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LCTPC/LPWP-6th phonemeeting

LCTPC/LPWP-6th phonemeeting. Date 2 August 2006 Time 7:00 west coast 10:00 east coast 16:00 central Europe 23:00 Japan To join, Phone +494089981390 code 52872#. Agenda for 6th WP phonemeeting. AGENDA -1.News Formation of the LCTPC/LP Collaboration

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LCTPC/LPWP-6th phonemeeting

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  1. LCTPC/LPWP-6th phonemeeting • Date 2 August 2006 • Time • 7:00 west coast • 10:00 east coast • 16:00 central Europe • 23:00 Japan • To join, Phone +494089981390 code 52872# Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  2. Agenda for 6th WP phonemeeting AGENDA -1.News Formation of the LCTPC/LP Collaboration WWS-R&D-panel tracking review at Beijing -2.WP meeting LCTPC/LP goals (RS) LP status (whoever is ready) -3.Future meetings -4.AOB Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  3. AGENDA -1a.Formation of the LCTPC/LP collaboration If your group has not yet sent us the name of your CB representative (Jan’s terminology), please do so a.s.a.p. I will circulate the list of names as soon as it is complete. Here are the groups who have replied up to now: marked by  Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  4. LCTPC/LP Groups (09 August 06) Americas Carleton Montreal Victoria Cornell Indiana LBNL MIT Purdue Yale Asia Tsinghua CDC: Hiroshima KEK Kinki U Saga Kogakuin Tokyo UA&T U Tokyo U Tsukuba Minadano SU-IIT Europe LAL Orsay IPN Orsay Saclay Aachen Bonn DESY UHamburg Freiburg Karlsruhe MPI-Munich Rostock Siegen NIKHEF UMM Krakow Bucharest Novosibirsk PNPI StPetersburgLund CERN …Other groups interested? Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  5. AGENDA -1b.Tracking review at Beijing: As announced at the VLSW06, the WWS-R&D Panel is starting regular reviews of the different R&D projects for the LC detector. Chris Damerell informed me they want to start with tracking (Si and TPC) at the Asian LC meeting in Beijing (February 2007). First ideas are to submit a report (presumably an update of the May2006-PRC report will be appropriate), give a presentation at an open session and have short overviews from each country (including finances/manpower) at a closed session. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  6. AGENDA -2a.Next iteration on the goals for LCTPC. Takeshi asked to list an overview with both LP and SP R&D possibilities. Here is a preliminary version of the items shown at VLCW06 + feedback from Dan; first the general idea: • 2007-08: SP (small prototype) tests, LP1 –> two endplates: Gem+pixel, Microm.+pixel • 2009-10: LP2 -> real LCTPC prototype endplate: Gem or Mm + carbon-fibre sandwich, gating grid, sector/panel shape, LCTPC electronics, gas, etc Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  7. TPC R&D breakdown (prel.) • Gem, Micromegas, Pixel LP1@Desy • Large, small, odd-shaped panels LP1@Desy • Endplate alignment and stability LP1,LP2@Desy • Fieldcage LP1@Desy • Sandwich structure SP/LP2 • Gating/max. space charge SP/LP2 • ion feedback rate • Point/2-track resolution LP1,2@Desy • Momentum meas. in inhomog. B-field LP1,2@Desy • dE/dx measurement LP1,2@Desy • Gas studies SP • Pad shapes SimulationLP1,LP2 • Jet environment SP@Cern/FermiLab • Beams • 1-6 GeV/c electrons LP1@Desy • 1-20 GeV/c hadrons (+dE/dx) SP,LP2@Cern/FermiL • 100 GeV hadrons (+jets) SP,LP2@Cern/FermiL Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  8. AGENDA -2b.Electronics ideas (Leif,Luciano) Reminder: for Eudet 1000 altro channels available ------------12/2007 From last meeting, drawing from Leif of connector: Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  9. AGENDA -2c.Electronics ideas (Madhu) From last meeting, Madhu proposes for the LCTPC electronics: -preamp 25ns Trise (10%-90%) -no shaper-integrator -25MHz 10to12-bit FADC (2-track resolution can benefit from the somewhat faster Trise if the noise is still acceptable) To the electronics experts: please comment! Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  10. AGENDA -2d.Ideas for the endplate Reminder: most urgent point for LP is to design layout of endplate and finalize ~12/2006 Nothing new this meeting. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  11. AGENDA -3.Future meetings -At Vancouver, it was decided that a phonemeeting every 2 weeks is the right frequency for now. After Vancouver there are (in addition to phonemeetings): -Paris Endcap meeting organized by Paul/Akira (12-15 September 2006) -Eudet annual meeting MPI-Munich (18-20 October 2006) -European LC workshop Valencia (6-10 November 2006) -Asian LC workshop Beijing (February 2007) Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  12. AGENDA -4.AOB Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  13. Back up slides, for reference Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  14. AGENDA -1a.Formation of the LCTPC/LP collaboration Dean, Takeshi and RS have started working on this. First ideas: • 1)Three coordinators, one chosen by each region. These spokespersons (SP) would coordinate the work of the following two boards: • 2)The collaboration board (CB), consisting of the principle investigator (the group leader or other chosen member) from each group. Each CB member would take care of the resources for its group (money and people). • 3)The technical board (TB), consisting of the existing workpackage (WP) conveners. The TB will ensure the technical integrity of their WP and compatibility with other WPs while maintaining close contact with the rest of the collaboration. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  15. AGENDA -1b.Formation of the LCTPC/LP collaboration The SP will ensure that the coordination between the CB and TB is efficient and the work is carried out in a timely fashion. We also discussed that the CB and TB may each appoint an a kind of executive committee to steer the work, since this is a job more efficiently done with a small number of people. Details on the exact structure and how the steering is to be done still have to be worked out (feedback is welcome), but first: The interim-SP and the TB exist. A preliminary from of the CB is the groupleader’s mailing list which evolved during the last couple of years. For this organizational work, we need a more official list of names, which was the subject of our 12 July email. Somewhat more than half have replied, so we need to get the rest in order to proceed. As soon as the full CB is known, we can start exchanging ideas between the SP, CB and TB. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  16. Akira Sugiyama – GLD DOD Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  17. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  18. RS study - LDC DOD - together with Joel Pouthas Philippe Rosier (IPN Orsay) Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  19. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  20. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  21. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  22. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  23. Aleph Endplate Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  24. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  25. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  26. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  27. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  28. Some features • Zigzag structure prevented loss of tracks > θ~22° • Sectors mounted from inside using a “handling tool” • to minimize the dead space between sectors. This • straight-forward operation which was performed • at least 30 times during the lifetime of Aleph. • Alu sandwich structure stiff, lightweight to • - contain 7mb overpressure • - provide forced-air thermal insulation • between electronics and TPC volume • Water cooling of 1kW electronics/side in addition • - 22K channels per side • Combination water/air cooling blocked all heat to TPC • Overall thickness ~ 25%Xo (average) w/o cables • Bending of endplate • 20 micrometers due to 7mb overpressure • 5 micrometers due to wire tension Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

  29. R&D Planning • 1) Demonstration phase • Continue work with small prototypes on mapping out parameter space, understanding resolution, etc, to prove feasibility of an MPGD TPC. For CMOS/Si-based ideas this will include a basic proof-of-principle. • 2) Consolidation phase • Build and operate the LP, large prototype, (Ø ≥ 75cm, drift ≥ 100cm), with EUDET infrastructure as pedestal, to test manufacturing techniques for MPGD endplates, fieldcage and electronics. Design is starting---building and testing will take another ~ 3 years. • 3) Design phase • After phase 2, the decision as to which endplate technology to use for the LC TPC would be taken and final design started. Ron Settles MPI-Munich/DESY 6th WP phonemeeting 02 August 2006

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