1 / 8

Status report of Resistive Strips Preparation

Status report of Resistive Strips Preparation. Atsuhiko Ochi, Kobe University. 16/04/2014 MM PCB WG mtg @ CERN. Large size resistive strip production. 2013 October First trial to make a large size sample 870mm x 425mm trapezoidal shape 8 foils are produced

chaman
Download Presentation

Status report of Resistive Strips Preparation

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Status report of Resistive Strips Preparation AtsuhikoOchi, Kobe University 16/04/2014 MM PCB WG mtg@ CERN

  2. Large size resistive strip production • 2013 October • First trial to make a large size sample • 870mm x 425mm trapezoidal shape • 8 foils are produced • Provided as a MSW resistive strips • 2014 March • Second trial • Same size as first trial • 3foils are produced • 2014 April • Third trial • 50cm x 40cm rectangle shape • 2 foils are produced • Provided as a new test chamber A. Ochi, MM PCB WG

  3. Micro scorpic pictures of strips • Recent rectangle foil • Strip width: 0.35mm • Gap width: 0.1mm • Foils are attached on PET film • To avoid the damage of the sputtered carbon pattern, by bending the foil Sputtered pattern 50 μm polyimide foil PET FILM A. Ochi, MM PCB WG

  4. Resistivity check • Resistivity from HV source bar • Line resistivity : 15MΩ/cm • Carbon sputter thickness: 310 nm Y x Preliminary Surface Resistivity [MΩ/sq.] Cupper thickness [Ǻ] A. Ochi, MM PCB WG

  5. Problem in liftoff process On the liftoff process • It is not easy to remove the wide resist pattern (correspond to non resistive pattern) • Long exposure in NaOH liquid may cause the damage to sputtered patterns • This is more critical for outside of the pattern • Currently, we have masked outside area by tape and other sheet by hand • However, it is time and cost consuming NaOH Sputtered carbon resist Substrate (polyimide) Sputtered carbon Substrate (polyimide) A. Ochi, MM PCB WG

  6. Request for new pattern- Dummy resistive coating - • Can we put dummy resistive coating around the resistive strip pattern with < 5mm gap? • Do we have to consider the mesh attachment and O-ring attachment ? Resistive strip pattern Dummy resistive coating A. Ochi, MM PCB WG

  7. Feasibility for Module-0 • Technical challenging • There are more than 2m long foils! • 16 types 64 foils needed • Are there resistivity variability for different sputtering batch ? • It should be checked. • Fast sputtering method should be developed for reducing the cost. • Currently: 6 hours/batch • Next trial: 2.5hours/batch, using multiple sputtering target • Shorter time available ? A. Ochi, MM PCB WG

  8. Summary and prospects • Currently, resistive foils production using sputtering is succeeded for large foils. • To reduce the process and the cost, dummy sputtering is needed. • 2.2m long foils can be made! • Discussion of the cost should be started. A. Ochi, MM PCB WG

More Related