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Supply Chain Management

Supply Chain Management. Customer. Customer Requirements. Marketing & Sales. Product Design. Planning Forecasting Capacity Schedule. Process Design. Distribution Whse & transport, by channel. Order Entry. Production Quality Control. Materials Management Supply Chain Management,

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Supply Chain Management

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  1. Supply Chain Management

  2. Customer Customer Requirements Marketing & Sales Product Design Planning Forecasting Capacity Schedule Process Design Distribution Whse & transport, by channel Order Entry Production Quality Control Materials Management Supply Chain Management, Purchasing, Inventory Control Overview of Operations Management Support from Accounting, Finance, Human Resources, Information Systems

  3. Supply Chain Management Power Customer BUR MN Cables TX KNG JAP ESS POK EFP

  4. Multi-plant Coordination • POK - Main Frame Assembly • KNG - Final Test and Ship • EFP - Supply CPU • ESS - Alternate CPU Supply • BUR - Supply Memory

  5. Bill of Materials (BOM) • 308X Series Main Frame • Frame 1 - Power Supply and Cabling • Frame 2 - CPUs • Frame 3 - Memory and Math Functions • Frame 4 - Parallel CPU

  6. 9, Chips 1, Substrate 12, TCMs 1, Top 9, Chips 1, Bottom 1, Substrate 1, Top 12, TCMs 1, Bottom 9, Chips 1, Substrate 1, Top 1, Bottom Mainframe BOM 1, FR1 MF 1, FR3 1, Power Supply 4, Memory 4, Cables 1, SP TCM 1, FR2 1, FR4

  7. How Much to Purchase? • Suppose we have an order for 10 Main Frames • 2 should have FR4 • 4 should have the special CPU • How many substrates are required?

  8. How Many Substrates? • 10 Main Frames -> 10 Frame 2s -> 120 TCMs -> 120 Substrates • 2 MF w/FR4 -> 2 additional FR2s -> 24 TCMs -> 24 Substrates • 4 MF w/FR3 SP TCM -> 4 SP TCMs-> 4 Substrates • Total Substrates = 120+24+4=148

  9. 10, Chips 4, Substrate 2, TCMs 2, Top 8, Chips 1, Bottom 4, Substrate 2, Top 2, TCMs 1, Bottom 8, Chips 4, Substrate 2, Top 1, Bottom Mainframe Lead Times 2, FR1 3, MF 2, FR3 2, Power Supply 6, Memory 1, Cables 6, Cables 2, SP TCM 2, FR2 2, FR4

  10. Determining Lead Times • If the Main Frame is made to order, what is the lead time? • Start from lowest level • At each level take the maximum parallel branch • Sum across the levels. • FR1 = 8, FR2 = 12, FR3 = 14, FR4 = 12 • Add 3 for Main Frame = 15 or 17 w/SP

  11. Questions • What are the issues the manufacturing managers need to consider? • Focus on transportation, what issues seem important? • What parts would you need? • How much would you order and when? • Would you want to hold inventory? • At what point(s) would you want to hold it?

  12. Back-up

  13. 9, Chips 1, Substrate 12, TCMs 1, Top 9, Chips 1, Bottom 1, Substrate 1, Top 12, TCMs 1, Bottom 9, Chips 1, Substrate 1, Top 1, Bottom Mainframe BOM 1, FR1 MF 1, FR3 1, Power Supply 4, Memory 4, Cables 1, SP TCM 1, FR2 1, FR4

  14. 10, Chips 4, Substrate 2, TCMs 2, Top 8, Chips 1, Bottom 4, Substrate 2, Top 2, TCMs 1, Bottom 8, Chips 4, Substrate 2, Top 1, Bottom Mainframe Lead Times 2, FR1 3, MF 2, FR3 2, Power Supply 6, Memory 1, Cables 6, Cables 2, SP TCM 2, FR2 2, FR4

  15. Frame 1 • Power Supply (Out Sourced) • One type • Three suppliers • Cables (Out Sourced) • 4 different (actually over 50) • 6 suppliers

  16. Frame 2 • CPUs - Generic • 12 - Thermal Conductive Modules • Chips • Substrate • Bonding • Test • Assembly

  17. Frame 3 • Memory (Internal Vendor) • Special Application Chips (Two Internal Vendors) with Substrate Mfg, Bonding, and Assembly in EFP

  18. Frame 4 • Custom Frame • An extra frame 2

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