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FGM C DR

FGM C DR. FGM Electronics (FGE) Ronald Kroth MAGSON GmbH Berlin Germany. Fluxgate Electronic. FGE FM Status of the FM F indings Influence of Clock Jitter. Electronics Design Excitation Data Acquisition Feedback Housekeeping Control Power Dissipation FGE Bread Board

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FGM C DR

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  1. FGM CDR FGM Electronics (FGE) Ronald Kroth MAGSON GmbH Berlin Germany

  2. Fluxgate Electronic • FGE FM • Status of the FM • Findings • Influence of Clock Jitter • Electronics Design • Excitation • Data Acquisition • Feedback • Housekeeping • Control • Power Dissipation • FGE Bread Board • Purpose of the Bread Board • Differences to the ETU’s and FM’s • Status of the Bread Board • FGE ETU • FGE ETU on the 6U Board • FGE ETU Layout • Status of the FGE ETU • Changes in the Layout since PDR

  3. Excitation to the sensor’s ringcore Excitation signal, square wave, ca.10kHz A square wave signal drives the excitation resonant circuit.

  4. Data Acquisition The pickup signal form the sensor is amplified by an instrumentation amplifier and sampled by a 14-bit Analog-Digital Converter.

  5. Feedback The feedback voltage is generated by to cascaded 12-bit Digital to Analog Converters, acting as a “18-bit DAC”. The voltage is converted into the feedback current by a voltage driven precision current source.

  6. Housekeeping Two analog housekeeping signals are supplied, representing the sensor- and electronics temperature. A Pt100 in a resistor bridge is used to generate the signals.

  7. Control • The FGE electronics is controlled by a FPGA which overtakes the following tasks: • Generating the Excitation Signal • Reading the ADC Data • Generating the Feedback Values • Calculating the Output Data • Acting as Command Receiver and Data Transmitter

  8. Power Dissipation • The estimated power dissipation is made up by the following contributions : • Excitation 180mW • Preamplifier 180mW • Analog/Digital Converter 150mW • Feedback 200mW • FPGA 50mW (85mW) • Total 760mW (795mW)

  9. Bread Board • The purpose of the FGE Bread Board is • to test and verify the general electronics design • to test and verify the FPGA design • to test the sensors • Differences to the FGE ETU’s and FM’s • There are some differences between the Bread Board Design and the ETU respectively FM design: • the Bread Board uses a re-programmable ProAsic FPGA • the FPGA core voltages are generated on board by line regulators • there are additional buffers in the digital lines due to the 3.3V IO’s of the ProAsic • the Bread Board has an additional parallel processor interface

  10. Status • The Bread Board is used to test the general electronics design and the FPGA design along with a GSE supplied by the IWF Graz Layout of the Bread Board

  11. FGM ETU U6 Board with PCB • The FGE will co-reside with the PCB on a single 6U board. • The FGE will be placed on the opposite half of J1 connector site. Space for the PCB Layout 6U Board with the FGE Layout

  12. Layout Feedback DAC’s and Current Sources Relays Voltage Reference to the back plane to the front panel Control FPGA Preamplifiers ADC’s Serial Interface Excitation Power Interface to the PCB

  13. Status of the FGE ETU • The FGE ETU is delivered and ready for testing

  14. Changes since PDR • There have been the following changes in the FGE • design and layout since the PDR: • all DAC’s are now placed on the top side due to the limited space between the boards • Megatron precision resistors have been replaced by MIL-qualified Vishay types • WIMA high value capacitors in the excitation circuitry have been replaced by MIL-qualified Kemet types

  15. Changes since PDR • grounding concept has been improved: separate ground nets for all functional parts, connected at a star point close to the Power interface • ADC analog interface simplified and improved based on experience of Venus Express • ADC serial interface mode was changed the ADC will now be clocked by the system clock instead of using the ADC‘s internal clock - no need to synchronise ADC clock to the system clock - reduces potential interfering frequencies on the board

  16. Status of the FM • The FGE FM layout will base on the ETU layout • Modifications may be caused by: • the testing results of the ETU • the interconnection of the FGE and PCB layout

  17. Influence of Clock Jitter (F1) • A jitter of the system clock will result in • a jitter in the excitation signal • an asymmetry of the excitation • increased noise in the magnetic field data • Test with a jittering excitation signal: • the excitation signal jittered with 0.1% • noise increased by the factor 3

  18. Influence of Clock Jitter (F1) • A jitter of the system clock will result in • a jitter in the excitation signal • an asymmetry of the excitation • increased noise in the magnetic field data • Jittering excitation signal (tested with the VEX electronics): • the excitation signal jittered with one sys clock period (0.13%) • - noise increased by the factor 3 • - influence of sys clock jitter will be neglectable

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