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Semiconductor Package Synthetic Models Provide:. Insight into the thermal performance of various package designs and improvements. “Why isn’t the performance of this new package much better than that of the old design?”
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Semiconductor Package Synthetic Models Provide: • Insight into the thermal performance of various package designs and improvements “Why isn’t the performance of this new package much better than that of the old design?” “Why has the change in die size had such a large effect on package ‘A’ and so little effect on package ‘B’?” Analysis of Thermal Transient Data www.analysistech.com
Semiconductor Package Synthetic Models Provide: • The basis for intelligent selection of alternate package thermal enhancement approaches “Would a heat spreader or heat sink provide greater package enhancement?” “Would a different die attachment provide significant enhancement?” Analysis of Thermal Transient Data www.analysistech.com
Semiconductor Package Synthetic Models Provide: • The basis for estimation of probable results for proposed enhanced package-designs “What is the greatest improvement in thermal performance that can be expected from this new package enhancement?” Analysis of Thermal Transient Data www.analysistech.com
Semiconductor Package Synthetic Models Provide: • Direct simulation of the thermal behavior of devices to non-steady or cyclic powering conditions “What is the thermal impedance of this device for a 50 hertz power waveform?” “What is the peak junction temperature expected during the high-power start-up and initializing cycle?” Analysis of Thermal Transient Data www.analysistech.com
Mock Empirical Data from Hypothetical Mechanical System Analysis of Thermal Transient Data www.analysistech.com
Selected Candidate Model for Mechanical System Example Optimal Assignments Based on Response Data: • MASS: 0.03 grams • SPRING: 10 dynes/cm • DAMPER: 0.02 dynes/cm/sec Analysis of Thermal Transient Data www.analysistech.com
Junction Temperature Step-ResponsePlotted Using Linear-Time Axis Analysis of Thermal Transient Data www.analysistech.com
Junction Temperature Step-ResponsePlotted Using Log-Time Axis Analysis of Thermal Transient Data www.analysistech.com
Candidate Thermal Model forSemiconductor Packages, Third Order Analysis of Thermal Transient Data www.analysistech.com
Model Step-Response Expressed asImpedance Versus Log-Time Analysis of Thermal Transient Data www.analysistech.com
Test Response of Plastic 24 Lead DIPwith Overlaid Synthesized Model Analysis of Thermal Transient Data www.analysistech.com
Test Response of Ceramic 24 LeadDIP with Overlaid Synthesized Model Analysis of Thermal Transient Data www.analysistech.com
Comparison of Plastic Packagevs. Ceramic Package Analysis of Thermal Transient Data www.analysistech.com
Assumed Segmentation Boundaries Analysis of Thermal Transient Data www.analysistech.com
Heat Capacity ComparisonEstimated Heat Capacities Relative to Synthetic Model Values Analysis of Thermal Transient Data www.analysistech.com
Test Response of 208 Lead Copper-SlugPackage with Overlaid Model(good die attachment, second order model) Analysis of Thermal Transient Data www.analysistech.com
Conditions Indicative of Model Degeneration: • The multiple between two time constants is less than 3 - 4 • One constituent resistance or heat capacitance is insignificantly small • One time constant is larger than the duration spanned by the test data Solutions for Model Degeneration • Reduce the order of the candidate model (number of RC pairs) • Expand the test duration Analysis of Thermal Transient Data www.analysistech.com
Test Response of 208 Lead Copper-SlugPackage with Overlaid Model(failed die attachment, third order model) Analysis of Thermal Transient Data www.analysistech.com
Test Response of 208 Lead Copper-SlugPackage with Overlaid Model(failed die attachment, second order model) Analysis of Thermal Transient Data www.analysistech.com
Comparison of Failed Die Attachto Good Die Attach Analysis of Thermal Transient Data www.analysistech.com
TO-247 Test Response, Junction-to-Case,Thermocouple Under Tab Analysis of Thermal Transient Data www.analysistech.com
Junction-to-Case Candidate Model Analysis of Thermal Transient Data www.analysistech.com
Model Response of Junction & ThermocoupleNodes, Junction-to-Case Model Analysis of Thermal Transient Data www.analysistech.com
TO-247 Test Response, Junction-to-Case,With Overlaid Synthetic Model(thermocouple on center lead) Analysis of Thermal Transient Data www.analysistech.com
Junction-to-Case Synthetic ModelOverlaid on TO-247 Test Response Data(thermocouple under tab) Analysis of Thermal Transient Data www.analysistech.com
TO-247 Test Response with Alternate Synthetic Model which Excludes the Bump Anomaly Analysis of Thermal Transient Data www.analysistech.com
Model Response for Square Waves of Various Periods and Duty Cycles Analysis of Thermal Transient Data www.analysistech.com
Test Response of Device #1 with Overlaid Model(3 Time Constants, Linear-Log Plot) Analysis of Thermal Transient Data www.analysistech.com
Test Response of Device #1 with Overlaid Model (3 Time Constants, Log-Log Plot) Analysis of Thermal Transient Data www.analysistech.com
Test Response of Device #1 with Overlaid Model(4 Time Constants, Linear-Log Plot) Analysis of Thermal Transient Data www.analysistech.com
Test Response of Device #1 with Overlaid Model (4 Time Constants, Log-Log Plot) Analysis of Thermal Transient Data www.analysistech.com
Test Response of Device #2 with Overlaid Model (3 Time Constants, Linear-Log Plot) Analysis of Thermal Transient Data www.analysistech.com
Test Response of Device #2 with Overlaid Model (4 Time Constants, Linear-Log Plot) Analysis of Thermal Transient Data www.analysistech.com
Test Response of Device #2 with Overlaid Model (4 Time Constants, Log-Log Plot) Analysis of Thermal Transient Data www.analysistech.com