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More Diamond?

More Diamond?. A Substrate Thickness Study for C-Shape VELO Brian Maynard. Including Digital Section of Chip. 0.5 W/chip Analog +1/R section of chip (RDP). Constant digital section of chip (DPB). The orange part of the chip is situated such that it is farthest away from the beam center.

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More Diamond?

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  1. More Diamond? A Substrate Thickness Study for C-Shape VELO Brian Maynard

  2. Including Digital Section of Chip 0.5 W/chip Analog +1/R section of chip (RDP) Constant digital section of chip (DPB) The orange part of the chip is situated such that it is farthest away from the beam center

  3. RDP=0.5W/chp DPB=0.5W/chp There is not much to be gained by making diamond thicker. 200um seems optimal in terms of efficiency of cooling per amount of material. A closer looks shows that we only gain Around 3C from 200um to 400um.

  4. For Next Time… • A three parameter study will be done varying analog power, RDP, and DPB

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