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DHE Chassis and Cooling

DHE Chassis and Cooling. DES Mechanical Workshop at FNAL November 2, 2005 Vaidas Simaitis High Energy Physics Group University of Illinois at Urbana-Champaign. 6-SLOT + 4-SLOT CHASSIS. FAN MANIFOLDS ADDED. FANS ADDED. COOLING MANIFOLDS ADDED. HEAD EXCHANGERS ADDED.

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DHE Chassis and Cooling

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  1. DHE Chassis and Cooling • DES Mechanical Workshop at FNAL • November 2, 2005 • Vaidas Simaitis • High Energy Physics Group • University of Illinois at Urbana-Champaign DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  2. 6-SLOT + 4-SLOT CHASSIS DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  3. FAN MANIFOLDS ADDED DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  4. FANS ADDED DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  5. COOLING MANIFOLDS ADDED DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  6. HEAD EXCHANGERS ADDED DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  7. MAIN MANIFOLDS ADDED WITH HEAT SINK FOR THERMOELECTRIC COOLER DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  8. POWER SUPPLIES ADDED DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  9. POWER SUPPLY MANIFOLDS ADDED DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  10. DELRIN MOUNTING INSULATORS DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  11. MOUNTED TO INNER CYLINDER (1/4 SHOWN) DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  12. CONNECTOR BULKHEAD DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  13. WITH MODULE IN GREEN DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  14. Z-AXIS VIEW WITH R=52” ID CLEARANCE CYLINDER DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  15. WORST-CASE MODULE EXTRACTION DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  16. WHOLE ASSEMBLY CAN BE TILTED AT EITHER END FOR MODULE EXTRACTION DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  17. Z-AXIS VIEW WITH HEAT SHIELDS ADDED DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  18. BOTTOM PERSPECTIVE OF ENTIRE ASSEMBLY DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  19. TOP PERSPECTIVE OF ENTIRE ASSEMBLY DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  20. HEAT SHIELD SIZE 17.5” 22” 12” DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  21. COOLING SYSTEM SIZE 14” 21.5” 12” DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  22. RADIATING SURFACE • A = 2x(12”x 14”+ 12”x 22.5”+ 14”x 22.5”) = ~1500 in² = ~1 meter² • L = Insulation thickness = .25” = 1/16 m • l = thermal conductivity = ~ 0.03 W/mK for air • If T-ambient= -20°C , T-electronics= 30°C then ΔT = 50°C • Q = heat flow rate = lA ΔT / L = 0.03 x 1 x 50 x 16 = 24 Watts DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  23. THERMOELECTRIC COOLER 1 • Q-hot = heat released hot side = Q-cold + P-in where Q-cold = heat absorbed at cold side and P-in = electrical Power input • T-hot = hot side temperature of thermoelectric = T-ambient + Q-hot x Θ where Θ = thermal resistance of the hot side heat exchanger • ΔT = required temperature differential = T-hot – T-cold DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  24. THERMOELECTRIC COOLER 2 • T-ambient is in fact the temperature of the electronics, which is assumed to be 30°C • The heat sink temperature rise can be 1st approximated to be 10°C • Then T-hot = 40°C • If T-cold = -20°C then ΔT = 60°C • Assume Q-cold = 10 W for each heat shield • Assume Θ = 0.10 C/W (possibly?) DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  25. THERMOELECTRIC COOLER 3 • If P-in = 100 W (this is hopefully worst case) • Q-hot = Q-cold + P-in = 10W+100W = 110W • T-hot = T-ambient + Q-hot x Θ = 30°C + 110 W x 0.1 C/W = 41°C which is close to the assumed value DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  26. THERMOELECTRIC COOLER 4 • Single stage TE’s are most efficient at a ΔT = 40°C ± 10°C • We probably need a 2-stage TE for handling ΔT of 60°C or more • We have not yet explored the specifications and pricing of these 2-stage TE’s • Yes, this is still all theoretical! DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  27. TOTAL HEAT LOAD • The estimated average DC power for a dual backplane is ~350 Watts • If power supply is 80% efficient, it must be producing another 70 W • Add 2 TE’s at 110 W each • Add 2 fans at 30 W each • TOTAL = 700 W • Or 350 W for each of 2 heat exchangers DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  28. HEAT EXCHANGERS • T-electronics assumed = 30°C • If we assume T-liquid = 10°C • ΔT = 20°C • Performance required is 350 W / 20°C = 17.5 W/C • Lytron M05-050 spec is 20W/C @ ½ gpm with a liquid pressure drop of ~0.5 psi at an air flow of ~60 cfm with an air pressure drop of 0.2 inches of water (at 100 cfm, the drop is 0.3”) DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  29. ΔT OF COOLING WATER • 1 gallon of water weighs 3784 grams • ½ gallon/min = 1892 grams/min • 1W = 14.33 calories/min • 350W = 5016 cal/min • ΔT = 5016/1892 cal/g -> 2.65°C • Can we run the two heat exchangers in each crate assembly in series, with a dt = 5.3°C ? DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

  30. FANS • Should be routine • For example: a Comair/Rotron Patriot PT2B3 is rated at 150 cfm at 0.3” drop running at 115 VAC at 60 Hz at 31 W. • PT2D3 should be 75 cfm at 16 W, running at 1700 rpm instead of 3400 rpm DES DHE Electronics Chassis --- Vaidas Simaitis vjs@uiuc.edu

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