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Semiconductor Package Synthetic Models Provide:

Explore synthetic models to analyze thermal behavior, optimize package design, and simulate thermal responses of various devices using non-steady power conditions. Gain insights into improving package designs and selecting the best thermal enhancement strategies. Find solutions for model degeneration and compare different die attachment methods for better thermal performance.

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Semiconductor Package Synthetic Models Provide:

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  1. Semiconductor Package Synthetic Models Provide: • Insight into the thermal performance of various package designs and improvements “Why isn’t the performance of this new package much better than that of the old design?” “Why has the change in die size had such a large effect on package ‘A’ and so little effect on package ‘B’?” Analysis of Thermal Transient Data www.analysistech.com

  2. Semiconductor Package Synthetic Models Provide: • The basis for intelligent selection of alternate package thermal enhancement approaches “Would a heat spreader or heat sink provide greater package enhancement?” “Would a different die attachment provide significant enhancement?” Analysis of Thermal Transient Data www.analysistech.com

  3. Semiconductor Package Synthetic Models Provide: • The basis for estimation of probable results for proposed enhanced package-designs “What is the greatest improvement in thermal performance that can be expected from this new package enhancement?” Analysis of Thermal Transient Data www.analysistech.com

  4. Semiconductor Package Synthetic Models Provide: • Direct simulation of the thermal behavior of devices to non-steady or cyclic powering conditions “What is the thermal impedance of this device for a 50 hertz power waveform?” “What is the peak junction temperature expected during the high-power start-up and initializing cycle?” Analysis of Thermal Transient Data www.analysistech.com

  5. Mock Empirical Data from Hypothetical Mechanical System Analysis of Thermal Transient Data www.analysistech.com

  6. Selected Candidate Model for Mechanical System Example Optimal Assignments Based on Response Data: • MASS: 0.03 grams • SPRING: 10 dynes/cm • DAMPER: 0.02 dynes/cm/sec Analysis of Thermal Transient Data www.analysistech.com

  7. Junction Temperature Step-ResponsePlotted Using Linear-Time Axis Analysis of Thermal Transient Data www.analysistech.com

  8. Junction Temperature Step-ResponsePlotted Using Log-Time Axis Analysis of Thermal Transient Data www.analysistech.com

  9. Candidate Thermal Model forSemiconductor Packages, Third Order Analysis of Thermal Transient Data www.analysistech.com

  10. Model Step-Response Expressed asImpedance Versus Log-Time Analysis of Thermal Transient Data www.analysistech.com

  11. Test Response of Plastic 24 Lead DIPwith Overlaid Synthesized Model Analysis of Thermal Transient Data www.analysistech.com

  12. Test Response of Ceramic 24 LeadDIP with Overlaid Synthesized Model Analysis of Thermal Transient Data www.analysistech.com

  13. Comparison of Plastic Packagevs. Ceramic Package Analysis of Thermal Transient Data www.analysistech.com

  14. Assumed Segmentation Boundaries Analysis of Thermal Transient Data www.analysistech.com

  15. Heat Capacity ComparisonEstimated Heat Capacities Relative to Synthetic Model Values Analysis of Thermal Transient Data www.analysistech.com

  16. Test Response of 208 Lead Copper-SlugPackage with Overlaid Model(good die attachment, second order model) Analysis of Thermal Transient Data www.analysistech.com

  17. Conditions Indicative of Model Degeneration: • The multiple between two time constants is less than 3 - 4 • One constituent resistance or heat capacitance is insignificantly small • One time constant is larger than the duration spanned by the test data Solutions for Model Degeneration • Reduce the order of the candidate model (number of RC pairs) • Expand the test duration Analysis of Thermal Transient Data www.analysistech.com

  18. Test Response of 208 Lead Copper-SlugPackage with Overlaid Model(failed die attachment, third order model) Analysis of Thermal Transient Data www.analysistech.com

  19. Test Response of 208 Lead Copper-SlugPackage with Overlaid Model(failed die attachment, second order model) Analysis of Thermal Transient Data www.analysistech.com

  20. Comparison of Failed Die Attachto Good Die Attach Analysis of Thermal Transient Data www.analysistech.com

  21. TO-247 Test Response, Junction-to-Case,Thermocouple Under Tab Analysis of Thermal Transient Data www.analysistech.com

  22. Junction-to-Case Candidate Model Analysis of Thermal Transient Data www.analysistech.com

  23. Model Response of Junction & ThermocoupleNodes, Junction-to-Case Model Analysis of Thermal Transient Data www.analysistech.com

  24. TO-247 Test Response, Junction-to-Case,With Overlaid Synthetic Model(thermocouple on center lead) Analysis of Thermal Transient Data www.analysistech.com

  25. Junction-to-Case Synthetic ModelOverlaid on TO-247 Test Response Data(thermocouple under tab) Analysis of Thermal Transient Data www.analysistech.com

  26. TO-247 Test Response with Alternate Synthetic Model which Excludes the Bump Anomaly Analysis of Thermal Transient Data www.analysistech.com

  27. Model Response for Square Waves of Various Periods and Duty Cycles Analysis of Thermal Transient Data www.analysistech.com

  28. Test Response of Device #1 with Overlaid Model(3 Time Constants, Linear-Log Plot) Analysis of Thermal Transient Data www.analysistech.com

  29. Test Response of Device #1 with Overlaid Model (3 Time Constants, Log-Log Plot) Analysis of Thermal Transient Data www.analysistech.com

  30. Test Response of Device #1 with Overlaid Model(4 Time Constants, Linear-Log Plot) Analysis of Thermal Transient Data www.analysistech.com

  31. Test Response of Device #1 with Overlaid Model (4 Time Constants, Log-Log Plot) Analysis of Thermal Transient Data www.analysistech.com

  32. Test Response of Device #2 with Overlaid Model (3 Time Constants, Linear-Log Plot) Analysis of Thermal Transient Data www.analysistech.com

  33. Test Response of Device #2 with Overlaid Model (4 Time Constants, Linear-Log Plot) Analysis of Thermal Transient Data www.analysistech.com

  34. Test Response of Device #2 with Overlaid Model (4 Time Constants, Log-Log Plot) Analysis of Thermal Transient Data www.analysistech.com

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