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The Influence of Adhesive Materials on Chip-On-Board Packing of MEMS Microphone

The Influence of Adhesive Materials on Chip-On-Board Packing of MEMS Microphone. Reporter : 黃一軒 Advisor : 莊承鑫 老師 Institute of Mechanical Engineering Southern Taiwan University , Tainan Taiwan. Outline. Motivation Simulation Design and Boundary conditions Results and Discussions

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The Influence of Adhesive Materials on Chip-On-Board Packing of MEMS Microphone

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  1. The Influence of Adhesive Materials on Chip-On-Board Packing of MEMS Microphone Reporter :黃一軒 Advisor:莊承鑫 老師 Institute of Mechanical Engineering Southern Taiwan University, Tainan Taiwan

  2. Outline • Motivation • Simulation Design and Boundary conditions • Results and Discussions - Influence of cap on PWB’s thermal deformation - Influence of adhesive material and thickness • What is Buffer Layer? - Discussion on buffer layer effect • Conclusions

  3. Motivation (a) COB (Chip on Board) Advantage: Cost down , Smallsize , Simple design , etc. Shortcomings : molding difficult. (b) SMT (Surface Mount Technology) Advantage: Automation. Pick and Place machine Solder paste printing ↓ Pick and Place machine ↓ Reflow(260 ℃) ↓ Complete Shortcomings : Reflow temperature is higher. Reflow Solder paste printing Reflow(260 ℃) ECM MEMS Microphone

  4. What is problem of MEMS Microphone ? E Adhesive CTE PWB Soft Cap Rigid Cap effect PWB PWB effect Chip 260℃ High temperature Heating of chip from SMT.

  5. Simulation Design and Boundary conditions Hinge Sliding end Heating process Sliding end Total element : 810002000 Simulation Cases

  6. Material properties 2025D>3140RTV DA6501 Metal Cap > PWB > LCP Cap LCP Cap > PWB > Metal Cap 3140RTV DA6501>2025D

  7. Results and Discussions

  8. Buffering effect Low E High E Buffering effect No Buffering effect

  9. Conclusions According to the simulations result when the adhesive thickness at 30um is at the minimum of stress and deformation on the diaphragm . A low Young’s modulus adhesive materials, such as 3140RTV and DA6501, effectively isolates the silicon chip with less influence of thermal deformation from bottom PWB as the buffer layer effect. However, the thickness of soft adhesive needs to be controlled in a low level to prevent the thermal stress in the diaphragm rising with thickness.

  10. Thank you for your attention

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