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Introduction of Temperature Measurement

Introduction of Temperature Measurement. by R&D RE Team. 1. GGT inc. March 3 rd , 2002. Presentation Outline. Primary Mechanic of Heat Transfer Processor Thermal Solution Design Thermal Measurement Equipment Thermal Profile Test Procedure Summary . 2.

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Introduction of Temperature Measurement

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  1. Introduction of Temperature Measurement by R&D RE Team 1 GGT inc. March 3rd, 2002

  2. Presentation Outline • Primary Mechanic of Heat Transfer • Processor Thermal Solution Design • Thermal Measurement Equipment • Thermal Profile Test Procedure • Summary 2

  3. Primary Mechanic of Heat Transfer • Conduction • 物质本身或当物质与物质接触时,能量传递的最基本形式 • Convection • 流体因加热而流动的传递热能的方式 • Radiation • 热辐射是一种可以在没有任何介质(空气)的情况下,不需要 • 靠接触,就能够达成热交换的传递方式 3

  4. Conduction Q = K ˙ A ˙ ΔT/ΔL • Q为热量,就是热传导所能带走的热量 • K为材料的热传导系数值(Conductivity) • A代表传热的面积(或是两物体的接触面积) • ΔT代表两端的温度差;ΔL则是两端的距离. 4 热传导后温度分布示图

  5. Convection Qc=hc ˙As ˙(Ts-Ta) • Qc:热量,就是热对流所能带走的热量 • As:固体的表面积 • Ts:固体的表面温度 • Ta:环境温度 • hc:传热系数,f(flow type,body geometry,physical,property,temperature, velocity,viscosity……) hc of air,natural convection:0.0015~~0.015W/in2℃forced convection:0.015~~0.15W/in2℃ 5

  6. Radiation Q =e˙s˙F˙Δ(T4) • Q为物体表面热辐射的热交换量 • e物体表面的热辐射系数(Emissivity),其值介 • 于0~1之间,是属于物体的表面材料特性 • S是波次曼常数5.67*10-8 • F (Exchange View Factor)辐射热交换的视角关 • 系,它其实是一个函数,一个跟两个表面所呈角度, • 面积,及热辐射系数有关的函数 • Δ(T4) =(Ta4-- Tb4) ,其中Ta是表面a的温度,而Tb • 是表面b的温度 6

  7. Processor Thermal Solution Design • Heat Sink • Heat Pipe • Fan • TIM(Thermal Interface Material) 7

  8. Heat Sink • The thermal resistance of a heat sink is determined by • the heat dissipation surface area,the material and • shape of the heat sink,and the airflow volume through • the heat sink. • ΘJ-A=(TJ-TA)/PCPU ℃/ W • ΘJ-A:CPU Junction to ambient thermal resistance • TJ :CPU Junction temperature (spec for Intel : 100 ℃) • TA:ambient temperature (OEM spec : 35 ℃) • PCPU:CPU power • in an integrity thermal design system • ΘJ-A= ΘJ-hp +Θhp-hs +Θhs-A 8

  9. Heat Pipe Material: 铜 Working fluid: 纯水 Standard working temperature: 0-100 ℃ Size :Φ3,Φ4,Φ5,Φ6,Φ8 Typical heat pipe wick structures:纤维 (fiber), 丝网(mesh),凹槽(groove) Fan 转速 噪音 (Fans are needed to move the air through the chassis,the airflow rate of a fan is usually directly related to the acoustic noise level of the fan and system.) Heat Pipe & Fan 9

  10. TIM(Thermal Interface Material) • Important of TIM • Material 油脂 (grease),蜡 (wax),thermal pads/taps,环氧树脂(epoxy) • Thermal resistance of these material 0.15~~0.3℃/ W 10

  11. Thermal Profile Test Introduction • Thermal Measurement Equipment • Thermal Profile Test Procedure 11

  12. Thermal Measurement Equipment • Thermocouple : OMEGA T-type , -270℃~~900℃,accuracy=+/-1.0 ℃ • Thermal Epoxy : OMEGABOND 101 • Thermocouples Connector : OMEGA T-type • Welder : TC 50W • Recorder : YOKOGAWA Hybrid Recorder DR230 • Kapton • Chamber : KSON Burn In Room P2000H+ 12

  13. Thermal Profile Test Procedure • 裁剪适当长度的热偶线,约2米 • 焊接热偶线量测端的两端点 • 在另一端接上转接头 • 选择量测点 • 固定热偶线 • 将转接头连接到recorder Continued 13

  14. Thermal Profile Test Procedure • 将待测机放入chamber中 • 运行测试软件 • 开启chamber,设置其目标温度为35℃,让其运行大约半小时待温度稳定后stop之,让待测机在无风环境下进行测试 • 开启recorder,并开始记录 • 3~4小时后,待温度曲线平稳再读取测试结果. 14

  15. Ambient temperature(Ta) Bottom base Beneath CPU Beneath charger Beneath LAN Beneath memory Beneath north bridge Battery top case & bottom LCD inverter Three spindles VGA BIOS Audio codec Palm Rest(left & right) PMU07 Adapter Floppy diskette PCMCIA ambient PCMCIA controller North bridge South bridge K/B controller Mini PCI CPU LVDS CLK generator SDRAM LAN …… Choose measuring point 15

  16. Summary • 随着NoteBook的处理器频率越来越高,体积越来越狭小,便要求其散热功效越来越高.所以就综合利用不同的散热原理, 运用不同的散热模式来达到散热目的 • 基于NoteBook可靠度考量,我们要知道其主要芯片和易接触部位的温度是否高出其spec.所以我们利用相关器具来测量这些芯片和部位的温度,并分析得出的结果,再对症下药,对不良设计加以改善. 16

  17. THE END Thank You! 17

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