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WBS 1.1.1.5 (& W.B.S. 1.1.1.6.2 & Services)

WBS 1.1.1.5 (& W.B.S. 1.1.1.6.2 & Services). Pixel Module Assembly & Test. Technical Status Goals for 2004 Service Panels. Technical Status. Thinning and dicing Module Assembly Pigtails are gone Adhesives Sector loading Production testing Burn-in setup.

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WBS 1.1.1.5 (& W.B.S. 1.1.1.6.2 & Services)

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  1. WBS 1.1.1.5(& W.B.S. 1.1.1.6.2 & Services) Pixel Module Assembly & Test • Technical Status • Goals for 2004 • Service Panels M. Garcia-Sciveres -- Module Assembly & Test

  2. Technical Status • Thinning and dicing • Module Assembly • Pigtails are gone • Adhesives • Sector loading • Production testing • Burn-in setup M. Garcia-Sciveres -- Module Assembly & Test

  3. Technical Status: Thinning and Dicing • This is going very well. Great work by Amanda, Aldo, & Al Clark. Vendor GDSI has been very reliable. Cost under control. • Only issue with FE-I1 was suspected silicon particle contamination leading to shorts during flip chip. This may not be an issue for FE-I1 (or it may be worse). Chip squashing tests are under way. M. Garcia-Sciveres -- Module Assembly & Test

  4. Technical Status: Module Assembly 1/2 • FE-I1 used to “shake down” the module assembly process. • Yield of all steps has steadily improved. Not quite at planned levels yet, but plateau probably not yet reached. M. Garcia-Sciveres -- Module Assembly & Test

  5. Technical Status: Module Assembly 2/2 • Fixturing is very simple and works well. What we have is good enough for production. • Assembly time with new adhesive tape is literally less than 1 hour per module • Wire bonding with new machine is a breeze. But we need to buy such a machine! (availability assumed in cost and schedule) • Only outstanding issue is how exactly to pot the bonds to avoid magnetic field resonance. Work in progress. M. Garcia-Sciveres -- Module Assembly & Test

  6. Technical Status: Pigtails Gone 1/3 • Original design had cable soldered to flex pigtail, in turn wire-bonded to module • In fixing a defective pigtail bypassing it with wires, we realized that the pigtail was hurting more than helping. • Now cable soldered directly to flex. • Fewer things to test, fail and assemble. • No wire bonded connections to module • All modules for a given disk are identical (before needed 2 flavors) M. Garcia-Sciveres -- Module Assembly & Test

  7. Technical Status: Pigtails Gone2/3implications for US assembly flow Flex + SMT LBL for cable Albany for HV test OU for MCC M. Garcia-Sciveres -- Module Assembly & Test

  8. Technical Status:Adhesives • Flex Hybrid To module Attachment • Original scheme of no glue under flex bond pads did not work due to flex bow • Switched to silicone tape adhesive under bond pads. • Allows for excellent wire bonding and instant assembly. • Radiation tested OK. Some further qualification needed (thermal cycling, etc.) • Module to Sector Attachment • SE-4445 Silicone accepted as new universal baseline • Modules on sector being loaded with this glue now (used to be CGL). Very good initial experience. M. Garcia-Sciveres -- Module Assembly & Test

  9. Technical Status:Sector Loading • Major development here • First and only real sector was loaded “by hand” with makeshift fixtures • Original tooling, now 2 years old, had many problems. • Pickup of real modules built with Dyconex flex was a problem • Sector tubing design evolved and no longer fit. • No provision for survey of module position • New concept introduced for sector safe handling, storage, survey, testing. “Sector frame”. Similar concept to flex frame. • Entirely new tooling designed around frame. All parts have need built and are almost ready for first use (build second real sector). (aside: Fred charges all this to SCT account) M. Garcia-Sciveres -- Module Assembly & Test

  10. Technical Status: Production Testing • Have been pushing for a documented module, sector and stave QA plan. Collaboration has been slow to respond. • Nevertheless, a fairly clear picture is emerging of the resources needed. • Basically: • Characterize each module with PC test setup • Burn-in and thermal cycle each module (new burn-in setup needed) • Burn-in, survey, thermal cycle, and IR image each sector (same burn-in setup as module) • Undecided: test each sector with ROD. M. Garcia-Sciveres -- Module Assembly & Test

  11. USB port or USB hub Technical Status: Burn-in Setup • Finally started development at LBL • Students + Eng. Div. drafter. • Design “specs” • Keep it simple • Add-on to existing single module test setup • Cheap and easy to replicate (we expect everyone will want one). New burn-in board New burn-in board ISEG supplies for HV, bulk supply for LV power New burn-in board New burn-in board M. Garcia-Sciveres -- Module Assembly & Test

  12. Goals For 2004 • Start Production! • Finish production in early FY05! • Try to get collaboration to buy into this “5th disk” • Gain time on ramp-up • If it ends up working more or less it becomes half of a 3rd hit M. Garcia-Sciveres -- Module Assembly & Test

  13. 2004 Goals:Type 0 Cable Production • There is no flex pigtail fabrication (1.1.1.4.3.2 -> 0) • Copper clad wire and other materials ($5K) • PCB for PP0 connector end of cable ($1.7K) • Cables attached to flex hybrid at LBL (600hrs tech.) • Total: • $6.7K this is part of • 600 hours labor ($40K) module assy. in WBS M. Garcia-Sciveres -- Module Assembly & Test

  14. 2004 Goals: Wafer Thinning, Dicing, Die-probing Production • 100x Bumped FE-I wafer thin ($15K) • Cleaning & re-coating in Microlab (100hrs student) • Inspection(25hrs student) • Dicing ($20K) • Cleaning resist in Microlab (100hrs student) • Single Die Probing & inspection (1760hrs student) • Supplies (gel packs, etc) ($12K) • Totals: • $47K ETC03 prod. total • 2000 hours student ($30K) 29K+28K +20K M. Garcia-Sciveres -- Module Assembly & Test

  15. 2004 Goals: Production Module Assembly • Shipping Covers & supplies ($8K) • Equipment maintenance ($5K) • Technician Assembly Labor (600hrs) • Technician tests (bond pulls, etc.) (300hrs) • Shops (100hrs) • Totals • $13.3+6.7= $20K ETC03 prod. total • 1160+600 hours ($60K) 24K+176K(type 0 cable) -120K M. Garcia-Sciveres -- Module Assembly & Test

  16. 2004 Goals:Burn-in System Development • Being developed by students + eng. Div. Drafter. • First prototype by end of summer => Much of this cost is in FY03! • At that point will need a lot of software help (new postdoc to jump in…) • Same system to be used for sector burn in. • See Module QA for operation of burn-in system • Copies of system likely to be requested by collaborators • $20K board fabrications and purchases • 440 hours drafter ($20K) • 880 hours student ($12K) • 80 hours shop ($6K) ETC03 • Total: $58K 46K +12K M. Garcia-Sciveres -- Module Assembly & Test

  17. 2004 Goals: Production Module QA • Still hard to estimate how long it will take per module for 1 person + TDaq setup. • Optimistically assume 4 hours per module. • Need dedicated setup and a lot of disk space. • Note this is different setup than burn-in. That’s a second dedicated setup. • => Do we need one more TDaq setup? Yes. • New Tdaq setup & pwr supplies ($15K) • 1760 hrs student ($25K) • Burn-in setup operation • Operating supplies ($5K) • 880 hrs student ($12K) ETC03 Prod. Total • Total QA: $20K + $37K $45K + $75K -63K M. Garcia-Sciveres -- Module Assembly & Test

  18. 2004 Goals: Production Sector Loading • This should not be a very labor intensive operation • Ideally will be done by an engineering tech. now F/T on mechanics, to be trained by FRED. • Important cost is frame holders for production modules and possibly additional tooling. • Misc. tooling, & supplies ($7K) • 20 frames, 16shop hours each ($16K) ETC03 Prod. Total • 440hrs. Mech. tech. ($16K) $7K + $24K +8K M. Garcia-Sciveres -- Module Assembly & Test

  19. 2004 Goals: Production Sector QA • Involves IR, Metrology, Thermal cycling, and electrical burn-in • Assume 1 sector/week • => 1 FTE for this job (student OK) • Fixtures, storage ($25K) ETC03 Prod. Total • 1760 hrs student ($25K) $36K + $12K • What about database?ETC03 has $11K +2K M. Garcia-Sciveres -- Module Assembly & Test

  20. Module Production Summary • Adding up the labor we need 4.1FTE students in FY04. • We have ~1. • New postdocs can pick up some of the work • Probably still need to hire at least 2 temps (eg. finishing undergrads) or find visitors or other help. • Technicians needed: 1.6FTE. Seems OK. • Assuming we can find this many students, looks like significant reduction compared to ETC03. (about 140K). • But, part of these savings are not real because we are spending “production” money on continued prototype work in FY03. I have not tried to add up FY03 standing army cost and subtract it from production budget. M. Garcia-Sciveres -- Module Assembly & Test

  21. Service Panel Production (2004)For 3-Hit System (everything up to PP1 tapes) This is the slide from last year. New estimate looks a tiny bit less (10-20%), but uncertainty is still too large to reduce this. • 57Kg Cu-Clad Al Wire (+overage) $81K • Flex fabs, connectors, vendor assy. $66K • LBNL Tech. Labor 3648Hrs • Total for Electrical component of Service panel production: $293K • (2 hit total is $226K) M. Garcia-Sciveres -- Module Assembly & Test

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