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Die Attach Process. Die Picking. Die can be directly picked from the wafer after the wafer sawing process. Die bonder are often equipped with ejector needle system to push against the backside of the wafer to eject the die. Computer controller vacuum pick-up tools are used to lift the dies.
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Die Picking • Die can be directly picked from the wafer after the wafer sawing process. • Die bonder are often equipped with ejector needle system to push against the backside of the wafer to eject the die. • Computer controller vacuum pick-up tools are used to lift the dies
Epoxy Dispensing • Die attach epoxy is dispensed in controlled volume by dispenser to the substrate • The viscosity of the epoxy has to be controlled. • The location of the dispensing is controlled computer with vision control
Die Placing • The die pick-up arm of the die attach machine will send the die to the appropriate position and load the die on the substrate. • Die bonding pressure has to be controlled. • The substrate may be heated to facilitate partial curing of the epoxy die attach.
Epoxy Curing • The die bonded substrate may need to send for curing in ovens to stabilize the polymer. • There are fast curing epoxy and also UV cured epoxy to facilitate the process.
