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CMP Pressure Distribution Study Group

CMP Pressure Distribution Study Group. Final Project Update By Dave Bullen Alia Koch Alicia Scarfo 7/30/1999. Overview. Previous work Photos: The Jumbo 1000 in action Data collection software redesign Final static and dynamic pressure data Numerical work on pad deformation.

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CMP Pressure Distribution Study Group

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  1. CMP Pressure Distribution Study Group Final Project Update By Dave Bullen Alia Koch Alicia Scarfo 7/30/1999

  2. Overview • Previous work • Photos: The Jumbo 1000 in action • Data collection software redesign • Final static and dynamic pressure data • Numerical work on pad deformation

  3. Previous Work • Manometer Testing • Response was to slow • Could not measure a wide enough range • Pressure Gage Testing • Adequate response time • Still could not read a wide enough range • Could not be used with a rotating wafer

  4. The Jumbo 1000 in Action

  5. The Jumbo 1000 in Action

  6. The Jumbo 1000 in Action

  7. Data Acquisition • LabVIEW helped because: • Real Time Data • Very Accurate Data from Transducer • Easier to Read Data • Other Calculations made in Real Time

  8. The Program • We were able to control: • Scan Rate • Scans per Channel • Total Scan Time • Total Number of Scans

  9. Our Front Panel

  10. Wafer Static Pressures

  11. Wafer Static Pressures • Pressure distribution is divided into two high pressure regions and two low pressure regions • There is a wide variation in the pressures from point to point • There is a vague increasing trend from rim to center

  12. Wafer Dynamic Pressures

  13. Wafer Dynamic Pressures • Pressure distribution structure is similar to the static structure • Less variation from point to point • There is a strong increasing trend from rim to center

  14. Accomplished Numerical Goals • Wrote structural program • modeled pad changes using finite element methods • wrote program in Fortran 77 compatible with current Fidap fluid finite element program

  15. Update • Program now compiles! • Future changes to structural FEM program • program would benefit from new mesh generator • observe effect of pad deformation on pressure distribution under the wafer • Other options • try to incorporate strain program supplied by Professor Perlman

  16. Project Accomplishments • Determined the pressure distribution under a static and dynamic wafer via three methods • Created a system that can monitor film pressure under a rotating wafer • Used numerical methods to advance the understanding of the pad deformation phenomenon

  17. Future Pressure Detector Work • Manufacturer the rotating platform and glass wafer as specified. • Add a position signal to the data stream. • Upgrade the sliding contact system to transmit several channels. • Redesign transducer/air purge system to further reduce the response time.

  18. Thanks Dewi Bramono Dr. Jonathan Coppeta Dr. Livia Racz James Hoffman Joe Lu The whole TAMPL gang

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