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Sensor and ladder and dimensions

Sensor and ladder and dimensions. PXL Ultimate-1 and Ultimate-2 sensor. (20230, 22720). 10 um. Dimensions are microns. Diced Silicon Size 20.240mm x 22.730mm There is a uniform 10 um border around the sensor lithography. 10 um. 10 um. Sensor (0,0). 10 um. (-10, -10).

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Sensor and ladder and dimensions

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  1. Sensor and ladder and dimensions

  2. PXL Ultimate-1 and Ultimate-2 sensor (20230, 22720) 10 um Dimensions are microns Diced Silicon Size 20.240mm x 22.730mm There is a uniform 10 um border around the sensor lithography 10 um 10 um Sensor (0,0) 10 um (-10, -10)

  3. Dicing is on outer edge of sealing line

  4. The engineering run will use ladders consisting of Ultimate-1 and Ultimate-2 sensors. • The production detector will use Ultimate-2 sensors only. • Optical fiducial point locations for the Ultimate-1 and Ultimate-2 sensor are shown on the next pages

  5. Left side Right side

  6. Right Side

  7. Right Side – Ultimate-1 This corner X= 18165.075 µm Y= 871.6 µm

  8. Right Side – Ultimate-2 This corner X= 18189.175 µm Y= 907.675 µm

  9. Left Side

  10. Left Side – Ultimate-1 This corner X= 4594.225 µm Y= 920.775 µm

  11. Left Side – Ultimate-2 This corner X= 4366.6 µm Y= 920.775 µm

  12. Shift in fiducial location from Ultimate-1 to Ultimate-2 • For the first fiducial at the left sideX= 4366.6 um   (shift = - 227.625 um)Y= 920.775 umFor the second fiducial at the right sideX= 18189.175 um  (shift = + 24.1 um)y= 907.675 um        (shift = + 36.075 um)

  13. Cable sizes and locations of sensors

  14. Ladder end detail Sensors are aligned to the upper edge of the cable 3.1 mm

  15. 214.48 mm 91.02 mm Driver section Low mass sensor section 1 mm gap Total length = 306.5 mm Width = 24.43 mm

  16. Joe Silber - Attached are measurements I made yesterday. 1) If I divide the total width of 10 butted sensors by 10x Leo's nominal width (19.62mm) I get an average gap of 2um. 2) If I instead divide by the width I measured (19.607mm) then I get average gap of 16um. 3) If I add up the worst cases of offset and rotation that I measured, then the maximum tol envelope would be 54um. 4) If I add up the stdevs on offset and rotation that I measured, then the tol envelope should be 18um. Clearly I may be simply interpreting the edge of sensor incorrectly due to my lighting conditions. If so, then the average gap is is tiny, 2um, as in case (1). But if I am seeing things correctly on the smartscope, then this batch of sensors were cut undersized by about 13um on average, and the correct gap to model would be more like 16-18um, as in cases (2) and (4). Case (3) is essentially what Howard originally assumed (2 mil), but in reality it looks to me like it would be incorrect for us to assume this worst-case placement on every sensor. I think the bottom line is that if Leo can stomach about 100um maximum error for wire bond alignment, then we should be fine splitting the difference between the 2 um and 18 um numbers, and calling the nominal gap 10um.

  17. Gap detail 10 um

  18. More background material

  19. ULTIMATERun SA35C11_1 # 12404 CC - IPHC 8th March 2011 - ULTIMATE

  20. Traceability – Chip Numbering CC - IPHC 8th March 2011 - ULTIMATE

  21. Sawing Diagram CC - IPHC 8th March 2011 - ULTIMATE

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