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Phase2 Pixel Sensor: Meeting on

Phase2 Pixel Sensor: Meeting on. D. Bortoletto, Purdue University & University of Oxford. Phase 2 Pixel Sensor Working group meeting. Bump bonding for hybrid pixels remain a dominant cost for hybrid detector. The cost for a single detector unit have been over € 200 - 300

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Phase2 Pixel Sensor: Meeting on

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  1. Phase2 Pixel Sensor: Meeting on D. Bortoletto, Purdue University & University of Oxford CMS Tracker Meeting

  2. Phase 2 Pixel Sensor Working group meeting • Bump bonding for hybrid pixels remain a dominant cost for hybrid detector. The cost fora single detector unit have been over € 200 - 300 • Readout chip (ROC) : sensor chip (SC) : bump bonding (cost ratio) = 1:2:7! • BB technology used in CERN pixel detectors is not commonly available in small volumes. Flip chip assembly part has caused the rise in total costs during last two years (pie diagrams). M. Campbel CMS Tracker Meeting

  3. Phase 2 Pixel Sensor Working group meeting • In this meeting we would like to discuss with companies the challenges for Phase 2 • The environment of HL-LHC: • Operations in 140 collisions per bunch crossing at 5x1034 cm-2 s-1 and 40 MHz • Maintain occupancy at ≈ % level • Higher granularity / smaller pixel require smaller thinner pixels CMS Tracker Meeting

  4. Pixel geometries • try PIXEL SIZES under Consideration CMS Tracker Meeting

  5. The questions • What is the minimal bump bonding pitch and bump bonding pad size that can be achieved with your technology? • How large can the die be or bb density to achieve a good yield (similar to the one that was achieved by the current pixel sensors) ? • What is the minimum thickness of the ROC and sensor wafers that you can handle? • Are they any interesting development in BB that we should be aware of? • Any other issue that we should consider? CMS Tracker Meeting

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