Targets a broad range of applications, e.g. wireless • video, digital TV, video-on-demand, DVD • The improved quality of H.264 requires intense • computational power making it a very exciting • challenge for real-time implementation ! MICROELECTRONICS GROUP

  29. Transform Current Frame (Fn) Quant CAVLC Motion Estimation Reference Frame(s)(F'n-1) Mode Decision Intra Prediction Reconstructed Frame (F'n) Deblocking Filter Inverse Transform Inverse Quant H.264 / MPEG4 Part 10 Encoder • Designed and Implemented Modules • Forward Transform and Quant, Inverse Transform and Quant, CAVLC • Module Implementations in Progress • Motion Estimation, Intra Prediction, Deblocking Filter, Mode Decision MICROELECTRONICS GROUP

  30. Arm Processor and Xilinx FPGA based Prototype Platform Xilinx FPGA Board Xilinx Virtex II FPGA Arm Processor • Motherboard MICROELECTRONICS GROUP

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