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Interoperability Beyond Design

Interoperability Beyond Design. Sharing Knowledge between Design and Manufacturing Don Cottrell VP Emerging Technologies Si2 Corporation Thomas J. Grebinski SEMI Data Path Task Force Chair SEMI Universal Data Model Working Group Chair. Data-centric IC Designs.

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Interoperability Beyond Design

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  1. Interoperability Beyond Design Sharing Knowledge between Design and Manufacturing Don Cottrell VP Emerging Technologies Si2 Corporation Thomas J. Grebinski SEMI Data Path Task Force Chair SEMI Universal Data Model Working Group Chair

  2. Data-centric IC Designs • The IC design community is becoming more data centric. • Overcoming the issues of interoperational efficiencies. • Common data structures for the entire IC design data flow. • Open data structure standards • OpenAccess and Si2 • Open-source applications program interface. • Open-source reference data base for all IC design data. • Free license for anyone to use and redistribute.. • The realization of common expectations • within an increasingly complex, more intimately connected and data-intensive design data flow.

  3. Open-source Reference Data Base and API • OpenAccess Coalition and Si2 • Click-thru internal use license • Free access to API specification • Free access to reference database binaries • Signed internal use and distribution license • Free access to reference database source • Royalty-free redistribution rights (binaries only) • Rights to distribute modifications to the reference database (binaries only) that do not alter the API

  4. OpenAcess Design Data Base and API Commercial EDA Tools University Research Internal Proprietary Tools External Design Partners Standard API The realization of common expectations . Reference Database Cores/Cells Gates Transistors Physical Layout OASIS (planned)/GDSII

  5. Wide range of Functionality • Translators • GDS2 • OASIS (planned) • LEF • DEF • Verilog (planned) • SPEF (planned) • SPICE (planned) • Design Database • Chips / Blocks / Cells • RTL to Silicon • Digital / Analog • Automated / Custom • Logical / Physical • Batch / Interactive • Library Database • Design organization • Design management • Access control • Technology Database • Foundry Rules • Design Constraints

  6. Opaque View Beyond IC Design • The data view beyond IC design is opaque after GDSII and OASIS. • Design intent is not conserved beyond GDSII and OASIS. • GDSII and OASIS are a geometric encapsulation of the design. • SEMI P10 and text files fed downstream are another encapsulation (interpretation) of the design intent. • The basic design data structure has changed substantially and thus, the design and mask engineering view up and downstream is not immediately accessible and also not clear (unambiguous). • Different data structures between design and mask manufacturing centers. • Obscures the up and downstream view further. • Need to convert to standard record structures for mask manufacturing.

  7. IC Design Data Encapsulation for Mask Manufacturing Conversion to standard record types SEMI P10 Text Files Physical Layout Internet File Transfers Cells, Cores, Gates, Transistors Design Data Base Mask Technical Planning Data Base OASIS GDSII Geometric Shapes OASIS/GDSII

  8. Mask Data Preparation and Storage MIC, MEBES, Toshiba Hitachi, JEOL, KLA, etc. Data Fracture Tonality, Mirroring Data Finishing Sizing, Biasing, Mask Layout Layer Extractions, Scaling, Shrinking Frame generation, bar coding, test structures Mask Technical planning Data Base OASIS/GDSII Mask Layout Data Data Preparation

  9. Machine-specific Data Flow Pattern Generation MIC, MEBES, Toshiba Hitachi, JEOL, KLA, etc. Job Queue Data base Mask Technical planning Data Base OASIS/GDSII Mask Layout Data Mask Inspection Mask Critical Dimensions

  10. Data Flow and Transformation in a Mask Writer Rendering Rendering Extraction CFRAC Writer Job Queue Data Base Mask Pattern Generation CFRAC FRAC Extraction Viewers- Integrity Test

  11. Design Data Base Technical Planning Data Base Changes in Structure and Hierarchy of Design and Manufacturing Data Encapsulation Filter Data preparation Filter Record Types Filter Technical Planning Data Base Technical Planning Data Base

  12. The Fracturing of Fractured Mask Layout Data Rendering FRAC CFRAC, Extraction and Rendering Filter Writer Job Queue Data Base Technical Planning Data Base Mask Pattern Generation CFRAC FRAC Extraction

  13. Design and Manufacturing Interoperability • IC and mask design intent are lost downstream • Numerous filters and translations of data drop design and manufacturing hierarchy. • There is no real time direct data link to what is written on a mask. • Which gives the IC designer an opaque view of how the design is spatially transformed onto a mask. • Such a view is a compelling need when non-parasitic biasing and proximity corrections push a design outside acceptable IC design rules. • Such constraints will increase as the spatial density budget for circuit elements increases. • Such losses extends “time to market” and increase design and manufacturing costs. • It will become increasingly important to design at a higher level of abstraction with a real-time view of what is actually writable on a mask or wafer. • It will also become increasingly important to ensure that any movement of data is as efficient, portable and extensible as possible.

  14. Finer Data Granularity Expected at the Mask Pattern Generation Level • Design and manufacturing data granularity continues to increase. • 100 to 300 Gb files with the expectation that the cost of ownership to write or manufacture a mask does not increase. • Job Queue and sorting data rates are reaching several hundreds of Mb/second with needed storage capacity in the Terabytes region. • These types of demands run orthogonal to the necessary reduction of COO and a shorter time to market. • Greater access to design data • Interconnectivity data will help improve mask layout and engineering data processing time. • Massive parallel processing • Sorting is fundamental for efficient massive parallel processing • Access efficiency features, such cell reference tables and bounding boxes, accelerates transformations, such as sorting

  15. IC Design DRC Simulation Verification Synthesis Encapsulation Mask Manufacturing CD measurement Pattern generation Inspection Encapsulation/Simulation Data preparation/Assembly Fracturing/Verification The SEMI and OpenAccess Universal Data Model (UDM) Standard API . IC Design and Mask Technical Planning Data Base Hierarchical Data Base Cells, Cores, Gates, Transistors Physical Design Layout Geometric shapes Mask layout Write-, inspection- and CD measurement-ready data files

  16. The SEMI and OpenAcess UDM • One standard data base and applications program interface (API). • For design and mask manufacturing. • Access to all design and mask manufacturing data through one common data language. • Standard semantics for all model objects, attributes and relationships • No ambiguity betweenor within design and manufacturing tasks. • Hierarchy preserved through to mask pattern generation, CD measurements and inspection. • Unified design to manufacturing data flow and effort.

  17. The SEMI and OpenAcess UDM • Full access to design and manufacturing intent up and down the design and manufacturing flow. • Opens the door to more efficient massive parallel processing at the mask pattern generation level. • Thread safe and data preparation • multiple threads within an application can operate on data in parallel without the risk of one thread contaminating the data on another. • request objects that are within a specified spatial area (e.g. a stripe) • Query by Region for pattern generation and inspection • multiple stripes in parallel; multiple executions. • Direct access to mask layout and DRC extraction data by region of interest during mask inspection and CD measurement operations. • Unlimited scalability • The model is limited only by the ability to store and manage the data within the data base.

  18. IC Design Mask Manufacturing Device manufacturing Process characterization Parasitics development CMP Etch CVD, PECVD, Implant PSM, Lithography, etc. Mask Quality Assessment Extending the reach of the UDM . Standard API Universal Data Model Hierarchical Data Base Wafer process data Process Parasitics

  19. UDM Status • The technology exists today for full implementation • The reference data base and API are already available and being used today. • Mask and wafer implementations underway through SEMI, OpenAccess Coalition and Si2. • It is a community resource • Change-order team in place. • Applicable to design, mask and wafer data flows. • Applicable to high-speed and volume data rendering and measurement applications. • Free-use license • Free-use after release from the OpenAccess coalition.

  20. Organizations Involved • SEMI Data Path Task Force • Tom Grebinski (tgrebinski@sbcglobal.net) • Task Force Chair • Applicable site • www.semi.org • www.si2.org/eda-mask • SEMI UDM Working Group • Tom Grebinski and Don Cottrell • Working Group Co-chairs • OpenAccess Coalition and Si2 • Scott Peterson, LSI Logic (OAC Chairman) • Steve Schulz- President and CEO, Si2 (schulz@si2.org) • Applicable sites • www.openeda.org • www.si2.org /openaccess

  21. Cadence Design Mentor Graphics Synopsys Micronic Laser Systems JEOL KLA-Tencor Applied Materials Dai Nippon Printing Toppan Printing Photronics Dupont Photomasks STMicroelectronics TSMC USA Toshiba (NuFlare) Hitachi Hewlett-Packard Companies Participating • International Sematech • IBM • Infineon • Texas Instruments • Motorola • Philips Semiconductor • JEOL • Alcatel • Intel • AMD • SELETE/JEITA • National Semiconductor • LSI Logic

  22. Moving Forward • Critical Path Items • New members to SEMI Data Path Task Force and Working Groups • New members to the OpenAcess Coalition • Implementation of the mask and wafer extensions to the OpenAccess Data base and API. • Extending and then bridging the responsibilities between design, mask and wafer manufacturing. • Data-intensive flow integration with OpenAccess and the UDM. • Pattern generation • Data Preparation • Mask inspection and CD measurement • Formalize relationship between SEMI, SI2 and OpenAccess Coalition

  23. Successful Track Record • Si2 and the OpenAccess Coalition • Open-Source Reference Data Base and API • Source and Binary code made available for the model and API. • Unprecedented effort and availability • Released to the public January 1, 2003 • SEMI Data Path Task Force • The development of a replacement for GDSII called OASISTM.

  24. Successful Track Record • OASISTM • 64-bit Open Artwork System Interchange Standard. • vs. 16-32 bit • direct access to cell pointers • GDSII has only sequential access to cell data. • 10-50 times more compact • Makes use of modality • Canmimic data organization of virtually any writing or inspection pattern file.  • Flexible property mechanism which can be used to tag figures, arrays, and cells with as much textual and numeric information as needed by downstream processors.

  25. Successful Track Record • The creation of the Universal Data Model (UDM) • Embrace of the technology worldwide and across several industry platforms. • A recognition of the importance of the link between design and manufacturing by the industry and the media. • Adoption of the OpenAccess reference data model and API as the basis for the ongoing development of the UDM.

  26. Adoption of the Technology • The compelling need • Data granularity of an IC design and the manufacturing of an IC continues to increase. • Closer integration of the data flow; greater opportunity to lose design intent at a number of levels. • Greater inability with the tracking and credible use of design and manufacturing data. • Greater need for speed with fewer errors. • Massive parallel processes into the tera-pixels per second. • Greater need for deign intent at the mask data preparation, pattern generation and inspection levels. • Greater need for manufacturing intent in the design space; cross talk is there ad getting louder. • Proximity corrections at the manufacturing level render DRC at the design level less effective. The need for a view by design at the mask production level. • There is no choice

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