1 / 34

Taiwan Semiconductor Manufacturing Company, Ltd.

Taiwan Semiconductor Manufacturing Company, Ltd. The Creator and Leader of the Foundry Industry. TSMC Introduction Market Overview Technology Leadership Capacity Leadership Services Leadership. Introduction to TSMC -. TSMC Is The Creator And Leader of the IC Foundry Industry

ata
Download Presentation

Taiwan Semiconductor Manufacturing Company, Ltd.

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Taiwan Semiconductor Manufacturing Company, Ltd. The Creator and Leader of the Foundry Industry

  2. TSMC Introduction Market Overview Technology Leadership Capacity Leadership Services Leadership Introduction to TSMC -

  3. TSMC Is The Creator And Leader of the IC Foundry Industry We are committed to leadership in capacity, technology and service Founded in 1987 Taiwan Semiconductor Manufacturing Company, Ltd. “Our vision is to be the most reputable, service-oriented maximum-total-benefits silicon foundry in the world, thereby earning the reward of also being the largest and most profitable foundry. To this end, we maintain a consistent focus on our foundry business, concentrating our commitment to being our customers’ “Virtual Fab”. Dr. Morris ChangChairman

  4. TSMC Employee Growth

  5. TSMC Revenue NT $ M Year 2000 : NT$166.2 Bn 4Q: NT$53.8 Bn 4Q 3Q 2Q 1Q 1992-2000(F) CAGR = 50%

  6. Foundry Market Demand B US$ M 8” eq. Wafers Foundry Market Foundry Wafer 35 30 25 20 15 10 5 35 30 25 20 15 10 5 1999 2000 2001 2002 2003 2004 Source: Dataquest, TSMC

  7. TSMC: The Market Share Leader By Revenue (WW Foundry Industry,2000) ~ U.S. $13.7 Billion Foundry10-15% Others 5% TSMC39% IDM Foundry20% Anam 3% Chartered 8% IDM Captive85-90% UMC24% Source: IC Insights, TSMC

  8. TSMC Leadership in Communications Normalized to TSMC wafer shipment excluding memory 1 0 1 56% 26% TSMC Competitor 2 Competitor 1 Source: Company News, TSMC 2001/Q1

  9. Sales by Market Segment % of Sales System Co. IDM Fabless 80% 60% 40% 20% 0% 1998 1999 1Q’ 00 2Q’ 00 3Q’ 00 4Q’ 00 2000 Net Sales 50.2 73.1 28.3 31.8 47.5 53.9 166.2 (NT$Bn) Pre-merger)

  10. Sales by Application Based on Quantity Sold at 8”equivalent 4Q’00 1,001K 2000 3,408K 3Q’00 942K Communications Others Memory Consumer Computer Based on Quantity Sold at 8”equivalent

  11. TSMC Leads in VDSM (0.25um & below) Wafer Shipment in 2000 Normalized to TSMC Wafer shipment Source: Company News, TSMC

  12. Industry’s Leading Portfolio of Process Technologies Logic Processes to 0.13um Embedded Non-Volatile Memory to 0.18um Mixed Signal & RF Processes High Voltage Processes to 0.25um Image Sensor Technology to 0.35um Embedded DRAM to 0.25um Copper and Low-K Dielectric Processes TSMC Is the Technology Leader

  13. CAGR 54% TSMC: The R&D Investment Leader NT $ M R&D R&D expense between 1992 and 1997 have not been restated under the current definition

  14. TSMC Roadmap Leading Foundry vs. SIA Roadmap Minimum Feature Size of Production 1 0.5 0.4 0.3 0.2 0.1 TSMC SIA Roadmap ’95 ’96 ’97 ’98 ’99 ’00 ’01 ’02 ’03

  15. Excellent yield (lot average>92%) demonstrated for 4Mb 6T SRAM vehicle More than a dozen customer tape-outs (LV,G,LP) First in offering 0.13um CyberShuttle (Nov.00) 5 customers received functional devices in 1st silicon (CPU,communications & FPGA) First in starting 0.13um risk production (multiple customer products-WIP greater than 3,000 wafers) Deploying 0.13um manufacturing to 2 fabs in 2001,and to 6 fabs in 2002 (incl. 300 fabs) with ample capacity to meet customer demand 0.13um Technology Leadership

  16. TSMC Logic Technology Features(Front End) 0.35 um 0.25 um 0.18 um 0.15 um 0.13 um Technology CL035 CL025 CL018 CL015 CL013 Risk Production Nov., 1996 Jan., 1998 Q1, 1999 Q1, 2000 Q4, 2000* # of metal layers 4 5 6 7 8 Core Voltage 3.3V 2.5V 1.8V 1.2V 1.0V I/O Voltage 3.3, 5V 2.5, 3.3, 5V 1.8, 3.3V 1.2V, 3.3V 1.0V, 2.5V Lithography I-Line DUV-stepper DUV-Scanner DUV-Scanner ArF PSM No No Yes Yes Yes Well formation Diffused well R well SSR SSR SSR Isolation LOCOS STI STI STI STI Gate oxide thickness 70A 50A 32A 20A 17A Gate delay ( ps/gate ) 61 38 28.6 20 14 * For CL013G

  17. Technology TSMC Logic Technology Features(Back End) 0.35 um 0.25 um 0.18 um 0.15 um 0.13 um CL035 CL025 CL018 CL015 CL013 Nov., 1996 Jan., 1998 Q1, 1999 Q1, 2000 Q4, 2000 Risk Production 4 5 6 7 8 # of metal layers TiSi2 TiSi2 CoSi2 CoSi2 CoSi2 Silicide Undoped Ox Undoped Ox low K <= 3.7 low K <= 3.6 low K <= 2.9~3.6 Inter Metal Dielectric W E.B. W CMP W CMP / Cu W CMP / Cu Cu Via Fill AlCu AlCu AlCu/Cu AlCu/Cu Cu Metal Scheme 15.25 um2 7.56 um2 4.65 um2 3.42 um2 2.43 um2 Emb 6T SRAM cell

  18. 12,000 11,000 10,000 9,000 8,000 7,000 6,000 5,000 4,000 3,000 2,000 1,000 TSMC Industry Leading Capacity (by Fab) 12” Fab Fab23 Unit: K pcs, 8" Equivalent Wafer Actual Output Installed Plan Fab22 11,460 Fab21 Fab20 Fab19 Fab18 9,166 Fab17 Fab16 Fab15 7,329 Fab14 Fab12 5,873 300PL SSMC 8” Fab 4,520 WT VIS Fab8 3,409 Fab7 Fab6 1,838 Fab5 Fab4 1,212 1,206 844 Fab3 680 528 374 6” Fab 228 163 99 Fab2 Fab1 ’90 ’92 ’94 ’96 ’98 ’00 ’02 ’04 Note : Fab-1/2 : 6" Wafer Fab-3/4/5/6/7/8/VIS/WT/SSMC: 8" Wafer 2000-2005 Installed Capacity Plan Fab12~23 and 300PL: 12" Wafer 1990-1999 Actual Output,

  19. In 2001 TSMC will continue to be the foundry industry’s largest manufacturer of wafers TSMC Is The Capacity Leader The company has one 300mm pilot line running and three full scale 300mm fabs under construction But leadership is more than planned capacity Flexibility Timely expansion Consistency across fabs

  20. 12,000 11,000 10,000 9,000 8,000 7,000 6,000 5,000 4,000 3,000 2,000 1,000 TSMC Industry Leading Capacity Plan (by Technology) =0.07um Unit: K pcs, 8" Equivalent Wafer Actual Output Installed Plan 11,460 =0.10um =0.13um 9,166 =0.15um =0.18um 7,329 <=0.25um 5,873 <=0.35um 4,520 <=0.5um 3,409 0.6um 1,838 0.8um 1,212 1,206 >=1.0um 844 680 528 374 228 163 99 >=2.0um ’90 ’91 ’92 ’93 ’94 ’95 ’96 ’97 ’98 ’99 ’00 ’01 ’02 ’03 ’04 ’05

  21. Capacity by Fabs TSMC & Affiliates (8” equiv, k) Installed Capacity:Annual (Monthly) FAB 1998 1999 2000 (19.6) FAB-1 (21.2) 252.0 (17.1) 233.0 205.0 FAB-2 (79.0) 943.0 936.0 (79.0) (77.5) 940.0 FAB-3 (41.0) 524.0 (45.0) 478.0 455.0 (39.0) FAB-4 348.0 426.0 (31.0) (36.0) (31.0) 353.0 116.0 (13.0) 222.0 (28.0) 417.0 (39.0) FAB-5 0.0 158.0 (32.0) 0.0 FAB-6 FAB-7A 26.0 (10.0) 366.0 (44.0) 0.0 0.0 0.0 0.0 FAB-7B FAB-8A 0.0 334.0 (31.0) 0.0 0.0 0.0 FAB-8B 77.0 (17.0) 154.0 (20.3) WaferTech 282.0 (28.0) 26.0 (8.0) SSMC 0.4 (0.4) (9.0) VIS 30.0 (22.0) 184.0 Total Installed Capacity 1,644 Total Installed Capacity 1,895 3,409 Annual Growth Rate Annual Growth Rate 80% 38% 15%

  22. TSMC Emerging As Capacity Leader Year 2001 Year 2000 3.4M(4.3%) TSMC ▲4.5M(5.2%) 5.1M(6.5%) Hyundai ▲5.4M(6.1%) 3.7M(4.7%) Intel ▲4.5M(5.1%) 4.1M(5.3%) Toshiba ▲4.3M(4.9%) 3.9M(5.0%) Samsung ▲4.3M(4.8%) 3.8M(4.8%) NEC ▲4.0M(4.6%) 3.7M(4.7%) Hitachi ▲3.8M(4.3%) 2.5M(3.2%) STM ▲3.4M(3.9%) 3.1M(4.0%) Philips ▲3.1M(3.6%) 2.4M(3.0%) UMC ▲2.8M(3.2%) 2.5M(3.1%) Motorola ▲2.7M(3.0%) 15.2M(19.3%) Others 16M((▼ 18.1%) WW Total 79M Wafers (8”eq.) WW Total 88M Wafers (8”eq.) Source: Semico, SICAS, Dataquest, TSMC

  23. The Industry’s Leading Design Service Alliance The Industry’s Leading Prototype Service, CyberShuttle The Industry’s Award Winning Quality Assurance Program The Industry’s Leading Mask Making Service Turnkey Assembly and Test Services The Industry Leader in Internet Services via eFoundry Suite TSMC Is The Foundry IndustryService Leader

  24. TSMC Design Services 3rd Party Alliances TSMC Services Design Service Portal IC Design Alliances Implementation Service EDA Alliances Reference Flow Library, Embedded Memory Service Library / IP Alliances Technology Files, Design Kits EDA Alliances Prototype Verification Service Pure Foundry Service Fab 11 Fab 7 Fab 3 Fab 4 Fab 5 Fab 6 Wafer Tech Fab 1 Fab 2 …………………. your Virtual Fab - Technology, Capacity, Service

  25. eFoundry™ Suite Close Collaboration in Design, Engineering and Logistics Logistics Collaboration Logistics Collaboration Engineering Collaboration Engineering Collaboration TSMC-Online Design Collaboration TSMC-Direct eFoundry™Suite TSMC- eJobView Engineering Collaboration TSMC- YES Design Collaboration TSMC- Internet Layout Viewer Design Collaboration

  26. E-Commerce center for logistics, engineering and design collaboration eFoundry™ --- Your Virtual Fab TSMC-Online TSMC-Direct System-to-system integration for collaborative planning and engineering data sharing TSMC-YES Collaborative yield enhancement effort between customers and TSMC engineering community TSMC-Internet Layout Viewer Web-based pre-tapeout design layout review between TSMC and customers TSMC-eJobView Web-based post-tapeout mask data inspection between TSMC and customers

  27. Reduced prototyping costs by as much as 10-fold. Shorter prototyping time through expedited lot processing. In-house backend ceramic packaging and bare die dicing service available per customers’ request. CyberShuttle Service Broad spectrum of leading edge technologies with frequent launches: 0.25um down to 0.13um technology and derivatives such as RF, mixed-signal, and embedded-flash technologies. Frequent launches and dependable schedule announced in advance. Fast prototyping and shared cost :

  28. TSMC Quality Policy TSMC will strive to provide superior semiconductormanufacturing services for worldwide customers and establish mutually beneficial, long-term partnership. TSMC will spread the dedication to quality throughout every facet of the company and achieve a culture of continual improvement to assure customer satisfaction. There is only one ultimate goal: Zero defect - in everything we do. TSMC will adopt expedient containment programs to shield our customer from any insufficiency until each has been permanently corrected. We are responsible for and to each other regarding this goal.

  29. Reliability Assurance Build in Reliability All new technologies are developed according to “TSMC technology development methodology” which includes manufacturability verification (Cp/Cpk study), T0 pre-qualification plan and T1 qualification plan. Process Qualification All new technologies will be qualified prior to the mass production. Process Monitor Every released mature process will be monitored and reported on monthly basis to ensure TSMC wafers quality and reliability. Continuous improvement activities will be conducted as well. Technology Support Consult and support on reliability related design and application issue.

  30. Customer Satisfaction Advisory Board Failure Analysis Supplier Quality Assistance Statistical Process Control Customer Feedback LAB Quality and Reliability Overview Technology Development Customer Satisfaction Product Quality Gating Manufacturing Process Reliability Monitor Product Reliability Monitor Build In Reliability Technology Release Qualification Incoming Quality Control In-Process Quality Control Outgoing Quality Assurance Backend Quality Assurance Customer Satisfaction Measurement Program Customer Corrective Action Response Total Quality Management

  31. Assembly & Test Services Strategy Develop and integrate leading edge and cost effective wafer, test and assembly technologies. Provide a seamless communication and data link throughout the entire assembly and test operation. Continuous quality and service improvement through internal monitoring and sound supplier management methodology.

  32. Assembly & Test Customer Benefits Quality & Engineering Advanced manufacturing services include mask making, wafer sort, assembly, and final test TSMC extends QRA / test engineering / product engineering support to cover assembly and final test Responsible for yield improvement and failure analysis A single contact for engineering, quality, and reliability issues Service Single point responsibility from order to unit shipment Complete WIP visibility throughout the entire process Competitive cycle times from wafer start to unit ship Proven drop ship system through fab, sort, assembly, and final test Cost Competitive pricing Reduced inventory cost

  33. Assembly & Test Capabilities Assembly Alliance with leading assembly houses Mainstream and high-performance IC packaging Reliability Qual Capability Test Digital, Mixed Signal, and Memory Test In-House Wafer Sort and Probe Card Making and Maintenance Alliance with Leading Test Subcontractors for Final Test Services Test Program Correlation and Conversion

  34. Taiwan Semiconductor Manufacturing Companywww.tsmc.com

More Related