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AMICSA 200 6 8 summary

AMICSA 200 6 8 summary. AMICSA 2006 in numbers. 48 51 participants From 11 12 countries GR, F, UK, NE, D, IT , BE, USA, SWI, SWE , AT , FI, P, NO

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AMICSA 200 6 8 summary

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  1. AMICSA 20068 summary AMICSA 2008

  2. AMICSA 2006 in numbers • 4851 participants • From 1112 countries GR, F, UK, NE, D, IT, BE, USA, SWI, SWE, AT, FI, P, NO • From 2627 different institutions/companies (more than half are new comers)DUTH, A2S, EADS Astrium (UK & F), E2V , ESA, CNES, National Semiconductor, TRAD, Aurelia, NTUA, STMicroelectronics, SODERN, SRON, Fraunhofer Inst IC, IHP, IMST, NISR, TESAT, ETH, SUPAERO, Saab, IMEC, AAS, Austria Space Research Inst, Nucletudes, ISD, EST Tomar, Instituto de Telecomunicações, Silicon SW Systems, Nova U., VTT, TKK, Gamma Medica Ideas, U. Bergen, Nemerix, Humboldt U., Kayser-Threde, Chipidea-MIPS, SABCA. • 1719 presentations in 2 days, plenty of discussions, questions and answers AMICSA 2008

  3. AMICSA 2008 in numbers • 4849 participants • From 1115 countries GR, F, UK, NE, D, IT, BE, USA, SWI, SWE, AT, FI, P, NO, E • From 2636 different institutions/companies (more than half are new comers)DUTH, A2S, EADS Astrium (UK & F), E2V , ESA, CNES, National Semiconductor, TRAD, Aurelia, NTUA, STMicroelectronics, SODERN, SRON, Fraunhofer Inst IC, IHP, IMST, NISR, TESAT, ETH, SUPAERO, Saab, IMEC, AAS, Austria Space Research Inst, Nucletudes, ISD, EST Tomar, Instituto de Telecomunicações, Silicon SW Systems, Nova U., VTT, TKK, Gamma Medica Ideas, U. Bergen, Nemerix, Humboldt U., Kayser-Threde, Chipidea-MIPS, SABCA, INTA, Insilition, RUAG,CNM/U. Seville, Arquimea,CERN, Dutch Space, ACTEL. • 1719 presentations in 2 days, plenty of discussions, questions and answers AMICSA 2008

  4. AMICSA’06 - Applications CMOS Image sensors readout Video processing chain ADC/DAC/HSSL high speed low power telecom processors (mobile & broadband) CAN1553 transceivers TM acquisition & data handling IO control Magnetometer front end Slow sampling high resolution Power converters LASER interferometer AOCS Environmental monitoring X,Gamma ray spectroscopy GNSS receivers Front End AMICSA 2008

  5. AMICSA’08 - Applications CMOS Image sensors readout Video processing chain ADC/DAC/HSSL high speed low power telecom processors (mobile & broadband) CAN1553 transceivers TM acquisition & data handling IO control Magnetometer front end Slow sampling high resolution Power converters LASER interferometer AOCS Environmental (T, wind, humidity) monitoring X,Gamma ray spectroscopy readout GNSS receivers Front End AMICSA 2008

  6. AMICSA – Technology (I/II) PROCESSES • CMOS • Bipolar • BiCMOS • Si / SiGe / SiGeC • bulk / SOI • 1.0, 0.5, 0.35, 0.25, 0.18, 0.13 µm; • 90, 65nm FOUNDRIES • AMS (AT) • AMIS (B) • STMicroelectronics (F) • IHP (D) • Infineon (D) • XFab (UK) • UMC (Taiwan) • TSMC (Taiwan) AMICSA 2008

  7. AMICSA – Technology (II/II) EDA tools, HDL & DK • Tanner • Cadence • Calibre (Mentor) • Pspice / Hspice • ADMS (Mentor) • VHDL-AMS / Verilog-A • proprietary simulators, optimizers: Astrium (UK), S3 (P) MPW programmes • Europractice • CMP • MOSIS • vendor specific… • Multi-Layer Mask AMICSA 2008

  8. AMICSA – Radiation effects Mitigation Techniques (technology and function dependent) • enclosed/bigger transistors, H-shape • guardband rings / STI / LOCOS • avoid diffusion resistors in favour of oxide R • epi layer / hetero-epi • buried-layers • low gain artificially provoked parasitic transistors • DRC isolation rules + waving to allow ELT • SOI • thinner field oxide, thicker gate oxide • hardened libraries (re-size, cell-topology) • ADC offset auto-zeroing (analog and digital correction) • architecture hardening (open vs closed loop) • redundancy and voting/comparing • self-powering functions (reducing SEL options) Rad Threats (TID, SEE) • leakage currents • Vth shifts • parasitic transistors/ latch up • gate rupture • data corruption (bit flips) • transient pulses AMICSA 2008

  9. AMICSA – Future Challenges Easier selection of process, foundry, design kit & tools, rad mitigation techniques, quality level – feasibility! Lower cost access to design kits, manufacturing services Simulation tools. Characterising COTS (NPR,etc) Supporting EU foundries in low volume market Coordinating/reusing EU resources (e.g. rad tests, new libs/DK & IPs), preserving industry competition and individual commercial interests Finding more resources (FP7?) for more tech/components evaluation and qualification. Sharing results ! Maintaining good (better) communication channels (ESCC Working Groups, Harmonisation/Tech Dossiers) AMICSA 2010 AMICSA 2008

  10. AMICSA – THANKS ! all participants sponsors National Semiconductor, E2V, Nova University of Lisbon, ESA organizers Boris Glass (ESTEC Microelectronics) and ESA Conference Bureau João Goes et al.(Faculty of Sciences & Tech / Nova University of Lisbon) AMICSA 2008

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