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Explore the integration of electrical and optical systems on a single chip, enabling low-cost, reliable broadband networks. Join the global market opportunity for high-speed networks.
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Listing 823. GPON/EPON the next generation of broadband optoelectronics system on a chip
GPON on a Chip • GPON/EPON the next generation of broadband optoelectronics system on a chip • Optical networking. • Use of proven semiconductor fabrication technology to build a low cost, integrated electrical and optical system on the same IC chip (GPON).
Market • Primary market is manufacturing of electrical and/or optical network communication components. • This is a global opportunity as high-speed networks are being installed all over the world.
Market Growth • Significant global growth for the PON technology is predicted in the next five years. • Worldwide market for GPON electronics -- optical network terminals (ONTs) and optical line terminals (OLTs) -- will be worth $4.7 billion in 2011, up from about $1.3 billion this year.
Major players • Verizon • Ericsson AB • Alcatel-Lucent • France Telecom • Nokia Siemens Networks • Cisco • Intel • PacketFront
Problem Solved by the Technology • Integration between optical and electronics-based systems by using a single device. • Today the connectivity is made through specially made couplers and components that have relatively higher losses, more expensive to manufacture, and are less reliable.
How the Technology Solves the Problem • A proven semiconductor manufacturing processes and methodologies, which are very precise, reliable, and at a lowest cost of manufacturing.
Technology Deployment • Delivered to the manufactures via systems and processes used by semiconductor manufacturing companies. • The products will be sold to the network content providers.
Competitive Advantage • Significant cost savings. • Lower cost resulting from fewer components.
Development Platform • Manufactured with semiconductor processing tools.
Development Status • Near prototype stage. • Optical coupler is ready for production, detectors and filters are off the shelf, the laser diode needs to be reconfigured, gratings on the silicon substrate need optimization.
Intellectual Property Ownership • The I.P. belongs to the seller, a large U.S. semiconductor manufacturing materials company. • There are no known liens or encumbrances.
Patent Status • U.S. Patents Pending: • 1. Patterning 3-D Features in a Substrate. 2. Optical Coupling to IC Chip. • 3. Multiplexed Optical Sub-Assembly. • 4. Wafer Level Alignment of Optical Elements. • Patent information provided upon request.
Productization • The existing development team is in Silicon Valley, USA. • Some engineering resources would be required to complete the development. • The team and know-how are available from the U.S.
Deal Structure Sought • The deal structure envisaged is the sale of this technology asset. • Acquisition in 3 parts: • Initial acquisition. • Payment triggered when patents are issued. • Royalties on product sales • 3-5% Royalties
Frequently Asked Questions And Answers • Why is the developer of this technology listing this technology? • Although the developer is a Fortune 500 company, it supplies semiconductor manufacturers and does not have existing channels to bring this product to market.
Follow Up • Please refer to Tynax listing number: 823 with regard to this opportunity. • Inquiries should be directed to: • Moshe Sarfaty • moshe.sarfaty@tynax.com
