1 / 33

Head Electronics BV

Head Electronics BV. Product Offerings. • Supplier Overview • Product Offerings. One Stop Shop. From idea to product. Product-redesign and – engineering. Purchasing of components. PCB work preparation and purchasing. SMT and THT (trough hole ) assembly.

clancy
Download Presentation

Head Electronics BV

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Head Electronics BV

  2. Product Offerings • SupplierOverview• Product Offerings

  3. One Stop Shop • From idea to product. • Product-redesign and – engineering. • Purchasing of components. • PCB work preparation and purchasing. • SMT and THT (trough hole) assembly. • Prototyping, pre-production, series production. • Housing and cabling assembly. • In-house testing of product and CE-EMC. • Deliveries on call (JIT) and as series. • Logistics, warehouse, outsourcing. • Service, upgrades and customer repairs. • • SupplierOverview• Product Offerings

  4. Locations, Geografic • • SupplierOverview• Locations, Geografic HEAD Electronics BV Ambachtsweg 172222 AH Katwijk zhTel: +31 (0)71 - 40 29 154Fax: +31 (0)71 - 40 30 091 Website: www.head.nlE-mail: info@head.nl

  5. Markets served • SupplierOverview• Markets Served - Products & Geographic

  6. Customer Service Capabilities Chooseyourownmenu… • Project definition. • Electronics design & development. • Project management / engineering support. • Electronics assembly. • Mechatronics, wiring, coating etc. • Testing, test engineering. • Logistics. • After sales. • Prototyping. • • SupplierOverview • Customer Service Capabilities • Menu

  7. Customer Service Capabilities • • SupplierOverview • Customer Service Capabilities • Menu explained • Project definition(product, specification, planning etc). • Electronics design & development(bycustomerand / orHEAD). • Project management / engineering support (workpreparation PCB & BOM, documenting, overall view, etc.) • PCB assembly (SMD, THT, manual soldering, etc.). • Mechatronics(total assemblies, wiring, coating etc.). • Testengineering (AOI, EMC, X-rayetc.). • Purchase & Logistics(forecast, purchasing, storage, consignment, etc.). • After sales (upgrades, changes, customer repairs, etc.). • Prototyping & pre-production(hand + machine & hand).

  8. Project Definition • • Manufacturing• Capabilities • Menu • Project Definition • Defining a project (enquiry, requirements, specs, etc.). • Calculation(BOM, labour, machine costs, etc.). • Specification(PCB, BOM, etc.). • Planning (lead times). • Purchase preparation(BOM + planning in MRP). • Terms & conditions(general, planning, warranty, payments, etc.). QUOTATION + ORDER + ORDER CONFORMATION.

  9. Project Definition - RFQ • Manufacturing• Capabilities • Menu • Project Definition • RFQ

  10. Electronics Development • • Manufacturing• Capabilities • Menu • Design & Development Fromideatofunctioning product (Balancingdevelopment vs. product costs) • Specification. • Hardware. • Embedded software. • Availability of components. • Costpricecomponents. • Productionfriendly. • Programming & testing. • CE, EMC pre-compliant. • Working prototype. • TPD - Technical Product Documentation.

  11. Project Management • • Manufacturing• Capabilities • Menu • Project Management Customer partnership • Operations management. • Project management. • Quality management. • Work preparation PCB/BOM/IT. • Documentation in AEGIS. • Logistics, purchase, storage. • Outsourcing. • Planning, controlling. • Cost control, invoicing.

  12. WorkPreparation PCB • • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation PCB Panelizing and specification before purchasing: • PCB data. • Multilayer PCB. • Panelizing with CAM350. • Design/edit with Pulsonics (tool). • Own internet tool for PCB specification. • Enquire PCB-quotations. • Prepare purchase of PCB’s.

  13. WorkPreparation BOM • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation BOM

  14. WorkPreparation Machines • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation Machines

  15. WorkPreparationDocumentation • • Manufacturing• Capabilities • Menu • Project Management • WorkPreparationDocumentation (MOS) Documentation in AEGIS MOS = Manufacturing Operations Software

  16. Floor Documentation • • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation • Floor Documentation Shop Floor paperless by AEGIS

  17. Electronics AssemblySurfaceMountedDevices • • Manufacturing• Capabilities • Menu • Electronics Assembly • SMD Fast, flexibleand accurate • Samsung CP 411-421 series SMD. • Placing SMD-components to 0402 • Finepitch QFP 0,4 mm • Finepitch (µ)BGA • Preparedfor intelligent feeders • Up to 60k components / hour • SoltecMy Reflow 10 zone Reflow Oven. • DEK Horizon 2 screenprinter.

  18. Electronics AssemblySurfaceMountedDevices • Manufacturing • Capabilities • Menu • Electronics Assembly • SMD Close up

  19. Electronics AssemblySurfaceMountedDevices • Manufacturing • Capabilities • Menu • Electronics Assembly • SMD Barcode

  20. Electronics AssemblySurfaceMountedDevices C1608-560pF C1608560PF9907141301 C1608-560pF C1608560PF9907141301 • Manufacturing • Capabilities • Menu • Electronics Assembly • SMD network DATABASE SERVER ETHERNET (TCP/IP) PART-STATION MACHINE FEEDER-STATION DeviceNet SM FEEDER BARCODE PRINTER REEL BARCODE READER REEL BARCODE READER Feeder ID Reading Feeder Event (insert, remove, …) DOCKING-CART

  21. Electronics AssemblyConventional Components • • Manufacturing • Capabilities • Menu • Electronics Assembly • Conventional • Component preparation as cut, bend etc. • Placing of all remaining components. • Soldering of the leaded components. • Final assembly, built in housings. • Programming and loading of software. • Routine testing. • Labeling, PCB serial number/barcode. • Packing.

  22. Electronics AssemblyConventional Components • Manufacturing • Capabilities • Menu • Electronics Assembly • Conventional • Close up

  23. Electronics AssemblyWave Soldering • • Manufacturing • Capabilities • Menu • Electronics Assembly • Conventional • Wave Soldering • Wave soldering N2 with the Soltec “Deltawave” (leaded). • In-line wave soldering N2 met EPM IBL (RoHS).

  24. Electronics AssemblySelective Soldering • Selective soldering N2 with the Soltec My Selective 6745 (RoHS). • • Manufacturing • Capabilities • Menu • Electronics Assembly • Conventional • Selective Soldering

  25. Electronics AssemblyMechatronics / Total Assembly • PCB cleaning. • PCB coating. • PCB potting. • Cabling in house or outsourced. • Total assemblies, housing, 19” racks etc. • Burn-in test. • • Manufacturing • Capabilities • Menu • Electronics Assembly • Mechatronics

  26. Electronics AssemblyCleaning & Coating • Manufacturing • Capabilities • Menu • Electronics Assembly • Mechatronics • Cleaning & Coating

  27. Test, Test Engineering • • Manufacturing • Capabilities • Menu • Test, Test Engineering • PCB: Visual, probe tester, sleeves /microscope. • SMD: AOI (Viscom), X-ray (Dage 2 M pixel). • CE- precompliantEMC. • Product: Visual, Functional, In-circuit, self-test, climate-test. • Realisationof project test tools withcustomers.

  28. Logistics - Storage • • Manufacturing • Capabilities • Menu • LogisticsStorage • Year order, rolling forecast, MRP. • Purchasing and incoming goods. • Identification / inspection (ATEX !*) / part storage / labeling. • Packing following instructions, ESD measures. • Storage intermediate and end products, consignation.

  29. Logistics - Transportation • • Manufacturing • Capabilities • Menu • LogisticsTransportation • Just in time, track and trace. • Destinations to customer and end customer. • Transportation boxes with UPS in NL, UK (Europe). • Pallet Benelux with Wesseling Transport Sassenheim. • Worldwide via expedition centres, airport etc.

  30. After Sales Service • • Manufacturing • Capabilities • Menu • After Sales Service • After sales service, upgrades, customer repair. • For hard- and software. • During the lifecycle of your product. • Redesign and use of other/newer parts. • Spare parts, obsolete part replacements.

  31. Quality Management • • Manufacturing • Quality Management • ISO 9001: 2008 accredited management system Scope Head Electronics BV: “Design and manufacturing of printed circuit boards and assemblies, Incl. SMD production. Design and manufacturing of electronic end products”. • Quality manual: • MSH Head electronics. • Accreditation + verification & support: • LRQA + BSH & IMC, NEVAT (consultancy).

  32. Your contact persons • • CompetitiveAdvantage of HEAD • Contact persons Managing Director: Arie van Leeuwen Marketing & Sales: Eric Verkerke Operations & Finances: Arjan van der Ploeg Production: Wim de Boer Head Electronics BVAmbachtsweg 172222 AH Katwijk ZHtel: +31 (71) 4029154fax: +31 (71) 4030091e-mail: info@head.nl Internet: www.head.nl

  33. Next steps ……. • CompetitiveAdvantage of HEAD • Next Steps …… MovingaHEADforyou!

More Related