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【IMPACT-EMAP 2014】 第九 屆國際構裝暨電路板技術研討會

【IMPACT-EMAP 2014】 第九 屆國際構裝暨電路板技術研討會 時　 間： 2014 年 10 月 22 日至 24 日 順 訪展覽： TPCA Show 2014 地　 點：台北南港 展覽館 重要 時程： Abstract 摘要 6.15  6.29 Full Paper 四頁全 文 8.15. Best Student Paper Award. Invited Speech. The 16 th EMAP. iNEMI Roadmap. Poster Session. Outstanding Paper Award.

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【IMPACT-EMAP 2014】 第九 屆國際構裝暨電路板技術研討會

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  1. 【IMPACT-EMAP 2014】第九屆國際構裝暨電路板技術研討會 時　間：2014年10月22日至24日順訪展覽：TPCA Show 2014 地　點：台北南港展覽館重要時程：Abstract摘要 6.15 6.29 Full Paper四頁全文 8.15 Best Student Paper Award Invited Speech The 16th EMAP iNEMI Roadmap Poster Session Outstanding Paper Award 1

  2. Plenary Speech 專題演講 Dr. Jie Xue President, IEEE-CPMT Senior Director, CISCO IEEE-CPMT主席/思科資深處長 Chee KienLim VP, Asia,STATS ChipPAC 星科金朋產品企劃亞洲區副總經理 Advanced Packaging Technology: Enabling Innovation in the Mobility and Internet of Things Era Dr. Mike Ma Vice President, SPIL 矽品-馬光華副總經理 Dr. Tien Wu COO, ASE Group 日月光-吳田玉營運長

  3. 展現企業研發能力 歡迎企業踴躍贊助 秘書處: 黃聖雯 TEL:03-3815659 # 404Email: sophia@tpca.org.tw IMPACT網站:www.impact.org.tw

  4. Call for Paper 邀稿領域 最大構裝暨電路板國際研討會 6/15截稿 錯過等明年! Submit papers Before 6/15 June 29 See more on www.impact.org.tw T:+886.3.3815659 # 405F:+886.3.3815150 E: service@impact.org.tw

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